ATE423386T1 - Elektronische vorrichtung und deren herstellungsverfahren - Google Patents

Elektronische vorrichtung und deren herstellungsverfahren

Info

Publication number
ATE423386T1
ATE423386T1 AT05018884T AT05018884T ATE423386T1 AT E423386 T1 ATE423386 T1 AT E423386T1 AT 05018884 T AT05018884 T AT 05018884T AT 05018884 T AT05018884 T AT 05018884T AT E423386 T1 ATE423386 T1 AT E423386T1
Authority
AT
Austria
Prior art keywords
electronic device
production
internal electrode
layers
hetero phase
Prior art date
Application number
AT05018884T
Other languages
English (en)
Inventor
Kazushige Ito
Akira Sato
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corp filed Critical Tdk Corp
Application granted granted Critical
Publication of ATE423386T1 publication Critical patent/ATE423386T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49206—Contact or terminal manufacturing by powder metallurgy

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Thermistors And Varistors (AREA)
  • Credit Cards Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
AT05018884T 2004-08-31 2005-08-31 Elektronische vorrichtung und deren herstellungsverfahren ATE423386T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004252595A JP4295179B2 (ja) 2004-08-31 2004-08-31 電子部品およびその製造方法

Publications (1)

Publication Number Publication Date
ATE423386T1 true ATE423386T1 (de) 2009-03-15

Family

ID=35455956

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05018884T ATE423386T1 (de) 2004-08-31 2005-08-31 Elektronische vorrichtung und deren herstellungsverfahren

Country Status (8)

Country Link
US (2) US7295422B2 (de)
EP (1) EP1630831B1 (de)
JP (1) JP4295179B2 (de)
KR (1) KR100724219B1 (de)
CN (1) CN1744244B (de)
AT (1) ATE423386T1 (de)
DE (1) DE602005012766D1 (de)
TW (1) TWI269324B (de)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
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JP2007035848A (ja) * 2005-07-26 2007-02-08 Taiyo Yuden Co Ltd 積層セラミックコンデンサ及びその製造方法
JP2007266289A (ja) * 2006-03-28 2007-10-11 Tdk Corp 積層型セラミック電子部品およびその製造方法
JPWO2008072448A1 (ja) * 2006-12-12 2010-03-25 株式会社村田製作所 積層セラミック電子部品の製造方法および積層セラミック電子部品
JP5094572B2 (ja) * 2008-03-26 2012-12-12 京セラ株式会社 積層セラミックコンデンサ
KR101120004B1 (ko) * 2009-06-19 2012-02-22 가부시키가이샤 무라타 세이사쿠쇼 세라믹 전자부품
JP5275918B2 (ja) * 2009-06-24 2013-08-28 Ｔｄｋ株式会社 積層型セラミック電子部品
CN102640239B (zh) 2009-12-11 2015-06-17 株式会社村田制作所 层叠型陶瓷电子部件
KR20110072938A (ko) * 2009-12-23 2011-06-29 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조방법
KR101133327B1 (ko) * 2010-04-09 2012-04-05 삼성전기주식회사 적층 세라믹 커패시터의 제조방법
EP2581922A1 (de) * 2010-06-10 2013-04-17 Kanji Shimizu Stromspeichervorrichtung
WO2012173018A1 (ja) * 2011-06-17 2012-12-20 株式会社村田製作所 積層セラミック電子部品、および積層セラミック電子部品の製造方法
US20130107419A1 (en) * 2011-10-28 2013-05-02 Kemet Electronics Corporation Multilayered ceramic capacitor with improved lead frame attachment
JP6168721B2 (ja) * 2012-01-20 2017-07-26 株式会社村田製作所 積層セラミック電子部品およびその製造方法
KR101761940B1 (ko) * 2012-05-04 2017-07-26 삼성전기주식회사 적층형 전자 부품 및 이의 제조방법
KR101580350B1 (ko) * 2012-06-04 2015-12-23 삼성전기주식회사 적층 세라믹 부품
JP5543537B2 (ja) * 2012-07-24 2014-07-09 太陽誘電株式会社 圧電素子
JP6117557B2 (ja) * 2013-01-28 2017-04-19 京セラ株式会社 積層型電子部品
JP6558084B2 (ja) * 2015-06-05 2019-08-14 株式会社村田製作所 積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法
CN109074956B (zh) * 2016-04-28 2020-07-10 株式会社村田制作所 陶瓷电子部件及陶瓷电子部件的制造方法
JP6571590B2 (ja) * 2016-05-26 2019-09-04 太陽誘電株式会社 積層セラミックコンデンサ
KR102078016B1 (ko) * 2018-04-10 2020-04-07 삼성전기주식회사 적층형 커패시터
KR102105384B1 (ko) * 2018-07-19 2020-04-28 삼성전기주식회사 적층형 커패시터
KR102691306B1 (ko) * 2018-11-13 2024-08-05 삼성전기주식회사 적층 세라믹 전자부품
JP2020167198A (ja) 2019-03-28 2020-10-08 株式会社村田製作所 積層セラミックコンデンサ
JP2020167197A (ja) 2019-03-28 2020-10-08 株式会社村田製作所 積層セラミックコンデンサ
JP7024756B2 (ja) 2019-03-28 2022-02-24 株式会社村田製作所 積層セラミックコンデンサ
JP2020167199A (ja) 2019-03-28 2020-10-08 株式会社村田製作所 積層セラミックコンデンサ
JP2020167201A (ja) 2019-03-28 2020-10-08 株式会社村田製作所 積層セラミックコンデンサ
KR102842061B1 (ko) 2019-07-15 2025-08-04 삼성전기주식회사 커패시터 부품
JP2021040100A (ja) 2019-09-05 2021-03-11 株式会社村田製作所 積層セラミックコンデンサ
US11373810B2 (en) * 2019-12-27 2022-06-28 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor
JP7575914B2 (ja) * 2019-12-27 2024-10-30 株式会社村田製作所 積層セラミックコンデンサ
JP2021111659A (ja) 2020-01-07 2021-08-02 株式会社村田製作所 積層セラミックコンデンサ
JP2021150300A (ja) 2020-03-16 2021-09-27 株式会社村田製作所 積層セラミックコンデンサ
JP2021150301A (ja) 2020-03-16 2021-09-27 株式会社村田製作所 積層セラミックコンデンサ
KR102867009B1 (ko) * 2020-10-30 2025-10-01 삼성전기주식회사 적층형 커패시터
JP2023050840A (ja) * 2021-09-30 2023-04-11 太陽誘電株式会社 セラミック電子部品およびその製造方法
KR20240068377A (ko) * 2022-11-10 2024-05-17 삼성전기주식회사 적층형 전자 부품

