ATE427557T1 - Vakuumvorrichtung und -verfahren - Google Patents

Vakuumvorrichtung und -verfahren

Info

Publication number
ATE427557T1
ATE427557T1 AT01308428T AT01308428T ATE427557T1 AT E427557 T1 ATE427557 T1 AT E427557T1 AT 01308428 T AT01308428 T AT 01308428T AT 01308428 T AT01308428 T AT 01308428T AT E427557 T1 ATE427557 T1 AT E427557T1
Authority
AT
Austria
Prior art keywords
chamber
articles
supporting surface
cover
load lock
Prior art date
Application number
AT01308428T
Other languages
English (en)
Inventor
Bruce Gordon Ramsay
Original Assignee
Edwards Vacuum Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Edwards Vacuum Inc filed Critical Edwards Vacuum Inc
Application granted granted Critical
Publication of ATE427557T1 publication Critical patent/ATE427557T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3312—Vertical transfer of a batch of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A50/00—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE in human health protection, e.g. against extreme weather
    • Y02A50/30—Against vector-borne diseases, e.g. mosquito-borne, fly-borne, tick-borne or waterborne diseases whose impact is exacerbated by climate change
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
AT01308428T 2000-10-04 2001-10-02 Vakuumvorrichtung und -verfahren ATE427557T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/679,498 US6609877B1 (en) 2000-10-04 2000-10-04 Vacuum chamber load lock structure and article transport mechanism

Publications (1)

Publication Number Publication Date
ATE427557T1 true ATE427557T1 (de) 2009-04-15

Family

ID=24727140

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01308428T ATE427557T1 (de) 2000-10-04 2001-10-02 Vakuumvorrichtung und -verfahren

Country Status (6)

