ATE414189T1 - Verfahren zur herstellung von selbsttragenden substraten, die iii-nitride umfassen, mittels heteroepitaxie auf einer opferschicht - Google Patents
Verfahren zur herstellung von selbsttragenden substraten, die iii-nitride umfassen, mittels heteroepitaxie auf einer opferschichtInfo
- Publication number
- ATE414189T1 ATE414189T1 AT04787441T AT04787441T ATE414189T1 AT E414189 T1 ATE414189 T1 AT E414189T1 AT 04787441 T AT04787441 T AT 04787441T AT 04787441 T AT04787441 T AT 04787441T AT E414189 T1 ATE414189 T1 AT E414189T1
- Authority
- AT
- Austria
- Prior art keywords
- iii
- nitrides
- self
- sacrificial layer
- nitride
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
- C30B25/183—Epitaxial-layer growth characterised by the substrate being provided with a buffer layer, e.g. a lattice matching layer
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2902—Materials being Group IVA materials
- H10P14/2904—Silicon carbide
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2921—Materials being crystalline insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
- H10P14/3202—Materials thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
- H10P14/3202—Materials thereof
- H10P14/3204—Materials thereof being Group IVA semiconducting materials
- H10P14/3211—Silicon, silicon germanium or germanium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
- H10P14/3242—Structure
- H10P14/3244—Layer structure
- H10P14/3248—Layer structure consisting of two layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
- H10P14/3242—Structure
- H10P14/3256—Microstructure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
- H10P14/3416—Nitrides
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0311296A FR2860248B1 (fr) | 2003-09-26 | 2003-09-26 | Procede de realisation de substrats autosupportes de nitrures d'elements iii par hetero-epitaxie sur une couche sacrificielle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE414189T1 true ATE414189T1 (de) | 2008-11-15 |
Family
ID=34307188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT04787441T ATE414189T1 (de) | 2003-09-26 | 2004-09-24 | Verfahren zur herstellung von selbsttragenden substraten, die iii-nitride umfassen, mittels heteroepitaxie auf einer opferschicht |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US7282381B2 (de) |
| EP (1) | EP1699951B1 (de) |
| JP (1) | JP4783288B2 (de) |
| KR (1) | KR101154747B1 (de) |
| CN (1) | CN100387760C (de) |
| AT (1) | ATE414189T1 (de) |
| AU (1) | AU2004276541B2 (de) |
| CA (1) | CA2540245C (de) |
| DE (1) | DE602004017781D1 (de) |
| FR (1) | FR2860248B1 (de) |
| WO (1) | WO2005031045A2 (de) |
Families Citing this family (68)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7018909B2 (en) * | 2003-02-28 | 2006-03-28 | S.O.I.Tec Silicon On Insulator Technologies S.A. | Forming structures that include a relaxed or pseudo-relaxed layer on a substrate |