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US2946937A (en) 1956-05-07 1960-07-26 Plessey Co Ltd Ceramic material and method of producing the same
NL231805A (de) 1957-10-03
US3987347A (en) 1975-05-29 1976-10-19 Sprague Electric Company Temperature stable monolithic ceramic capacitor with base metal electrodes
DE69034034T2 (de) * 1989-10-18 2003-10-16 Tdk Corp., Tokio/Tokyo Keramischer Mehrschicht-Chipkondensator und Verfahren zu seiner Herstellung
US5335139A (en) * 1992-07-13 1994-08-02 Tdk Corporation Multilayer ceramic chip capacitor
JPH113834A (ja) 1996-07-25 1999-01-06 Murata Mfg Co Ltd 積層セラミックコンデンサおよびその製造方法
JP2000269066A (ja) * 1999-03-19 2000-09-29 Taiyo Yuden Co Ltd 積層セラミックコンデンサ
JP3760364B2 (ja) 1999-07-21 2006-03-29 Ｔｄｋ株式会社 誘電体磁器組成物および電子部品
JP3348081B2 (ja) 1999-10-19 2002-11-20 ティーディーケイ株式会社 誘電体磁器組成物および電子部品
JP3417911B2 (ja) 2000-08-21 2003-06-16 ティーディーケイ株式会社 誘電体磁器組成物の製造方法と誘電体層含有電子部品の製造方法
JP3875832B2 (ja) 2000-10-17 2007-01-31 Ｔｄｋ株式会社 電子部品およびその製造方法
JP3341003B2 (ja) 2000-12-25 2002-11-05 ティーディーケイ株式会社 誘電体磁器組成物および電子部品
JP4691807B2 (ja) 2001-03-08 2011-06-01 株式会社村田製作所 積層セラミックコンデンサ
JP2002293627A (ja) 2001-04-04 2002-10-09 Taiyo Yuden Co Ltd 誘電体磁器組成物及び磁器コンデンサ
EP1327616B9 (de) 2002-01-15 2011-04-13 TDK Corporation Dielektrische keramische Zusammensetzung und elektronische Vorrichtung
JP3783938B2 (ja) * 2002-03-19 2006-06-07 Ｔｄｋ株式会社 セラミック粉末と積層セラミック電子部品
JP4776913B2 (ja) * 2004-01-08 2011-09-21 Ｔｄｋ株式会社 積層型セラミックコンデンサ及びその製造方法
JP4203452B2 (ja) * 2004-06-28 2009-01-07 Ｔｄｋ株式会社 積層型セラミックコンデンサの製造方法

Also Published As

Publication number Publication date
DE602005012766D1 (de) 2009-04-02
US20080110006A1 (en) 2008-05-15
EP1630831B1 (de) 2009-02-18
KR100724219B1 (ko) 2007-05-31
EP1630831A2 (de) 2006-03-01
TW200612447A (en) 2006-04-16
JP4295179B2 (ja) 2009-07-15
CN1744244B (zh) 2010-05-12
CN1744244A (zh) 2006-03-08
KR20060050889A (ko) 2006-05-19
TWI269324B (en) 2006-12-21
EP1630831A3 (de) 2007-01-24
US8087136B2 (en) 2012-01-03
JP2006073623A (ja) 2006-03-16
US7295422B2 (en) 2007-11-13
US20060043523A1 (en) 2006-03-02

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