ATE451725T1 - Neue deckschicht für eine magnettunnelübergangsvorrichtung zur verstärkung von dr/r und herstellungsverfahren dafür - Google Patents
Neue deckschicht für eine magnettunnelübergangsvorrichtung zur verstärkung von dr/r und herstellungsverfahren dafürInfo
- Publication number
- ATE451725T1 ATE451725T1 AT07392004T AT07392004T ATE451725T1 AT E451725 T1 ATE451725 T1 AT E451725T1 AT 07392004 T AT07392004 T AT 07392004T AT 07392004 T AT07392004 T AT 07392004T AT E451725 T1 ATE451725 T1 AT E451725T1
- Authority
- AT
- Austria
- Prior art keywords
- layer
- nifehf
- nife
- reinforcement
- production
- Prior art date
Links
- 230000002787 reinforcement Effects 0.000 title 1
- 230000007704 transition Effects 0.000 title 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 abstract 5
- 230000005415 magnetization Effects 0.000 abstract 2
- 229910019236 CoFeB Inorganic materials 0.000 abstract 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- 239000002131 composite material Substances 0.000 abstract 1
- 238000005247 gettering Methods 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
- 238000004544 sputter deposition Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
- G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
- G11B5/3903—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
- G11B5/3906—Details related to the use of magnetic thin film layers or to their effects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1673—Reading or sensing circuits or methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/26—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers
- H01F10/30—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers characterised by the composition of the intermediate layers, e.g. seed, buffer, template, diffusion preventing, cap layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3295—Spin-exchange coupled multilayers wherein the magnetic pinned or free layers are laminated without anti-parallel coupling within the pinned and free layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/30—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE]
- H01F41/302—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
- H10N50/85—Materials of the active region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3254—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3254—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]
- H01F10/3259—Spin-exchange-coupled multilayers comprising at least a nanooxide layer [NOL], e.g. with a NOL spacer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Hall/Mr Elements (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Magnetic Heads (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/496,691 US7595520B2 (en) | 2006-07-31 | 2006-07-31 | Capping layer for a magnetic tunnel junction device to enhance dR/R and a method of making the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE451725T1 true ATE451725T1 (de) | 2009-12-15 |
Family
ID=38686715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT07392004T ATE451725T1 (de) | 2006-07-31 | 2007-07-30 | Neue deckschicht für eine magnettunnelübergangsvorrichtung zur verstärkung von dr/r und herstellungsverfahren dafür |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US7595520B2 (de) |
| EP (1) | EP1885006B1 (de) |
| JP (1) | JP5346453B2 (de) |
