ATE376050T1 - Halbleiterreinigungslösung - Google Patents

Halbleiterreinigungslösung

Info

Publication number
ATE376050T1
ATE376050T1 AT04737678T AT04737678T ATE376050T1 AT E376050 T1 ATE376050 T1 AT E376050T1 AT 04737678 T AT04737678 T AT 04737678T AT 04737678 T AT04737678 T AT 04737678T AT E376050 T1 ATE376050 T1 AT E376050T1
Authority
AT
Austria
Prior art keywords
compound
cleaning solution
equal
present
chemical formula
Prior art date
Application number
AT04737678T
Other languages
English (en)
Inventor
Rita Vos
Paul Mertens
Bernd Kolbesen
Albrecht Fester
Oliver Doll
Original Assignee
Imec Inter Uni Micro Electr
Air Prod & Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imec Inter Uni Micro Electr, Air Prod & Chem filed Critical Imec Inter Uni Micro Electr
Application granted granted Critical
Publication of ATE376050T1 publication Critical patent/ATE376050T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/39—Organic or inorganic per-compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/39—Organic or inorganic per-compounds
    • C11D3/3947—Liquid compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3281—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/34—Organic compounds containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AT04737678T 2003-06-27 2004-06-26 Halbleiterreinigungslösung ATE376050T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US48314703P 2003-06-27 2003-06-27

Publications (1)

Publication Number Publication Date
ATE376050T1 true ATE376050T1 (de) 2007-11-15

Family

ID=33552033

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04737678T ATE376050T1 (de) 2003-06-27 2004-06-26 Halbleiterreinigungslösung

Country Status (5)

Country Link
US (1) US7521408B2 (de)
EP (1) EP1648991B1 (de)
AT (1) ATE376050T1 (de)
DE (1) DE602004009584T2 (de)
WO (1) WO2005001016A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1648991B1 (de) * 2003-06-27 2007-10-17 Interuniversitair Microelektronica Centrum ( Imec) Halbleiterreinigungslösung
US7700533B2 (en) 2005-06-23 2010-04-20 Air Products And Chemicals, Inc. Composition for removal of residue comprising cationic salts and methods using same
GB0520380D0 (en) 2005-10-07 2005-11-16 Unilever Plc Stain removal
ATE469199T1 (de) * 2006-10-31 2010-06-15 Soitec Silicon On Insulator Verfahren zur charakterisierung von defekten auf silizium-oberflächen, ätzlösung für silizium- oberflächen und verfahren zur behandlung von silizium-oberflächen mit der ätzlösung
WO2008061258A2 (en) * 2006-11-17 2008-05-22 Sachem, Inc. Selective metal wet etch composition and process
CN101270325A (zh) * 2007-03-23 2008-09-24 安集微电子（上海）有限公司 一种清洗液及其应用
JP2009099945A (ja) * 2007-09-28 2009-05-07 Fujifilm Corp 半導体デバイス用洗浄剤及びそれを用いた洗浄方法
CN101855334B (zh) * 2007-11-13 2013-03-27 沙琛公司 高负电动势多面体倍半硅氧烷组合物及无损坏半导体湿式清洁方法
TWI426125B (zh) * 2007-11-20 2014-02-11 Anji Microelectronics Co Ltd 清洗液及其應用
JP5278492B2 (ja) * 2010-06-16 2013-09-04 株式会社デンソー 半導体装置の製造方法
CN102064090B (zh) * 2010-10-15 2013-01-09 北京通美晶体技术有限公司 化合物半导体晶片清洗方法
US20120295447A1 (en) * 2010-11-24 2012-11-22 Air Products And Chemicals, Inc. Compositions and Methods for Texturing of Silicon Wafers
JP6445982B2 (ja) 2012-12-31 2018-12-26 ボルケーノ コーポレイション 管の評価のための装置、システム、及び方法
US10780461B2 (en) * 2015-05-15 2020-09-22 Taiwan Semiconductor Manufacturing Co., Ltd Methods for processing substrate in semiconductor fabrication