| US7348076B2 (en) | 2004-04-08 | 2008-03-25 | Saint-Gobain Ceramics & Plastics, Inc. | Single crystals and methods for fabricating same |
| JP2007134388A (ja) * | 2005-11-08 | 2007-05-31 | Sharp Corp | 窒化物系半導体素子とその製造方法 |
| EP1960571A2 (de) * | 2005-11-17 | 2008-08-27 | Mosaic Crystals Ltd. | Gan-kristallplatte |
| US7777217B2 (en) | 2005-12-12 | 2010-08-17 | Kyma Technologies, Inc. | Inclusion-free uniform semi-insulating group III nitride substrate and methods for making same |
| TWI519686B (zh) * | 2005-12-15 | 2016-02-01 | 聖戈班晶體探測器公司 | 低差排密度氮化鎵(GaN)之生長方法 |
| CN1988109B (zh) * | 2005-12-21 | 2012-03-21 | 弗赖贝格化合物原料有限公司 | 生产自支撑iii-n层和自支撑iii-n基底的方法 |
| JP2007217227A (ja) * | 2006-02-16 | 2007-08-30 | Sumitomo Electric Ind Ltd | GaN結晶の製造方法、GaN結晶基板および半導体デバイス |
| JP2009536606A (ja) | 2006-05-09 | 2009-10-15 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 非極性および半極性(Al、Ga、In)Nの原位置欠陥低減技術 |
| DE102006029831A1 (de) * | 2006-06-27 | 2008-01-03 | Acandis Gmbh & Co. Kg | Verfahren zur Herstellung strukturierter Schichten aus Titan und Nickel |
| CA2663382C (en) * | 2006-09-22 | 2012-04-24 | Saint-Gobain Ceramics & Plastics, Inc. | C-plane sapphire method and apparatus |
| JP5242587B2 (ja) * | 2006-12-08 | 2013-07-24 | サン−ゴバン クリストー エ デテクトゥール | 結晶が基材端部上に成長しないように基板上にエピタキシャル成長させて窒化物単結晶を製造する方法 |
| JP5125098B2 (ja) * | 2006-12-26 | 2013-01-23 | 信越半導体株式会社 | 窒化物半導体自立基板の製造方法 |
| WO2008091910A2 (en) * | 2007-01-22 | 2008-07-31 | Group4 Labs, Llc | Composite wafers having bulk-quality semiconductor layers |
| DE102007020979A1 (de) * | 2007-04-27 | 2008-10-30 | Azzurro Semiconductors Ag | Nitridhalbleiterbauelement mit Gruppe-III-Nitrid-Schichtstruktur auf einer Gruppe-IV-Substratoberfläche mit höchstens zweizähliger Symmetrie |
| FR2917232B1 (fr) * | 2007-06-06 | 2009-10-09 | Soitec Silicon On Insulator | Procede de fabrication d'une structure pour epitaxie sans zone d'exclusion. |
| US20090130415A1 (en) * | 2007-11-21 | 2009-05-21 | Saint-Gobain Ceramics & Plastics, Inc. | R-Plane Sapphire Method and Apparatus |
| KR100969812B1 (ko) * | 2007-12-12 | 2010-07-13 | 주식회사 실트론 | 자가 분리를 이용한 질화갈륨 단결정 기판의 제조 방법 |
| JP5324110B2 (ja) * | 2008-01-16 | 2013-10-23 | 国立大学法人東京農工大学 | 積層体およびその製造方法 |
| KR101423718B1 (ko) * | 2008-02-26 | 2014-08-04 | 서울바이오시스 주식회사 | 낮은 결함 밀도를 가지는 단결정 실리콘 카바이드 기판 및그 제조 방법 |
| FR2931293B1 (fr) * | 2008-05-15 | 2010-09-03 | Soitec Silicon On Insulator | Procede de fabrication d'une heterostructure support d'epitaxie et heterostructure correspondante |
| US9171909B2 (en) | 2008-08-04 | 2015-10-27 | Goldeneye, Inc. | Flexible semiconductor devices based on flexible freestanding epitaxial elements |
| US8633493B2 (en) | 2008-08-04 | 2014-01-21 | Goldeneye, Inc. | Large area thin freestanding nitride layers and their use as circuit layers |