| AT (1) | ATE451725T1 (de) |
| DE (1) | DE602007003641D1 (de) |
Families Citing this family (86)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7408747B2 (en) * | 2005-02-01 | 2008-08-05 | Hitachi Global Storage Technologies Netherlands B.V. | Enhanced anti-parallel-pinned sensor using thin ruthenium spacer and high magnetic field annealing |
| US7880249B2 (en) * | 2005-11-30 | 2011-02-01 | Magic Technologies, Inc. | Spacer structure in MRAM cell and method of its fabrication |
| US7595520B2 (en) | 2006-07-31 | 2009-09-29 | Magic Technologies, Inc. | Capping layer for a magnetic tunnel junction device to enhance dR/R and a method of making the same |
| JP4862564B2 (ja) * | 2006-08-30 | 2012-01-25 | Tdk株式会社 | トンネル型磁気検出素子およびその製造方法 |
| JP2008078378A (ja) * | 2006-09-21 | 2008-04-03 | Alps Electric Co Ltd | トンネル型磁気検出素子及びその製造方法 |
| US7672093B2 (en) * | 2006-10-17 | 2010-03-02 | Magic Technologies, Inc. | Hafnium doped cap and free layer for MRAM device |
| JP5003109B2 (ja) * | 2006-11-14 | 2012-08-15 | 富士通株式会社 | 強磁性トンネル接合素子、その製造方法、及びそれを用いた磁気ヘッド、磁気メモリ |
| US7920363B2 (en) * | 2006-12-22 | 2011-04-05 | Hitachi Global Storage Technologies Netherlands B.V. | TMR sensor having magnesium/magnesium oxide tunnel barrier |
| US7598579B2 (en) * | 2007-01-30 | 2009-10-06 | Magic Technologies, Inc. | Magnetic tunnel junction (MTJ) to reduce spin transfer magnetization switching current |
| TWI330366B (en) * | 2007-02-07 | 2010-09-11 | Ind Tech Res Inst | Magnetic memory device |
| US7663131B2 (en) | 2007-03-08 | 2010-02-16 | Magic Technologies, Inc. | SyAF structure to fabricate Mbit MTJ MRAM |
| JP2008227297A (ja) * | 2007-03-14 | 2008-09-25 | Tdk Corp | トンネル型磁気検出素子及びその製造方法 |
| US8372661B2 (en) | 2007-10-31 | 2013-02-12 | Magic Technologies, Inc. | High performance MTJ element for conventional MRAM and for STT-RAM and a method for making the same |
| US20090122450A1 (en) * | 2007-11-08 | 2009-05-14 | Headway Technologies, Inc. | TMR device with low magnetostriction free layer |
| KR20100131967A (ko) | 2008-03-06 | 2010-12-16 | 후지 덴키 홀딩스 가부시키가이샤 | 강자성 터널 접합 소자 및 강자성 터널 접합 소자의 구동 방법 |
| US7820455B2 (en) * | 2008-03-31 | 2010-10-26 | Hitachi Global Storage Technologies Netherlands B.V. | Method for manufacturing a tunnel junction magnetoresistive sensor with improved performance and having a CoFeB free layer |
| US8164862B2 (en) * | 2008-04-02 | 2012-04-24 | Headway Technologies, Inc. | Seed layer for TMR or CPP-GMR sensor |
| US8724264B2 (en) * | 2008-09-04 | 2014-05-13 | Tdk Corporation | Thin film magnetic head, magnetic head slider, head gimbal assembly, head arm assembly, magnetic disk device and method of manufacturing thin film magnetic head |
| US8482966B2 (en) * | 2008-09-24 | 2013-07-09 | Qualcomm Incorporated | Magnetic element utilizing protective sidewall passivation |
| US7939188B2 (en) * | 2008-10-27 | 2011-05-10 | Seagate Technology Llc | Magnetic stack design |
| US8169753B2 (en) * | 2008-11-21 | 2012-05-01 | Hitachi Global Storage Technologies Netherlands B.V. | Current-perpendicular-to-plane (CPP) read sensor with ferromagnetic amorphous buffer and polycrystalline seed layers |
| US20100148167A1 (en) * | 2008-12-12 | 2010-06-17 | Everspin Technologies, Inc. | Magnetic tunnel junction stack |