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2842862A1 (de) * 1978-10-02 1980-04-10 Boehringer Mannheim Gmbh Verfahren zur bestimmung von ionen, polaren und/oder lipophilen substanzen in fluessigkeiten
US5686410A (en) * 1989-07-20 1997-11-11 Novartis Ag Polypeptide derivatives
CA2059841A1 (en) * 1991-01-24 1992-07-25 Ichiro Hayashida Surface treating solutions and cleaning method
JP3075290B2 (ja) * 1991-02-28 2000-08-14 三菱瓦斯化学株式会社 半導体基板の洗浄液
DE4136590A1 (de) * 1991-11-07 1993-05-13 Bosch Gmbh Robert Pumpe
US5421897A (en) * 1992-07-17 1995-06-06 Grawe; John Abatement process for contaminants
TW274630B (de) * 1994-01-28 1996-04-21 Wako Zunyaku Kogyo Kk
US5466389A (en) * 1994-04-20 1995-11-14 J. T. Baker Inc. PH adjusted nonionic surfactant-containing alkaline cleaner composition for cleaning microelectronics substrates
US5498293A (en) * 1994-06-23 1996-03-12 Mallinckrodt Baker, Inc. Cleaning wafer substrates of metal contamination while maintaining wafer smoothness
DE69636618T2 (de) * 1995-07-27 2007-08-30 Mitsubishi Chemical Corp. Verfahren zur behandlung einer substratoberfläche und behandlungsmittel hierfür
US5989353A (en) * 1996-10-11 1999-11-23 Mallinckrodt Baker, Inc. Cleaning wafer substrates of metal contamination while maintaining wafer smoothness
US6066609A (en) * 1997-07-31 2000-05-23 Siemens Aktiengesellschaft Aqueous solution for cleaning a semiconductor substrate
US6599370B2 (en) * 2000-10-16 2003-07-29 Mallinckrodt Inc. Stabilized alkaline compositions for cleaning microelectronic substrates
TW583310B (en) * 2000-12-22 2004-04-11 Ashland Inc Composition comprising an oxidizing and complexing compound
EP1224972A1 (de) * 2001-01-18 2002-07-24 Shipley Co. L.L.C. Verfahren zur Rückgewinnung von Katalysatormetallen aus kolloidaler Lösung
GB0116212D0 (en) * 2001-07-03 2001-08-29 Avecia Ltd Process
KR100546169B1 (ko) * 2001-09-21 2006-01-24 주식회사 하이닉스반도체 포토레지스트 제거용 용액 조성물
AU2003276094A1 (en) * 2002-11-05 2004-06-07 Merck Patent Gmbh Semiconductor surface treatment and mixture used therein
EP1648991B1 (de) * 2003-06-27 2007-10-17 Interuniversitair Microelektronica Centrum ( Imec) Halbleiterreinigungslösung
JP4620680B2 (ja) * 2003-10-29 2011-01-26 マリンクロッド・ベイカー・インコーポレイテッド ハロゲン化金属の腐食阻害剤を含有するアルカリ性のプラズマエッチング／灰化後の残渣の除去剤およびフォトレジスト剥離組成物
US7432233B2 (en) * 2003-12-18 2008-10-07 Interuniversitair Microelektronica Centrum (Imec) Composition and method for treating a semiconductor substrate
WO2005107723A2 (en) * 2004-05-06 2005-11-17 Rashid Buttar Transdermal delivery systems and transdermal chelation preparations

Also Published As

Publication number Publication date
DE602004009584D1 (de) 2007-11-29
WO2005001016A1 (en) 2005-01-06
US7521408B2 (en) 2009-04-21
EP1648991A1 (de) 2006-04-26
DE602004009584T2 (de) 2008-08-07
US20060089280A1 (en) 2006-04-27
EP1648991B1 (de) 2007-10-17

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Legal Events

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