ATE399806T1 - Einkomponentige thermoset epoxidharzzusammensetzung und unterfüllungsmaterial für halbleitermontage - Google Patents

Einkomponentige thermoset epoxidharzzusammensetzung und unterfüllungsmaterial für halbleitermontage

Info

Publication number
ATE399806T1
ATE399806T1 AT06090201T AT06090201T ATE399806T1 AT E399806 T1 ATE399806 T1 AT E399806T1 AT 06090201 T AT06090201 T AT 06090201T AT 06090201 T AT06090201 T AT 06090201T AT E399806 T1 ATE399806 T1 AT E399806T1
Authority
AT
Austria
Prior art keywords
epoxy resin
resin composition
backing material
semiconductor assembly
type epoxy
Prior art date
Application number
AT06090201T
Other languages
English (en)
Inventor
Johshi Gotoh
Tatsuya Okuno
Original Assignee
Sunstar Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sunstar Engineering Inc filed Critical Sunstar Engineering Inc
Application granted granted Critical
Publication of ATE399806T1 publication Critical patent/ATE399806T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AT06090201T 2001-03-30 2002-03-29 Einkomponentige thermoset epoxidharzzusammensetzung und unterfüllungsmaterial für halbleitermontage ATE399806T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001099479A JP5280597B2 (ja) 2001-03-30 2001-03-30 一液加熱硬化型エポキシ樹脂組成物および半導体実装用アンダーフィル材

Publications (1)

Publication Number Publication Date
ATE399806T1 true ATE399806T1 (de) 2008-07-15

Family

ID=18953017

Family Applications (2)

Application Number Title Priority Date Filing Date
AT06090201T ATE399806T1 (de) 2001-03-30 2002-03-29 Einkomponentige thermoset epoxidharzzusammensetzung und unterfüllungsmaterial für halbleitermontage
AT02708720T ATE349475T1 (de) 2001-03-30 2002-03-29 Einkomponentige heisshärtende epoxidharzzusammensetzung und halbleitermontage- unterfüllungsmaterial

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT02708720T ATE349475T1 (de) 2001-03-30 2002-03-29 Einkomponentige heisshärtende epoxidharzzusammensetzung und halbleitermontage- unterfüllungsmaterial

Country Status (6)

Country Link
US (1) US7449362B2 (de)
EP (2) EP1384738B1 (de)
JP (1) JP5280597B2 (de)
AT (2) ATE399806T1 (de)
DE (2) DE60217095T2 (de)
WO (1) WO2002079294A1 (de)

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US20130101863A1 (en) * 2010-04-21 2013-04-25 Mitsubishi Gas Chemical Company, Inc. Heat curable composition
KR101319493B1 (ko) * 2010-12-30 2013-10-22 주식회사 삼양사 감광성 수지 조성물 및 이로부터 제조되는 절연막
JP5467469B2 (ja) 2011-01-04 2014-04-09 山栄化学株式会社 プリント配線基板に表面実装する方法
JP5739372B2 (ja) * 2012-04-25 2015-06-24 信越化学工業株式会社 接着剤組成物、並びにこれを用いた接着シート、半導体装置保護用材料、及び半導体装置
CN108587385A (zh) * 2018-05-30 2018-09-28 安徽润晟建设有限公司 一种耐冲击防水环氧涂料
CN110649241B (zh) * 2019-09-27 2021-01-26 东北大学 硅基Si-B-C负极材料及其电化学合成方法和应用
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Also Published As

Publication number Publication date
JP5280597B2 (ja) 2013-09-04
US20040209403A1 (en) 2004-10-21
EP1754735A1 (de) 2007-02-21
EP1384738B1 (de) 2006-12-27
EP1384738A1 (de) 2004-01-28
EP1754735B1 (de) 2008-07-02
DE60227433D1 (de) 2008-08-14
DE60217095D1 (de) 2007-02-08
ATE349475T1 (de) 2007-01-15
EP1384738A4 (de) 2005-08-10
US7449362B2 (en) 2008-11-11
WO2002079294A1 (fr) 2002-10-10
DE60217095T2 (de) 2007-10-31
JP2002293883A (ja) 2002-10-09

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