ATE431699T1 - Leiterplatte und verfahren zur herstellung einer leiterplatte - Google Patents

Leiterplatte und verfahren zur herstellung einer leiterplatte

Info

Publication number: ATE431699T1
Authority: AT; Austria
Prior art keywords: film; thin copper; thin; circuit board; copper film
Prior art date: 2004-07-01

Application number

AT05254062T

Other languages

English (en)

Inventor

Kei Nakamura

Takeshi Yamato

Original Assignee

Nitto Denko Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2004-07-01

Filing date

2005-06-29

Publication date

2009-05-15

2005-06-29 Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp

2009-05-15 Application granted granted Critical

2009-05-15 Publication of ATE431699T1 publication Critical patent/ATE431699T1/de

Links

238000004519 manufacturing process Methods 0.000 title 1
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 6
229910052802 copper Inorganic materials 0.000 abstract 6
239000010949 copper Substances 0.000 abstract 6
238000007747 plating Methods 0.000 abstract 4
239000004020 conductor Substances 0.000 abstract 3
239000002184 metal Substances 0.000 abstract 2
229910052751 metal Inorganic materials 0.000 abstract 2
238000003486 chemical etching Methods 0.000 abstract 1
229910000365 copper sulfate Inorganic materials 0.000 abstract 1
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract 1
238000009713 electroplating Methods 0.000 abstract 1
239000012212 insulator Substances 0.000 abstract 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Chemical & Material Sciences (AREA)
Inorganic Chemistry (AREA)
Manufacturing Of Printed Wiring (AREA)
Manufacturing Of Printed Circuit Boards (AREA)
Parts Printed On Printed Circuit Boards (AREA)
Transmitters (AREA)

AT05254062T 2004-07-01 2005-06-29 Leiterplatte und verfahren zur herstellung einer leiterplatte ATE431699T1 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2004195939A JP4298597B2 (ja)	2004-07-01	2004-07-01	配線回路基板および配線回路基板の製造方法

Publications (1)

Publication Number	Publication Date
ATE431699T1 true ATE431699T1 (de)	2009-05-15

Family

ID=34941781

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AT05254062T ATE431699T1 (de)	2004-07-01	2005-06-29	Leiterplatte und verfahren zur herstellung einer leiterplatte

Country Status (8)

Country	Link
US (2)	US20060000637A1 (de)
EP (1)	EP1613135B1 (de)
JP (1)	JP4298597B2 (de)
KR (1)	KR101156915B1 (de)
CN (1)	CN100593964C (de)
AT (1)	ATE431699T1 (de)
DE (1)	DE602005014421D1 (de)
TW (1)	TWI363589B (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4844730B2 (ja) *	2006-05-22	2011-12-28	住友金属鉱山株式会社	金属被覆ポリイミド基板の評価方法
US8877074B2 (en) *	2006-12-15	2014-11-04	The Regents Of The University Of California	Methods of manufacturing microdevices in laminates, lead frames, packages, and printed circuit boards
TW200847867A (en) *	2007-04-26	2008-12-01	Mitsui Mining & Smelting Co	Printed wire board and manufacturing method thereof, and electrolytic copper foil for copper-clad lamination board used for manufacturing the same
JP5736722B2 (ja) *	2010-10-22	2015-06-17	大日本印刷株式会社	サスペンション用基板、サスペンション用基板の製造方法、サスペンション、素子付サスペンション、およびハードディスクドライブ
CN102427058B (zh) *	2011-11-09	2015-07-22	深南电路有限公司	通过溅射工艺制作线路图形的方法和芯片的重新布线方法
JP5812845B2 (ja) *	2011-12-19	2015-11-17	新光電気工業株式会社	発光素子搭載用パッケージ及び発光素子パッケージ並びにそれらの製造方法
CN103298263B (zh) *	2012-02-28	2016-09-21	深南电路有限公司	一种印制线路板及其加工方法
CN103906364B (zh) *	2012-12-25	2017-07-14	上海美维科技有限公司	一种印制电路板中隐埋电阻的加工方法
CN103966601B (zh) *	2013-02-05	2018-05-18	汉达精密电子(昆山)有限公司	非金属基体导电线路的制作方法及其产品
EP3104400B1 (de)	2014-02-04	2022-08-31	Murata Manufacturing Co., Ltd.	Herstellungsverfahren für ein elektronisches komponentenmodul
KR101893503B1 (ko) *	2016-05-27	2018-08-30	(주) 화인켐	미세배선용 연성 회로 기판 및 이의 제조방법
TWI658763B (zh)	2017-10-11	2019-05-01	欣興電子股份有限公司	製造導線之方法
CN113630977B (zh) *	2020-05-06	2023-01-17	鹏鼎控股(深圳)股份有限公司	厚铜电路板及其制作方法
CN115665979A (zh) *	2022-11-15	2023-01-31	施耐德万高（天津）电气设备有限公司	两层、多层铜膜的pcb板的制作方法及pcb板

