ATE419963T1 - Verfahren zum abtrennen von komponenten von einem substrat - Google Patents

Verfahren zum abtrennen von komponenten von einem substrat

Info

Publication number
ATE419963T1
ATE419963T1 AT02733073T AT02733073T ATE419963T1 AT E419963 T1 ATE419963 T1 AT E419963T1 AT 02733073 T AT02733073 T AT 02733073T AT 02733073 T AT02733073 T AT 02733073T AT E419963 T1 ATE419963 T1 AT E419963T1
Authority
AT
Austria
Prior art keywords
substrate
separating components
protrusions
groove
deviations
Prior art date
Application number
AT02733073T
Other languages
English (en)
Inventor
Petrus Bouten
T Veld Frederik In
Roger Wehrens
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE419963T1 publication Critical patent/ATE419963T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
AT02733073T 2001-05-29 2002-05-27 Verfahren zum abtrennen von komponenten von einem substrat ATE419963T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP01202030 2001-05-29

Publications (1)

Publication Number Publication Date
ATE419963T1 true ATE419963T1 (de) 2009-01-15

Family

ID=8180386

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02733073T ATE419963T1 (de) 2001-05-29 2002-05-27 Verfahren zum abtrennen von komponenten von einem substrat

Country Status (8)

Country Link
US (2) US7134582B2 (de)
EP (1) EP1395406B1 (de)
JP (1) JP2004526603A (de)
KR (1) KR20030029641A (de)
CN (1) CN1234515C (de)
AT (1) ATE419963T1 (de)
DE (1) DE60230746D1 (de)
WO (1) WO2002096612A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1395406B1 (de) * 2001-05-29 2009-01-07 Koninklijke Philips Electronics N.V. Verfahren zum abtrennen von komponenten von einem substrat
JP2007149743A (ja) * 2005-11-24 2007-06-14 Disco Abrasive Syst Ltd ウエーハのレーザー加工方法
US7923837B2 (en) * 2007-10-31 2011-04-12 Hewlett-Packard Development Company, L.P. Microelectronic device patterned by ablating and subsequently sintering said microelectronic device
CN102132635A (zh) * 2008-06-20 2011-07-20 日立金属株式会社 陶瓷集合基板及其制造方法，陶瓷基板和陶瓷电路基板
JP2013046924A (ja) * 2011-07-27 2013-03-07 Toshiba Mach Co Ltd レーザダイシング方法
KR101396989B1 (ko) * 2011-08-24 2014-05-21 미쓰보시 다이야몬도 고교 가부시키가이샤 유리 기판의 스크라이브 방법
DE102013022584B3 (de) * 2013-04-22 2025-06-05 Rogers Germany Gmbh Verfahren zum Herstellen eines Basissubstrates und ein solches Basissubstrat
DE102013104055B4 (de) 2013-04-22 2023-08-31 Rogers Germany Gmbh Basissubstrat, Metall-Keramik-Substrat hergestellt aus einem Basissubstrat sowie Verfahren zum Herstellen eines Basissubstrates

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3680213A (en) * 1969-02-03 1972-08-01 Karl O Reichert Method of grooving semiconductor wafer for the dividing thereof
DE2121455A1 (de) * 1971-04-30 1972-11-02 Siemens AG, 1000 Berlin u. 8000 München Verfahren zum Aufteilen von plattenförmigen Werkstücken
US4247031A (en) 1979-04-10 1981-01-27 Rca Corporation Method for cracking and separating pellets formed on a wafer
FR2516848A1 (fr) * 1981-11-25 1983-05-27 Radiotechnique Compelec Procede et machine pour subdiviser une plaque de ceramiqueŸa
JPS58218123A (ja) 1982-06-11 1983-12-19 Nippon Telegr & Teleph Corp <Ntt> 研摩用マ−クを有するウエハの製造方法
JP2575795B2 (ja) * 1988-04-28 1997-01-29 富士通株式会社 半導体装置の製造方法
JP2696964B2 (ja) * 1988-07-21 1998-01-14 松下電器産業株式会社 セラミック基板の分割方法
JPH02179708A (ja) * 1989-01-05 1990-07-12 Kawasaki Steel Corp 半導体ウエハの破折分離方法
US5128282A (en) * 1991-11-04 1992-07-07 Xerox Corporation Process for separating image sensor dies and the like from a wafer that minimizes silicon waste
JP2924588B2 (ja) 1992-08-31 1999-07-26 住友電気工業株式会社 基板の切断方法
JP2790416B2 (ja) * 1993-08-26 1998-08-27 沖電気工業株式会社 アライメントマーク配置方法
EP0678904A1 (de) * 1994-04-12 1995-10-25 Lsi Logic Corporation Wafer-Schneidverfahren durch Mehrfachschnitte
JP4301584B2 (ja) * 1998-01-14 2009-07-22 株式会社ルネサステクノロジ レチクル、それを用いた露光装置、露光方法および半導体装置の製造方法
KR100268426B1 (ko) * 1998-05-07 2000-11-01 윤종용 반도체 장치의 제조 방법
JP2001345289A (ja) * 2000-05-31 2001-12-14 Nec Corp 半導体装置の製造方法
EP1395406B1 (de) * 2001-05-29 2009-01-07 Koninklijke Philips Electronics N.V. Verfahren zum abtrennen von komponenten von einem substrat

Also Published As

Publication number Publication date
CN1234515C (zh) 2006-01-04
DE60230746D1 (de) 2009-02-26
US7134582B2 (en) 2006-11-14
EP1395406A1 (de) 2004-03-10
US20070072395A1 (en) 2007-03-29
WO2002096612A1 (en) 2002-12-05
EP1395406B1 (de) 2009-01-07
KR20030029641A (ko) 2003-04-14
US7331495B2 (en) 2008-02-19
JP2004526603A (ja) 2004-09-02
CN1463218A (zh) 2003-12-24
US20040144824A1 (en) 2004-07-29

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