| US7808027B2 (en) * | 2009-01-14 | 2010-10-05 | Magic Technologies, Inc. | Free layer/capping layer for high performance MRAM MTJ |
| US20100213073A1 (en) * | 2009-02-23 | 2010-08-26 | International Business Machines Corporation | Bath for electroplating a i-iii-vi compound, use thereof and structures containing same |
| US8218271B2 (en) * | 2009-07-22 | 2012-07-10 | Hitachi Global Storage Technologies Netherlands B.V. | TMR sensor with a multilayered reference layer |
| US7919407B1 (en) * | 2009-11-17 | 2011-04-05 | Magic Technologies, Inc. | Method of high density field induced MRAM process |
| US8238143B2 (en) | 2009-12-15 | 2012-08-07 | Qualcomm Incorporated | Magnetic tunnel junction device and fabrication |
| US8922956B2 (en) | 2010-06-04 | 2014-12-30 | Seagate Technology Llc | Tunneling magneto-resistive sensors with buffer layers |
| US8427791B2 (en) | 2010-11-23 | 2013-04-23 | HGST Netherlands B.V. | Magnetic tunnel junction having a magnetic insertion layer and methods of producing the same |
| US8541247B2 (en) * | 2010-12-20 | 2013-09-24 | Seagate Technology Llc | Non-volatile memory cell with lateral pinning |
| US8786036B2 (en) | 2011-01-19 | 2014-07-22 | Headway Technologies, Inc. | Magnetic tunnel junction for MRAM applications |
| US8568602B2 (en) * | 2011-01-19 | 2013-10-29 | HGST Netherlands B.V. | Method of manufacturing a magnetic read sensor having a low resistance cap structure |
| US8790798B2 (en) * | 2011-04-18 | 2014-07-29 | Alexander Mikhailovich Shukh | Magnetoresistive element and method of manufacturing the same |
| US9159908B2 (en) | 2011-05-05 | 2015-10-13 | Headway Technologies, Inc. | Composite free layer within magnetic tunnel junction for MRAM applications |
| US8686484B2 (en) | 2011-06-10 | 2014-04-01 | Everspin Technologies, Inc. | Spin-torque magnetoresistive memory element and method of fabricating same |
| JP2013021108A (ja) * | 2011-07-11 | 2013-01-31 | Toshiba Corp | 半導体記憶装置およびその製造方法 |
| US8492169B2 (en) | 2011-08-15 | 2013-07-23 | Magic Technologies, Inc. | Magnetic tunnel junction for MRAM applications |
| US10553785B2 (en) | 2012-04-20 | 2020-02-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Magnetoresistive random access memory device and method of making same |
| US8901687B2 (en) | 2012-11-27 | 2014-12-02 | Industrial Technology Research Institute | Magnetic device with a substrate, a sensing block and a repair layer |
| US8797688B2 (en) | 2012-11-30 | 2014-08-05 | HGST Netherlands B.V. | Fill-in contact layer for slider air bearing surface protective coating |
| US9275713B2 (en) * | 2013-01-17 | 2016-03-01 | Yimin Guo | Magnetoresistive element and method of manufacturing the same |
| US20140295579A1 (en) * | 2013-03-29 | 2014-10-02 | T3Memory, Inc. | Method of patterning mtj stack |
| JP6414984B2 (ja) * | 2013-04-10 | 2018-10-31 | 国立大学法人東北大学 | 半導体装置及びその製造方法 |
| KR102105078B1 (ko) | 2013-05-30 | 2020-04-27 | 삼성전자주식회사 | 자기 기억 소자 |
| US9203017B2 (en) | 2013-08-02 | 2015-12-01 | Samsung Electronics Co., Ltd. | Method and system for providing magnetic junctions including a package structure usable in spin transfer torque memories |
| US8958180B1 (en) | 2013-08-28 | 2015-02-17 | HGST Netherlands, B.V. | Capping materials for magnetic read head sensor |
| US9240547B2 (en) | 2013-09-10 | 2016-01-19 | Micron Technology, Inc. | Magnetic tunnel junctions and methods of forming magnetic tunnel junctions |
