ATE452421T1 - Plasmaverarbeitungsvorrichtung und plasmaverarbeitungsverfahren - Google Patents

Plasmaverarbeitungsvorrichtung und plasmaverarbeitungsverfahren

Info

Publication number
ATE452421T1
ATE452421T1 AT04745450T AT04745450T ATE452421T1 AT E452421 T1 ATE452421 T1 AT E452421T1 AT 04745450 T AT04745450 T AT 04745450T AT 04745450 T AT04745450 T AT 04745450T AT E452421 T1 ATE452421 T1 AT E452421T1
Authority
AT
Austria
Prior art keywords
plasma
plasma processing
processing
processing apparatus
processing target
Prior art date
Application number
AT04745450T
Other languages
English (en)
Inventor
Toshihisa Nozawa
Kiyotaka Ishibashi
Toshio Nakanishi
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of ATE452421T1 publication Critical patent/ATE452421T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32266—Means for controlling power transmitted to the plasma
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Plasma Technology (AREA)
  • Formation Of Insulating Films (AREA)
  • Physical Vapour Deposition (AREA)
AT04745450T 2003-05-29 2004-05-31 Plasmaverarbeitungsvorrichtung und plasmaverarbeitungsverfahren ATE452421T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003152808 2003-05-29
PCT/JP2004/007485 WO2004107430A1 (ja) 2003-05-29 2004-05-31 プラズマ処理装置およびプラズマ処理方法

Publications (1)

Publication Number Publication Date
ATE452421T1 true ATE452421T1 (de) 2010-01-15

Family

ID=33487270

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04745450T ATE452421T1 (de) 2003-05-29 2004-05-31 Plasmaverarbeitungsvorrichtung und plasmaverarbeitungsverfahren

Country Status (9)

Country Link
US (1) US20060156984A1 (de)
EP (1) EP1632994B1 (de)
JP (2) JP4615442B2 (de)
KR (2) KR100843018B1 (de)
CN (1) CN1799127B (de)
AT (1) ATE452421T1 (de)
DE (1) DE602004024675D1 (de)
TW (1) TW200511430A (de)
WO (1) WO2004107430A1 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4718189B2 (ja) * 2005-01-07 2011-07-06 東京エレクトロン株式会社 プラズマ処理方法
CN101053083B (zh) * 2005-02-01 2011-01-12 东京毅力科创株式会社 半导体装置的制造方法和等离子体氧化处理方法
JP4993938B2 (ja) * 2005-04-28 2012-08-08 株式会社半導体エネルギー研究所 半導体装置の作製方法
US8318554B2 (en) 2005-04-28 2012-11-27 Semiconductor Energy Laboratory Co., Ltd. Method of forming gate insulating film for thin film transistors using plasma oxidation
JP5183910B2 (ja) * 2005-11-23 2013-04-17 株式会社半導体エネルギー研究所 半導体素子の作製方法
US7625783B2 (en) 2005-11-23 2009-12-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and method for manufacturing the same
JP4578412B2 (ja) * 2006-01-20 2010-11-10 日本碍子株式会社 放電プラズマ発生方法
JP2007250569A (ja) * 2006-03-13 2007-09-27 Tokyo Electron Ltd プラズマ処理装置およびプラズマに曝される部材
JP2007273189A (ja) * 2006-03-30 2007-10-18 Tokyo Electron Ltd プラズマ処理装置，基板処理システムおよび電力切替方法
US7443175B2 (en) * 2006-07-14 2008-10-28 Covidien Ag Surgical testing instrument and system
US7914692B2 (en) 2006-08-29 2011-03-29 Ngk Insulators, Ltd. Methods of generating plasma, of etching an organic material film, of generating minus ions, of oxidation and nitriding
JP4864661B2 (ja) * 2006-11-22 2012-02-01 東京エレクトロン株式会社 太陽電池の製造方法及び太陽電池の製造装置
JP5138261B2 (ja) * 2007-03-30 2013-02-06 東京エレクトロン株式会社 シリコン酸化膜の形成方法、プラズマ処理装置および記憶媒体
JP2009088298A (ja) * 2007-09-29 2009-04-23 Tokyo Electron Ltd プラズマ処理装置及びプラズマ処理方法
KR101111494B1 (ko) * 2008-02-18 2012-02-23 미쯔이 죠센 가부시키가이샤 원자층 성장 장치 및 원자층 성장 방법
JP5357487B2 (ja) * 2008-09-30 2013-12-04 東京エレクトロン株式会社 シリコン酸化膜の形成方法、コンピュータ読み取り可能な記憶媒体およびプラズマ酸化処理装置
WO2010151337A1 (en) * 2009-06-26 2010-12-29 Tokyo Electron Limited Improving the adhesiveness of fluorocarbon(cfx) film by doping of amorphous carbon
JP5839804B2 (ja) 2011-01-25 2016-01-06 国立大学法人東北大学 半導体装置の製造方法、および半導体装置
TWI620227B (zh) * 2011-07-27 2018-04-01 日立全球先端科技股份有限公司 電漿處理裝置及電漿蝕刻方法
US9301383B2 (en) 2012-03-30 2016-03-29 Tokyo Electron Limited Low electron temperature, edge-density enhanced, surface wave plasma (SWP) processing method and apparatus
EP2880963A4 (de) * 2012-08-06 2015-08-12 Goji Ltd Verfahren zur erkennung von dunkelentladung und vorrichtung unter verwendung dieses verfahrens
JP5841917B2 (ja) * 2012-08-24 2016-01-13 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理方法
CN103035470B (zh) * 2012-12-14 2016-02-17 中微半导体设备(上海)有限公司 半导体刻蚀装置及半导体刻蚀方法
JP6861479B2 (ja) * 2016-06-24 2021-04-21 東京エレクトロン株式会社 プラズマ成膜方法およびプラズマ成膜装置
KR102217171B1 (ko) * 2018-07-30 2021-02-17 도쿄엘렉트론가부시키가이샤 성막 방법 및 성막 장치
JP2025085400A (ja) * 2023-11-24 2025-06-05 東京エレクトロン株式会社 基板処理装置