Country Link
US (2) US6609877B1 (de)
EP (1) EP1195795B1 (de)
JP (1) JP5209158B2 (de)
AT (1) ATE427557T1 (de)
DE (1) DE60138168D1 (de)
ES (1) ES2320972T3 (de)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6841033B2 (en) * 2001-03-21 2005-01-11 Nordson Corporation Material handling system and method for a multi-workpiece plasma treatment system
US20030086774A1 (en) * 2001-11-07 2003-05-08 Schlumberger Technologies, Inc. System and method for inhibiting motion of semiconductor wafers in a variable-pressure chamber
JP4389424B2 (ja) * 2001-12-25 2009-12-24 東京エレクトロン株式会社 被処理体の搬送機構及び処理システム
SG115631A1 (en) 2003-03-11 2005-10-28 Asml Netherlands Bv Lithographic projection assembly, load lock and method for transferring objects
SG115629A1 (en) 2003-03-11 2005-10-28 Asml Netherlands Bv Method and apparatus for maintaining a machine part
JP4420380B2 (ja) * 2003-09-10 2010-02-24 大日本スクリーン製造株式会社 基板処理装置
US20060249370A1 (en) * 2003-09-15 2006-11-09 Makoto Nagashima Back-biased face target sputtering based liquid crystal display device
US7500822B2 (en) * 2004-04-09 2009-03-10 Edwards Vacuum, Inc. Combined vacuum pump load-lock assembly
TWI502694B (zh) 2004-05-14 2015-10-01 費洛鐵股份有限公司 轉移物件通過低壓狀態下之負荷固定艙的裝置及方法
KR100622846B1 (ko) * 2004-10-06 2006-09-19 주식회사 에이디피엔지니어링 평판표시소자 제조장치
US7585141B2 (en) * 2005-02-01 2009-09-08 Varian Semiconductor Equipment Associates, Inc. Load lock system for ion beam processing
US20070205096A1 (en) * 2006-03-06 2007-09-06 Makoto Nagashima Magnetron based wafer processing
DE202006007937U1 (de) * 2006-05-18 2007-09-20 Strämke, Siegfried, Dr.-Ing. Plasmabehandlungsanlage
US8454810B2 (en) 2006-07-14 2013-06-04 4D-S Pty Ltd. Dual hexagonal shaped plasma source
US10541157B2 (en) 2007-05-18 2020-01-21 Brooks Automation, Inc. Load lock fast pump vent
WO2008144670A1 (en) 2007-05-18 2008-11-27 Brooks Automation, Inc. Load lock fast pump vent
US8022372B2 (en) * 2008-02-15 2011-09-20 Veeco Instruments Inc. Apparatus and method for batch non-contact material characterization
KR20100000146A (ko) * 2008-06-24 2010-01-06 주성엔지니어링(주) 챔버리드를 포함하는 기판처리를 위한 진공챔버
JP5796279B2 (ja) * 2009-07-10 2015-10-21 シンフォニアテクノロジー株式会社 ロードポート装置、並びにその蓋体着脱装置及びマッピング装置の各昇降機構の制御方法
US8445874B2 (en) * 2010-04-11 2013-05-21 Gatan Inc. Ion beam sample preparation apparatus and methods
DE102010016792A1 (de) 2010-05-05 2011-11-10 Aixtron Ag Bevorratungsmagazin einer CVD-Anlage
US9920418B1 (en) 2010-09-27 2018-03-20 James Stabile Physical vapor deposition apparatus having a tapered chamber
US8958061B2 (en) 2011-05-31 2015-02-17 Veeco Instruments Inc. Heated wafer carrier profiling
CN103014617B (zh) 2011-09-22 2014-05-14 株式会社新柯隆 薄膜形成装置
JPWO2013042247A1 (ja) * 2011-09-22 2015-03-26 株式会社シンクロン 薄膜形成装置
US9082801B2 (en) * 2012-09-05 2015-07-14 Industrial Technology Research Institute Rotatable locating apparatus with dome carrier and operating method thereof
US9373534B2 (en) 2012-09-05 2016-06-21 Industrial Technology Research Institute Rotary positioning apparatus with dome carrier, automatic pick-and-place system, and operating method thereof
US20140096483A1 (en) * 2012-10-04 2014-04-10 Brookhaven Science Associates, Llc Transfer Chamber for Air-Sensitive Sample Processing
US9016998B2 (en) * 2013-03-14 2015-04-28 Varian Semiconductor Equipment Associates, Inc. High throughput, low volume clamshell load lock
JP6495707B2 (ja) 2015-03-25 2019-04-03 株式会社Ｓｃｒｅｅｎホールディングス 露光装置および基板処理装置
JP6493339B2 (ja) * 2016-08-26 2019-04-03 村田機械株式会社 搬送容器、及び収容物の移載方法
TWI794475B (zh) * 2018-05-09 2023-03-01 德商索萊爾有限公司 用於接收多個基板以進行處理之保持裝置、處理系統及方法
TWI730406B (zh) * 2018-09-17 2021-06-11 美商先進尼克斯有限公司 真空隔離的批次處理系統
CN110284114B (zh) * 2019-06-17 2021-02-05 福建省福联集成电路有限公司 一种晶圆镀膜的真空装置
CN111180375B (zh) * 2020-01-20 2025-04-01 烟台职业学院 一种双温区避免温度串扰的物料交换装置
WO2021186604A1 (ja) * 2020-03-18 2021-09-23 株式会社Ｔｈｅｒｍａｌｙｔｉｃａ 蒸着装置
CN112501574B (zh) * 2020-10-27 2022-10-25 东兴华鸿光学科技有限公司 太阳镜片镀膜设备
EP4295390A1 (de) * 2021-02-22 2023-12-27 Evatec AG Vakuumbehandlungsvorrichtung und verfahren zur herstellung von vakuumbehandelten substraten
CN113345822B (zh) * 2021-07-16 2023-12-01 江苏天芯微半导体设备有限公司 批处理用晶圆支撑架和加载互锁真空室