| US9461242B2 (en) | 2013-09-13 | 2016-10-04 | Micron Technology, Inc. | Magnetic memory cells, methods of fabrication, semiconductor devices, memory systems, and electronic systems |
| US9608197B2 (en) | 2013-09-18 | 2017-03-28 | Micron Technology, Inc. | Memory cells, methods of fabrication, and semiconductor devices |
| US8953284B1 (en) * | 2013-11-20 | 2015-02-10 | HGST Netherlands B.V. | Multi-read sensor having a narrow read gap structure |
| KR102214798B1 (ko) | 2014-02-05 | 2021-02-10 | 삼성전자주식회사 | 패키지 기판 및 이를 포함하는 반도체 패키지 |
| US9281466B2 (en) | 2014-04-09 | 2016-03-08 | Micron Technology, Inc. | Memory cells, semiconductor structures, semiconductor devices, and methods of fabrication |
| US9559296B2 (en) | 2014-07-03 | 2017-01-31 | Samsung Electronics Co., Ltd. | Method for providing a perpendicular magnetic anisotropy magnetic junction usable in spin transfer torque magnetic devices using a sacrificial insertion layer |
| US9330692B2 (en) | 2014-07-25 | 2016-05-03 | HGST Netherlands B.V. | Confinement magnetic cap |
| US9349945B2 (en) | 2014-10-16 | 2016-05-24 | Micron Technology, Inc. | Memory cells, semiconductor devices, and methods of fabrication |
| US9768377B2 (en) | 2014-12-02 | 2017-09-19 | Micron Technology, Inc. | Magnetic cell structures, and methods of fabrication |
| US9647204B2 (en) | 2014-12-05 | 2017-05-09 | International Business Machines Corporation | Spin torque MRAM based on Co, Ir synthetic antiferromagnetic multilayer |
| US9373779B1 (en) | 2014-12-08 | 2016-06-21 | Micron Technology, Inc. | Magnetic tunnel junctions |
| US10439131B2 (en) | 2015-01-15 | 2019-10-08 | Micron Technology, Inc. | Methods of forming semiconductor devices including tunnel barrier materials |
| US9502642B2 (en) | 2015-04-10 | 2016-11-22 | Micron Technology, Inc. | Magnetic tunnel junctions, methods used while forming magnetic tunnel junctions, and methods of forming magnetic tunnel junctions |
| US9520553B2 (en) | 2015-04-15 | 2016-12-13 | Micron Technology, Inc. | Methods of forming a magnetic electrode of a magnetic tunnel junction and methods of forming a magnetic tunnel junction |
| US9530959B2 (en) | 2015-04-15 | 2016-12-27 | Micron Technology, Inc. | Magnetic tunnel junctions |
| US9257136B1 (en) | 2015-05-05 | 2016-02-09 | Micron Technology, Inc. | Magnetic tunnel junctions |
| US9960346B2 (en) | 2015-05-07 | 2018-05-01 | Micron Technology, Inc. | Magnetic tunnel junctions |
| US9490164B1 (en) | 2015-06-23 | 2016-11-08 | International Business Machines Corporation | Techniques for forming contacts for active BEOL |
| US9537088B1 (en) * | 2015-07-13 | 2017-01-03 | Micron Technology, Inc. | Magnetic tunnel junctions |
| US9685604B2 (en) * | 2015-08-31 | 2017-06-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Magnetoresistive random access memory cell and fabricating the same |
| KR102465539B1 (ko) | 2015-09-18 | 2022-11-11 | 삼성전자주식회사 | 자기 터널 접합 구조체를 포함하는 반도체 소자 및 그의 형성 방법 |
| US10483460B2 (en) * | 2015-10-31 | 2019-11-19 | Everspin Technologies, Inc. | Method of manufacturing a magnetoresistive stack/ structure using plurality of encapsulation layers |
| US10483320B2 (en) | 2015-12-10 | 2019-11-19 | Everspin Technologies, Inc. | Magnetoresistive stack with seed region and method of manufacturing the same |