| EP2151856A1 (de) * | 2008-08-06 | 2010-02-10 | S.O.I. TEC Silicon | Relaxation von Spannungsschichten |
| EP2151861A1 (de) * | 2008-08-06 | 2010-02-10 | S.O.I. TEC Silicon | Passivierung von geätzten Halbleiterstrukturen |
| TWI457984B (zh) | 2008-08-06 | 2014-10-21 | S O I Tec絕緣層上矽科技公司 | 應變層的鬆弛方法 |
| EP2151852B1 (de) | 2008-08-06 | 2020-01-15 | Soitec | Relaxation und Übertragung von Spannungsschichten |
| EP2159836B1 (de) * | 2008-08-25 | 2017-05-31 | Soitec | Versteifungsschichten zur Relaxation von verspannten Schichten |
| KR101101780B1 (ko) * | 2008-09-08 | 2012-01-05 | 서울대학교산학협력단 | 질화물 박막 구조 및 그 형성 방법 |
| CA2747574C (en) * | 2008-12-24 | 2015-07-14 | Saint-Gobain Cristaux & Detecteurs | Manufacturing of low defect density free-standing gallium nitride substrates and devices fabricated thereof |
| JP4871973B2 (ja) * | 2009-04-28 | 2012-02-08 | 株式会社沖データ | 半導体薄膜素子の製造方法並びに半導体ウエハ、及び、半導体薄膜素子 |
| KR101640830B1 (ko) * | 2009-08-17 | 2016-07-22 | 삼성전자주식회사 | 기판 구조체 및 그 제조 방법 |
| US8158200B2 (en) * | 2009-08-18 | 2012-04-17 | University Of North Texas | Methods of forming graphene/(multilayer) boron nitride for electronic device applications |
| US9012253B2 (en) * | 2009-12-16 | 2015-04-21 | Micron Technology, Inc. | Gallium nitride wafer substrate for solid state lighting devices, and associated systems and methods |
| FR2961948B1 (fr) * | 2010-06-23 | 2012-08-03 | Soitec Silicon On Insulator | Procede de traitement d'une piece en materiau compose |
| EP2727134A4 (de) | 2011-06-28 | 2015-04-01 | Saint Gobain Cristaux Et Detecteurs | Halbleitersubstrat und verfahren zu seiner herstellung |
| KR20140106590A (ko) * | 2011-11-21 | 2014-09-03 | 쌩-고벵 크리스톡스 에 드테끄퇴르 | 반도체 기판 및 형성 방법 |
| WO2013123241A1 (en) * | 2012-02-17 | 2013-08-22 | The Regents Of The University Of California | Method for the reuse of gallium nitride epitaxial substrates |
| JP2013173652A (ja) * | 2012-02-27 | 2013-09-05 | Tokuyama Corp | 自立基板の製造方法 |
| TWI528580B (zh) * | 2012-03-30 | 2016-04-01 | 聖戈班晶體探測器公司 | 形成獨立式半導體晶圓之方法 |
| CN102650074B (zh) * | 2012-04-09 | 2015-09-16 | 中国电子科技集团公司第五十五研究所 | 制备大尺寸宽禁带单晶薄膜的结构和方法 |
| KR102008494B1 (ko) * | 2012-08-23 | 2019-08-07 | 식스포인트 머터리얼즈 인코퍼레이티드 | 질화갈륨과 금속 산화물의 복합체 기판 |
| CN103074676B (zh) * | 2012-09-13 | 2016-04-27 | 中国电子科技集团公司第四十六研究所 | 一种实现具有自剥离功能半导体材料生长的边缘保护方法 |
| KR101381056B1 (ko) | 2012-11-29 | 2014-04-14 | 주식회사 시지트로닉스 | Ⅲ-질화계 에피층이 성장된 반도체 기판 및 그 방법 |
| KR102071034B1 (ko) * | 2013-02-28 | 2020-01-29 | 서울바이오시스 주식회사 | 질화물 기판 제조 방법 |
| FR3007193B1 (fr) * | 2013-06-18 | 2016-12-09 | Saint-Gobain Lumilog | Materiau semi-conducteur incluant des zones d'orientations cristallines differentes et procede de realisation associe |
| CN103388178B (zh) * | 2013-08-07 | 2016-12-28 | 厦门市三安光电科技有限公司 | Iii族氮化物外延结构及其生长方法 |
| TWI570911B (zh) * | 2014-05-19 | 2017-02-11 | 新世紀光電股份有限公司 | 半導體結構 |