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3220897A (en) *	1961-02-13	1965-11-30	Esther S Conley	Conducting element and method
US3328275A (en) *	1963-12-18	1967-06-27	Revere Copper & Brass Inc	Treatment of copper to form a dendritic surface
US3674656A (en) *	1969-06-19	1972-07-04	Circuit Foil Corp	Bonding treatment and products produced thereby
US4352716A (en) *	1980-12-24	1982-10-05	International Business Machines Corporation	Dry etching of copper patterns
MY101308A (en)	1986-06-09	1991-09-05	Minnesota Mining & Mfg	Presensitized circuit material.
JPH0783168B2 (ja) *	1988-04-13	1995-09-06	株式会社日立製作所	プリント板の製造方法
DE4113261A1 (de)	1991-04-23	1992-10-29	Siemens Ag	Verfahren zum aufbringen einer basiskupferschicht auf glasfaserverstaerktem oder keramikpulvergefuelltem teflonsubstrat und verfahren zur herstellung sehr feiner leiterbahnstrukturen darauf
JPH06120630A (ja)	1992-10-07	1994-04-28	Ulvac Japan Ltd	プリント配線基板用の銅箔
JP2717911B2 (ja) *	1992-11-19	1998-02-25	日鉱グールド・フォイル株式会社	印刷回路用銅箔及びその製造方法
JP2762386B2 (ja) *	1993-03-19	1998-06-04	三井金属鉱業株式会社	銅張り積層板およびプリント配線板
JPH0732544A (ja)	1993-07-22	1995-02-03	Mitsui Mining & Smelting Co Ltd	紙基材銅張積層板およびその製造方法
JPH0951163A (ja)	1995-05-31	1997-02-18	Mitsui Toatsu Chem Inc	フレキシブル回路基板
JPH0955575A (ja) *	1995-08-10	1997-02-25	Mitsui Toatsu Chem Inc	積層体
US5679230A (en) *	1995-08-21	1997-10-21	Oak-Mitsui, Inc.	Copper foil for printed circuit boards
SG55276A1 (en) *	1996-02-13	1998-12-21	Nitto Denko Corp	Circuit substrate circuit-formed suspension substrate and production method thereof
US6319620B1 (en) *	1998-01-19	2001-11-20	Mitsui Mining & Smelting Co., Ltd.	Making and using an ultra-thin copper foil
US6278185B1 (en)	1998-05-27	2001-08-21	Intel Corporation	Semi-additive process (SAP) architecture for organic leadless grid array packages
EP1120820A3 (de) *	2000-01-24	2008-01-09	Ebara Corporation	Verfahren und Vorrichtung zur Herstellung einer Verdrahtungsstruktur
JP3633422B2 (ja) *	2000-02-22	2005-03-30	ソニーケミカル株式会社	接続材料
US6346335B1 (en) *	2000-03-10	2002-02-12	Olin Corporation	Copper foil composite including a release layer
JP2002176259A (ja)	2000-09-27	2002-06-21	Hitachi Ltd	多層プリント配線板の製造方法および多層プリント配線板
US6772515B2 (en) *	2000-09-27	2004-08-10	Hitachi, Ltd.	Method of producing multilayer printed wiring board
US6429523B1 (en)	2001-01-04	2002-08-06	International Business Machines Corp.	Method for forming interconnects on semiconductor substrates and structures formed
JP2002268905A (ja) *	2001-03-07	2002-09-20	Canon Inc	プログラム動作装置、プログラム書込制御装置、プログラム書込制御方法及び記憶媒体
TW587103B (en)	2001-04-06	2004-05-11	Phoenix Prec Technology Corp	Circuit board Ni/Au electroplating process without electroplated wires
JP2003318532A (ja) *	2002-04-24	2003-11-07	Toyo Metallizing Co Ltd	フレキシブルプリント配線用基板
JP2003324258A (ja)	2002-05-01	2003-11-14	Nippon Mektron Ltd	プリント配線板用銅張板
JP2004039771A (ja)	2002-07-02	2004-02-05	Nitto Denko Corp	配線回路基板の製造方法
JP2004082444A (ja) *	2002-08-26	2004-03-18	Dainippon Printing Co Ltd	金属層付き樹脂体および配線体
JP2004335807A (ja) *	2003-05-08	2004-11-25	Nitto Denko Corp	配線回路基板の製造方法