| EP4514109A3 (de) | 2015-12-10 | 2025-04-30 | Everspin Technologies, Inc. | Magnetoresistiver stapel, seed-region dafür und verfahren zur herstellung davon |
| US20170221506A1 (en) * | 2016-02-02 | 2017-08-03 | Seagate Technology Llc | Thin Data Reader Cap |
| US10008224B2 (en) * | 2016-03-11 | 2018-06-26 | Western Digital Technologies, Inc. | Magnetic read head with floating trailing shield |
| US10361361B2 (en) * | 2016-04-08 | 2019-07-23 | International Business Machines Corporation | Thin reference layer for STT MRAM |
| US9680089B1 (en) | 2016-05-13 | 2017-06-13 | Micron Technology, Inc. | Magnetic tunnel junctions |
| KR102511914B1 (ko) * | 2016-08-04 | 2023-03-21 | 삼성전자주식회사 | 자기 기억 소자 및 이의 제조 방법 |
| JP2018056389A (ja) * | 2016-09-29 | 2018-04-05 | Tdk株式会社 | 磁気抵抗効果素子 |
| US10741417B2 (en) * | 2017-11-30 | 2020-08-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for forming interconnect structure |
| US10622047B2 (en) * | 2018-03-23 | 2020-04-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Free layer structure in magnetic random access memory (MRAM) for Mo or W perpendicular magnetic anisotropy (PMA) enhancing layer |
| US10522752B1 (en) | 2018-08-22 | 2019-12-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Magnetic layer for magnetic random access memory (MRAM) by moment enhancement |
| US11239413B2 (en) * | 2018-10-31 | 2022-02-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Magnetic device and magnetic random access memory |
| US11009570B2 (en) * | 2018-11-16 | 2021-05-18 | Samsung Electronics Co., Ltd. | Hybrid oxide/metal cap layer for boron-free free layer |
| US11125840B2 (en) | 2020-02-18 | 2021-09-21 | Western Digital Technologies, Inc. | Ultra-low RA and high TMR magnetic sensor with radiation reflective lead |
| CN117337049A (zh) * | 2020-06-16 | 2024-01-02 | 联华电子股份有限公司 | 半导体元件及其制作方法 |
| KR20220125050A (ko) * | 2021-03-04 | 2022-09-14 | 삼성전자주식회사 | 자기터널접합 소자, 자기터널접합 소자를 포함하는 메모리 장치, 및 자기터널접합 소자의 제조 방법 |
| KR102931169B1 (ko) | 2021-05-27 | 2026-02-27 | 삼성전자주식회사 | 자기 기억 소자 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3388685B2 (ja) * | 1996-04-01 | 2003-03-24 | ティーディーケイ株式会社 | 磁気ヘッド |
| US6226159B1 (en) * | 1999-06-25 | 2001-05-01 | International Business Machines Corporation | Multilayered pinned layer of cobalt based films separated by a nickel base film for improved coupling field and GMR for spin valve sensors |
| US6686071B2 (en) * | 2000-06-06 | 2004-02-03 | Matsushita Electric Industrial Co., Ltd. | Magnetic recording medium and magnetic recording apparatus using the same |
| JP2001352112A (ja) * | 2000-06-07 | 2001-12-21 | Matsushita Electric Ind Co Ltd | 磁気抵抗効果素子及び磁気抵抗効果型ヘッド |
| US6574079B2 (en) * | 2000-11-09 | 2003-06-03 | Tdk Corporation | Magnetic tunnel junction device and method including a tunneling barrier layer formed by oxidations of metallic alloys |
| JP2003338644A (ja) * | 2001-11-19 | 2003-11-28 | Alps Electric Co Ltd | 磁気検出素子及びその製造方法 |
| JP2003198003A (ja) * | 2001-12-27 | 2003-07-11 | Sony Corp | 磁気抵抗効果素子およびその製造方法並びに磁気メモリ装置 |
| JP2003208710A (ja) * | 2002-01-15 | 2003-07-25 | Fuji Photo Film Co Ltd | 磁気記録媒体 |
| JP2003318762A (ja) | 2002-04-22 | 2003-11-07 | Nagoya Industrial Science Research Inst | イメージ信号キャンセル型ヘテロダイン受信方式 |
| JP2003318462A (ja) | 2002-04-22 | 2003-11-07 | Matsushita Electric Ind Co Ltd | 磁気抵抗効果素子とこれを用いた磁気ヘッドおよび磁気メモリ |