| KR20160008382A (ko) | 2014-07-14 | 2016-01-22 | 서울대학교산학협력단 | 반도체 적층 구조, 이를 이용한 질화물 반도체층 분리방법 및 장치 |
| JP2016062956A (ja) * | 2014-09-16 | 2016-04-25 | アイシン精機株式会社 | 基板及びその製造方法、半導体素子及びその製造方法、並びにレーザ加工装置 |
| FR3029942B1 (fr) * | 2014-12-11 | 2020-12-25 | Saint Gobain Lumilog | Procede de fabrication de plaquettes de nitrure d'element 13 a angle de troncature non nul |
| US10181398B2 (en) | 2014-12-30 | 2019-01-15 | Sensor Electronic Technology, Inc. | Strain-control heterostructure growth |
| WO2016197077A1 (en) | 2015-06-05 | 2016-12-08 | Sensor Electronic Technology, Inc. | Heterostructure with stress controlling layer |
| US10950747B2 (en) * | 2015-07-01 | 2021-03-16 | Sensor Electronic Technology, Inc. | Heterostructure for an optoelectronic device |
| FR3048547B1 (fr) | 2016-03-04 | 2018-11-09 | Saint-Gobain Lumilog | Procede de fabrication d'un substrat semi-conducteur |
| US11047650B2 (en) | 2017-09-29 | 2021-06-29 | Saint-Gobain Ceramics & Plastics, Inc. | Transparent composite having a laminated structure |
| US11302800B2 (en) | 2018-02-23 | 2022-04-12 | The Texas A&M University System | Fabrication of electronic devices using sacrificial seed layers |
| JP6553765B1 (ja) * | 2018-03-20 | 2019-07-31 | 株式会社サイオクス | 結晶基板の製造方法および結晶基板 |
| FR3091020B1 (fr) | 2018-12-21 | 2023-02-10 | Saint Gobain Lumilog | SUBSTRAT SEMI-CONDUCTEUR CO-DOPE n |
| FR3091008B1 (fr) | 2018-12-21 | 2023-03-31 | Saint Gobain Lumilog | Substrat semi-conducteur avec couche intermédiaire dopée n |
| DE102019115351A1 (de) | 2019-06-06 | 2020-12-10 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterbauelement mit Strahlungskonversionselement und Verfahren zum Herstellen von Strahlungskonversionselementen |
| FR3102776B1 (fr) | 2019-11-05 | 2025-04-11 | Saint Gobain Lumilog | Plaquette de nitrure d’élément 13 de variation d’angle de troncature réduite |
| JP7620570B2 (ja) * | 2019-12-23 | 2025-01-23 | 日本碍子株式会社 | AlN単結晶板 |
| JP7620571B2 (ja) * | 2019-12-23 | 2025-01-23 | 日本碍子株式会社 | AlN積層板 |
| FR3112238A1 (fr) | 2020-07-06 | 2022-01-07 | Saint-Gobain Lumilog | Substrat semi-conducteur avec couche d’interface nitruree |
| CN112820632B (zh) * | 2021-01-14 | 2024-01-09 | 镓特半导体科技(上海)有限公司 | 半导体结构、自支撑氮化镓层及其制备方法 |
| CN113161226A (zh) * | 2021-03-10 | 2021-07-23 | 无锡吴越半导体有限公司 | 一种基于等离子体cvd的氮化镓单结晶基板制造方法 |
| CN115347037B (zh) * | 2022-08-26 | 2025-10-17 | 江苏第三代半导体研究院有限公司 | 半导体外延结构及其制备方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996041906A1 (en) * | 1995-06-13 | 1996-12-27 | Advanced Technology Materials, Inc. | Bulk single crystal gallium nitride and method of making same |
| DE19640594B4 (de) * | 1996-10-01 | 2016-08-04 | Osram Gmbh | Bauelement |
| WO1999001594A1 (en) * | 1997-07-03 | 1999-01-14 | Cbl Technologies | Thermal mismatch compensation to produce free standing substrates by epitaxial deposition |
| EP1041610B1 (de) * | 1997-10-30 | 2010-12-15 | Sumitomo Electric Industries, Ltd. | Gan einkristall-substrat und herstellungsmethode |