2004
- 2004-07-01 JP JP2004195939A patent/JP4298597B2/ja not_active Expired - Fee Related
2005
- 2005-06-28 TW TW094121651A patent/TWI363589B/zh not_active IP Right Cessation
- 2005-06-29 AT AT05254062T patent/ATE431699T1/de not_active IP Right Cessation
- 2005-06-29 EP EP05254062A patent/EP1613135B1/de not_active Expired - Lifetime
- 2005-06-29 DE DE602005014421T patent/DE602005014421D1/de not_active Expired - Lifetime
- 2005-06-30 KR KR1020050057589A patent/KR101156915B1/ko not_active Expired - Fee Related
- 2005-06-30 CN CN200510082408A patent/CN100593964C/zh not_active Expired - Fee Related
- 2005-07-01 US US11/173,126 patent/US20060000637A1/en not_active Abandoned
2007
- 2007-12-13 US US11/955,432 patent/US8092696B2/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
CN1717161A (zh)	2006-01-04
TWI363589B (en)	2012-05-01
EP1613135A1 (de)	2006-01-04
US20080164236A1 (en)	2008-07-10
KR101156915B1 (ko)	2012-06-21
DE602005014421D1 (de)	2009-06-25
CN100593964C (zh)	2010-03-10
US8092696B2 (en)	2012-01-10
US20060000637A1 (en)	2006-01-05
TW200603707A (en)	2006-01-16
EP1613135B1 (de)	2009-05-13
JP4298597B2 (ja)	2009-07-22
KR20060048744A (ko)	2006-05-18
JP2006019522A (ja)	2006-01-19

Legal Events

Date	Code	Title	Description
2009-11-15	RER	Ceased as to paragraph 5 lit. 3 law introducing patent treaties

Publication	Publication Date	Title
ATE431699T1 (de)	2009-05-15	Leiterplatte und verfahren zur herstellung einer leiterplatte
DE3860511D1 (de)	1990-10-04	Verfahren zur herstellung von leiterplatten.
JPH02128492A (ja)	1990-05-16	印刷配線板の製造方法
TW200501852A (en)	2005-01-01	Method for producing wired circuit board
DE60216182D1 (de)	2007-01-04	Verfahren zur Herstellung einer gedruckten Leiterplatte
ATE388614T1 (de)	2008-03-15	Verfahren zur herstellung einer doppelseitigen leiterplatte
WO2008111309A1 (ja)	2008-09-18	認識マークおよび回路基板の製造方法
DE59909260D1 (de)	2004-05-27	Verfahren zur herstellung von mehrlagenschaltungen
CN1836472B (zh)	2010-06-16	印刷布线板及其制造方法
TW200631481A (en)	2006-09-01	Printed wiring board manufacturing method
TW200746968A (en)	2007-12-16	Method for fabricating electrical connecting structure of circuit board
WO2011010889A3 (en)	2011-06-30	Flexible printed circuit board and method for manufacturing the same
JP2003078234A (ja)	2003-03-14	プリント配線板およびその製造方法
TW200742514A (en)	2007-11-01	Process for producing wiring circuit board
TW200607425A (en)	2006-02-16	Method for producing PCB
JPH03196597A (ja)	1991-08-28	印刷配線板の製造方法
MY138599A (en)	2009-07-31	Printed circuit boards having integrated inductor cores
TW200420756A (en)	2004-10-16	Plating-pretreatment solution and plating-pretreatment method
JP2015172250A5 (ja)	2016-12-28	表面処理銅箔、キャリア付銅箔、プリント回路板の製造方法、銅張積層板の製造方法及びプリント配線板の製造方法
JP7699193B2 (ja)	2025-06-26	粗化銅箔の製造方法
JPH03202500A (ja)	1991-09-04	銅箔の粗面化方法
ATE544324T1 (de)	2012-02-15	Verfahren zur herstellung einer elektrisch leitenden schichtstruktur
KR101607821B1 (ko)	2016-03-30	미세패턴 인쇄회로기판 제조방법
KR20070113706A (ko)	2007-11-29	리드선 없이 인쇄 회로 기판에 전해 금도금을 수행하는 방법
JP2009267001A (ja)	2009-11-12	配線基板の製造方法