| JP3699954B2 (ja) * | 2002-10-25 | 2005-09-28 | 株式会社東芝 | 磁気メモリ |
| US6903909B2 (en) * | 2002-11-01 | 2005-06-07 | Hewlett-Packard Development Company, L.P. | Magnetoresistive element including ferromagnetic sublayer having smoothed surface |
| JP2004200245A (ja) * | 2002-12-16 | 2004-07-15 | Nec Corp | 磁気抵抗素子及び磁気抵抗素子の製造方法 |
| JP2004221302A (ja) * | 2003-01-15 | 2004-08-05 | Alps Electric Co Ltd | 磁気検出素子 |
| JP2004335931A (ja) * | 2003-05-12 | 2004-11-25 | Alps Electric Co Ltd | Cpp型巨大磁気抵抗効果素子 |
| JP2005032780A (ja) * | 2003-07-07 | 2005-02-03 | Tdk Corp | 磁気抵抗効果素子、これを用いた磁気ヘッド、ヘッドサスペンションアセンブリ及び磁気ディスク装置 |
| JP2005203701A (ja) * | 2004-01-19 | 2005-07-28 | Sony Corp | 磁気抵抗効果素子及び磁気メモリ装置 |
| US7122852B2 (en) * | 2004-05-12 | 2006-10-17 | Headway Technologies, Inc. | Structure/method to fabricate a high performance magnetic tunneling junction MRAM |
| US20050271799A1 (en) * | 2004-06-02 | 2005-12-08 | Fuji Photo Film Co., Ltd. | Method for producing magnetic recording medium |
| US7449345B2 (en) * | 2004-06-15 | 2008-11-11 | Headway Technologies, Inc. | Capping structure for enhancing dR/R of the MTJ device |
| US7405011B2 (en) * | 2004-06-30 | 2008-07-29 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetic recording media for tilted recording |
| US7072208B2 (en) * | 2004-07-28 | 2006-07-04 | Headway Technologies, Inc. | Vortex magnetic random access memory |
| US20080008908A1 (en) * | 2004-11-22 | 2008-01-10 | Nec Corporation | Ferromagnetic Film, Magneto-Resistance Element And Magnetic Random Access Memory |
| TWI261912B (en) * | 2004-12-01 | 2006-09-11 | Ind Tech Res Inst | Magnetic random access memory with reference magnetic resistance and reading method thereof |
| JP2006190838A (ja) * | 2005-01-06 | 2006-07-20 | Sony Corp | 記憶素子及びメモリ |
| JP2006245229A (ja) * | 2005-03-02 | 2006-09-14 | Alps Electric Co Ltd | 磁気検出素子及びその製造方法 |
| JP4533807B2 (ja) * | 2005-06-23 | 2010-09-01 | 株式会社東芝 | 磁気抵抗効果素子及び磁気ランダムアクセスメモリ |
| US7479394B2 (en) * | 2005-12-22 | 2009-01-20 | Magic Technologies, Inc. | MgO/NiFe MTJ for high performance MRAM application |
| US7528457B2 (en) * | 2006-04-14 | 2009-05-05 | Magic Technologies, Inc. | Method to form a nonmagnetic cap for the NiFe(free) MTJ stack to enhance dR/R |
| US7595520B2 (en) | 2006-07-31 | 2009-09-29 | Magic Technologies, Inc. | Capping layer for a magnetic tunnel junction device to enhance dR/R and a method of making the same |
-
2006
- 2006-07-31 US US11/496,691 patent/US7595520B2/en active Active
-
2007
- 2007-07-30 AT AT07392004T patent/ATE451725T1/de not_active IP Right Cessation
- 2007-07-30 EP EP07392004A patent/EP1885006B1/de active Active
- 2007-07-30 DE DE602007003641T patent/DE602007003641D1/de active Active
- 2007-07-31 JP JP2007199432A patent/JP5346453B2/ja active Active
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2009
- 2009-09-01 US US12/584,190 patent/US8378330B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| DE602007003641D1 (de) | 2010-01-21 |
| JP2008034857A (ja) | 2008-02-14 |
| US20080023740A1 (en) | 2008-01-31 |
| JP5346453B2 (ja) | 2013-11-20 |
| US7595520B2 (en) | 2009-09-29 |
| US8378330B2 (en) | 2013-02-19 |
| EP1885006B1 (de) | 2009-12-09 |
| US20090325319A1 (en) | 2009-12-31 |
| EP1885006A1 (de) | 2008-02-06 |
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