ATE403971T1 - Tiefpassfilter und elektronisches bauelement - Google Patents

Tiefpassfilter und elektronisches bauelement

Info

Publication number
ATE403971T1
ATE403971T1 AT04734878T AT04734878T ATE403971T1 AT E403971 T1 ATE403971 T1 AT E403971T1 AT 04734878 T AT04734878 T AT 04734878T AT 04734878 T AT04734878 T AT 04734878T AT E403971 T1 ATE403971 T1 AT E403971T1
Authority
AT
Austria
Prior art keywords
pass filter
low
electronic component
low pass
capacitor
Prior art date
Application number
AT04734878T
Other languages
English (en)
Inventor
Adrianus Smolders
Nicolas Pulsford
Adrianus Buijsman
Philippe Pascal
Fattah Haddad
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE403971T1 publication Critical patent/ATE403971T1/de

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/06—Frequency selective two-port networks including resistors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/12—Bandpass or bandstop filters with adjustable bandwidth and fixed centre frequency
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L7/00—Automatic control of frequency or phase; Synchronisation
    • H03L7/06—Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop
    • H03L7/08—Details of the phase-locked loop
    • H03L7/085—Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal
    • H03L7/093—Details of the phase-locked loop concerning mainly the frequency- or phase-detection arrangement including the filtering or amplification of its output signal using special filtering or amplification characteristics in the loop
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Filters And Equalizers (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)
  • Transceivers (AREA)
  • Networks Using Active Elements (AREA)
AT04734878T 2003-06-03 2004-05-26 Tiefpassfilter und elektronisches bauelement ATE403971T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP03076725 2003-06-03

Publications (1)

Publication Number Publication Date
ATE403971T1 true ATE403971T1 (de) 2008-08-15

Family

ID=33483967

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04734878T ATE403971T1 (de) 2003-06-03 2004-05-26 Tiefpassfilter und elektronisches bauelement

Country Status (8)

Country Link
US (1) US7388439B2 (de)
EP (1) EP1634371B1 (de)
JP (1) JP4704329B2 (de)
KR (1) KR101145569B1 (de)
CN (1) CN1799195B (de)
AT (1) ATE403971T1 (de)
DE (1) DE602004015596D1 (de)
WO (1) WO2004107568A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100735455B1 (ko) 2005-11-22 2007-07-04 삼성전기주식회사 주파수 드리프트 개선기능을 갖는 위상 동기 제어기
KR101315858B1 (ko) 2007-01-29 2013-10-08 엘지이노텍 주식회사 위성방송수신기의 주파수 드래프트 보상 장치
JP2009055116A (ja) * 2007-08-23 2009-03-12 Sanyo Electric Co Ltd ローパスフィルタ及びオーディオアンプ
WO2009104251A1 (ja) * 2008-02-20 2009-08-27 富士通株式会社 フィルタ、分波器、通信モジュール、および通信装置
US8143659B2 (en) * 2008-04-14 2012-03-27 Infineon Technologies Ag Vertical trench capacitor, chip comprising the capacitor, and method for producing the capacitor
US8178962B1 (en) 2009-04-21 2012-05-15 Xilinx, Inc. Semiconductor device package and methods of manufacturing the same
US8963671B2 (en) 2012-08-31 2015-02-24 Advanced Semiconductor Engineering, Inc. Semiconductor transformer device and method for manufacturing the same
FR3038105B1 (fr) * 2015-06-29 2017-08-04 Oberthur Technologies Module equipe d'un condensateur et d'une antenne, avec disposition d'electrode de condensateur amelioree
EP3680934A1 (de) * 2019-01-08 2020-07-15 Murata Manufacturing Co., Ltd. Rc-architekturen und verfahren zur herstellung davon

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6343356A (ja) * 1986-08-08 1988-02-24 Fujitsu Ltd 半導体記憶装置およびその製造方法
JPH06103741B2 (ja) * 1988-06-30 1994-12-14 日本電気株式会社 半導体記憶装置
JPH02214213A (ja) * 1989-02-15 1990-08-27 Hitachi Ltd 自走発振周波数調整不要ｈｄｄ用データセパレータ
JP3129750B2 (ja) * 1990-09-27 2001-01-31 株式会社東芝 半導体記憶装置及びその製造方法
JPH07336141A (ja) * 1994-06-03 1995-12-22 Matsushita Electric Ind Co Ltd 発振器
JPH08163113A (ja) * 1994-12-01 1996-06-21 Fujitsu Ltd 誤差検出回路並びにこれを用いたクロック再生回路及び遅延ロック回路
JPH08274581A (ja) * 1995-03-30 1996-10-18 Matsushita Electric Ind Co Ltd アナログフィルター
KR100190002B1 (ko) 1995-12-29 1999-06-01 윤종용 저항과 캐패시터를 함께 구비하는 반도체 소자 및 그제조방법
TW388877B (en) * 1997-04-23 2000-05-01 Toshiba Corp Semiconductor device and its manufacturing process
KR100290784B1 (ko) * 1998-09-15 2001-07-12 박종섭 스택 패키지 및 그 제조방법
US6157271A (en) * 1998-11-23 2000-12-05 Motorola, Inc. Rapid tuning, low distortion digital direct modulation phase locked loop and method therefor
KR100877253B1 (ko) * 1999-08-02 2009-01-07 콸콤 인코포레이티드 잡음 면역성을 가진 다중 대역 전압제어 발진기를 위한방법 및 장치
US6700203B1 (en) * 2000-10-11 2004-03-02 International Business Machines Corporation Semiconductor structure having in-situ formed unit resistors
JP3839323B2 (ja) * 2001-04-06 2006-11-01 株式会社ルネサステクノロジ 半導体装置の製造方法
KR100441993B1 (ko) * 2001-11-02 2004-07-30 한국전자통신연구원 고주파 저역 통과 필터
GB0127537D0 (en) * 2001-11-16 2002-01-09 Hitachi Ltd A communication semiconductor integrated circuit device and a wireless communication system
US6984860B2 (en) * 2002-11-27 2006-01-10 Semiconductor Components Industries, L.L.C. Semiconductor device with high frequency parallel plate trench capacitor structure

Also Published As

Publication number Publication date
CN1799195A (zh) 2006-07-05
DE602004015596D1 (de) 2008-09-18
CN1799195B (zh) 2010-06-02
JP4704329B2 (ja) 2011-06-15
US20070018748A1 (en) 2007-01-25
JP2006526928A (ja) 2006-11-24
EP1634371B1 (de) 2008-08-06
KR101145569B1 (ko) 2012-05-15
KR20060017836A (ko) 2006-02-27
WO2004107568A1 (en) 2004-12-09
EP1634371A1 (de) 2006-03-15
US7388439B2 (en) 2008-06-17

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Legal Events

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