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4226208A (en) * 1977-08-04 1980-10-07 Canon Kabushiki Kaisha Vapor deposition apparatus
US4341582A (en) 1980-12-22 1982-07-27 The Perkin-Elmer Corporation Load-lock vacuum chamber
JPS59206206A (ja) * 1983-05-11 1984-11-22 Yokohama Rubber Co Ltd:The 乗用車用空気入りタイヤ
US4584045A (en) 1984-02-21 1986-04-22 Plasma-Therm, Inc. Apparatus for conveying a semiconductor wafer
US4632624A (en) 1984-03-09 1986-12-30 Tegal Corporation Vacuum load lock apparatus
JPS60238133A (ja) * 1984-04-16 1985-11-27 Tokuda Seisakusho Ltd 真空処理装置
US4915564A (en) 1986-04-04 1990-04-10 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
US4676884A (en) 1986-07-23 1987-06-30 The Boc Group, Inc. Wafer processing machine with evacuated wafer transporting and storage system
US4861563A (en) 1987-05-14 1989-08-29 Spectrum Cvd, Inc. Vacuum load lock
JPH0689442B2 (ja) * 1987-06-05 1994-11-09 新明和工業株式会社 真空蒸着装置
DE3923237C2 (de) * 1988-08-03 1994-01-27 Stihl Maschf Andreas Zündschaltung für einen Verbrennungsmotor
DE3921672C2 (de) * 1989-07-01 1996-12-05 Leybold Ag Vorrichtung zum Halten und Wenden von Linsen, insbesondere für in einer Hochvakuum-Aufdampfanlage oder -Sputteranlage zu beschichtende Brillenglaslinsen
JP3466607B2 (ja) * 1989-09-13 2003-11-17 ソニー株式会社 スパッタリング装置
JP3044735B2 (ja) * 1990-03-30 2000-05-22 ソニー株式会社 スパッタリング装置
JP2808826B2 (ja) * 1990-05-25 1998-10-08 松下電器産業株式会社 基板の移し換え装置
JPH0811606B2 (ja) * 1990-09-20 1996-02-07 株式会社芝浦製作所 搬送装置
JP2868637B2 (ja) * 1991-02-12 1999-03-10 東京エレクトロン株式会社 板状体の搬送装置
JPH05275511A (ja) * 1991-03-01 1993-10-22 Tokyo Electron Ltd 被処理体の移載システム及び処理装置
JPH0773833B2 (ja) * 1992-04-23 1995-08-09 アプライド マテリアルズ インコーポレイテッド ロボット・アセンブリ
JPH063503A (ja) * 1992-06-18 1994-01-14 Seiko Epson Corp 眼鏡用レンズの反射防止膜蒸着装置
US5482607A (en) * 1992-09-21 1996-01-09 Nissin Electric Co., Ltd. Film forming apparatus
KR100302012B1 (ko) * 1992-11-06 2001-11-30 조셉 제이. 스위니 미소-환경 콘테이너 연결방법 및 미소-환경 로드 로크
US5586585A (en) * 1995-02-27 1996-12-24 Asyst Technologies, Inc. Direct loadlock interface
US6481956B1 (en) * 1995-10-27 2002-11-19 Brooks Automation Inc. Method of transferring substrates with two different substrate holding end effectors
JPH10303276A (ja) 1997-04-28 1998-11-13 Toshiba Corp マルチチャンバ装置
JP3076775B2 (ja) * 1997-07-31 2000-08-14 芝浦メカトロニクス株式会社 真空処理装置
JPH11150059A (ja) * 1997-11-19 1999-06-02 Canon Inc 半導体装置の製造方法及びその装置並びに投影露光装置
JPH11156771A (ja) * 1997-11-28 1999-06-15 Dainippon Screen Mfg Co Ltd 基板搬送装置および基板搬送方法
JPH11179649A (ja) * 1997-12-16 1999-07-06 Speedfam Co Ltd ワークの取出方法及びワーク取出機構付き平面研磨装置
US6042623A (en) * 1998-01-12 2000-03-28 Tokyo Electron Limited Two-wafer loadlock wafer processing apparatus and loading and unloading method therefor
JPH11284048A (ja) * 1998-03-31 1999-10-15 Shibaura Mechatronics Corp ロボット装置および処理装置
JPH11330196A (ja) * 1998-05-13 1999-11-30 Tadamoto Tamai ウエハ搬送装置及び搬送方法
JP2000064042A (ja) * 1998-08-19 2000-02-29 Shibaura Mechatronics Corp 回転アーム式スパッタ装置
US6719516B2 (en) * 1998-09-28 2004-04-13 Applied Materials, Inc. Single wafer load lock with internal wafer transport
US6217272B1 (en) 1998-10-01 2001-04-17 Applied Science And Technology, Inc. In-line sputter deposition system
JP2000195925A (ja) * 1998-12-28 2000-07-14 Anelva Corp 基板処理装置
US6190103B1 (en) * 1999-03-31 2001-02-20 Gasonics International Corporation Wafer transfer device and method
US6429139B1 (en) * 1999-12-17 2002-08-06 Eaton Corporation Serial wafer handling mechanism

Also Published As

Publication number Publication date
EP1195795B1 (de) 2009-04-01
JP5209158B2 (ja) 2013-06-12
EP1195795A3 (de) 2006-04-12
US20040083955A1 (en) 2004-05-06
US7541061B2 (en) 2009-06-02
US6609877B1 (en) 2003-08-26
JP2002198413A (ja) 2002-07-12
DE60138168D1 (de) 2009-05-14
EP1195795A2 (de) 2002-04-10
ES2320972T3 (es) 2009-06-01

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