| US6071795A (en) * | 1998-01-23 | 2000-06-06 | The Regents Of The University Of California | Separation of thin films from transparent substrates by selective optical processing |
| JP3788041B2 (ja) * | 1998-06-30 | 2006-06-21 | 住友電気工業株式会社 | GaN単結晶基板の製造方法 |
| US6372041B1 (en) * | 1999-01-08 | 2002-04-16 | Gan Semiconductor Inc. | Method and apparatus for single crystal gallium nitride (GaN) bulk synthesis |
| JP3545962B2 (ja) | 1999-03-23 | 2004-07-21 | 三菱電線工業株式会社 | GaN系化合物半導体結晶の成長方法及び半導体結晶基材 |
| FR2835096B1 (fr) * | 2002-01-22 | 2005-02-18 | Procede de fabrication d'un substrat auto-porte en materiau semi-conducteur monocristallin | |
| JP2002284600A (ja) * | 2001-03-26 | 2002-10-03 | Hitachi Cable Ltd | 窒化ガリウム結晶基板の製造方法及び窒化ガリウム結晶基板 |
| JP3631724B2 (ja) * | 2001-03-27 | 2005-03-23 | 日本電気株式会社 | Iii族窒化物半導体基板およびその製造方法 |
| US6498113B1 (en) * | 2001-06-04 | 2002-12-24 | Cbl Technologies, Inc. | Free standing substrates by laser-induced decoherency and regrowth |
| US6648966B2 (en) * | 2001-08-01 | 2003-11-18 | Crystal Photonics, Incorporated | Wafer produced thereby, and associated methods and devices using the wafer |
-
2003
- 2003-09-26 FR FR0311296A patent/FR2860248B1/fr not_active Expired - Fee Related
-
2004
- 2004-09-24 KR KR1020067008056A patent/KR101154747B1/ko not_active Expired - Fee Related
- 2004-09-24 AT AT04787441T patent/ATE414189T1/de not_active IP Right Cessation
- 2004-09-24 US US10/573,463 patent/US7282381B2/en not_active Expired - Lifetime
- 2004-09-24 CA CA2540245A patent/CA2540245C/fr not_active Expired - Fee Related
- 2004-09-24 WO PCT/FR2004/002416 patent/WO2005031045A2/fr not_active Ceased
- 2004-09-24 AU AU2004276541A patent/AU2004276541B2/en not_active Ceased
- 2004-09-24 EP EP04787441A patent/EP1699951B1/de not_active Expired - Lifetime
- 2004-09-24 JP JP2006527446A patent/JP4783288B2/ja not_active Expired - Fee Related
- 2004-09-24 CN CNB2004800343701A patent/CN100387760C/zh not_active Expired - Fee Related
- 2004-09-24 DE DE602004017781T patent/DE602004017781D1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| WO2005031045A3 (fr) | 2005-05-26 |
| FR2860248B1 (fr) | 2006-02-17 |
| JP4783288B2 (ja) | 2011-09-28 |
| CA2540245A1 (fr) | 2005-04-07 |
| US20070072396A1 (en) | 2007-03-29 |
| DE602004017781D1 (de) | 2008-12-24 |
| AU2004276541A1 (en) | 2005-04-07 |
| AU2004276541B2 (en) | 2009-05-28 |
| KR20060079249A (ko) | 2006-07-05 |
| EP1699951B1 (de) | 2008-11-12 |
| FR2860248A1 (fr) | 2005-04-01 |
| KR101154747B1 (ko) | 2012-06-08 |
| EP1699951A2 (de) | 2006-09-13 |
| CN100387760C (zh) | 2008-05-14 |
| JP2007506635A (ja) | 2007-03-22 |
| CA2540245C (fr) | 2012-02-14 |
| US7282381B2 (en) | 2007-10-16 |
| CN1882720A (zh) | 2006-12-20 |
| WO2005031045A2 (fr) | 2005-04-07 |
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