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2792558B2 (ja) * 1987-12-07 1998-09-03 株式会社日立製作所 表面処理装置および表面処理方法
JPH06314660A (ja) * 1993-03-04 1994-11-08 Mitsubishi Electric Corp 薄膜形成法及びその装置
US5770098A (en) * 1993-03-19 1998-06-23 Tokyo Electron Kabushiki Kaisha Etching process
JPH0955376A (ja) * 1995-08-15 1997-02-25 Sony Corp プラズマｃｖｄ方法
DE69736790T2 (de) * 1996-06-27 2007-08-16 Nissin Electric Co., Ltd. Mit einem Kohlenstofffilm beschichteter Gegenstand und Verfahren zu dessen Herstellung
JP3658922B2 (ja) * 1997-05-22 2005-06-15 松下電器産業株式会社 プラズマ処理方法及び装置
JP3405141B2 (ja) 1997-08-28 2003-05-12 松下電器産業株式会社 プラズマ処理方法及び装置
JP2000058292A (ja) * 1998-08-04 2000-02-25 Matsushita Electron Corp プラズマ処理装置及びプラズマ処理方法
KR100745495B1 (ko) * 1999-03-10 2007-08-03 동경 엘렉트론 주식회사 반도체 제조방법 및 반도체 제조장치
JP4255563B2 (ja) * 1999-04-05 2009-04-15 東京エレクトロン株式会社 半導体製造方法及び半導体製造装置
JP4258789B2 (ja) * 1999-03-17 2009-04-30 東京エレクトロン株式会社 ガス処理方法
JP2000306845A (ja) * 1999-04-19 2000-11-02 Tokyo Electron Ltd マグネトロンプラズマ処理装置および処理方法
JP2000306894A (ja) * 1999-04-23 2000-11-02 Nec Corp 基板のプラズマ処理方法
JP4819267B2 (ja) * 1999-08-17 2011-11-24 東京エレクトロン株式会社 パルスプラズマ処理方法および装置
CN101399198A (zh) * 2001-01-22 2009-04-01 东京毅力科创株式会社 电子器件材料的制造方法
EP1361606B1 (de) * 2001-01-25 2010-11-24 Tokyo Electron Limited Verfahren zur herstellung von elektronikbauteilmaterial
JP2003037105A (ja) * 2001-07-26 2003-02-07 Tokyo Electron Ltd プラズマ処理装置及び方法
WO2003015151A1 (fr) * 2001-08-02 2003-02-20 Tokyo Electron Limited Procede de traitement d'un materiau de base et materiau d'utlisation de dispositif electronique
JP4090225B2 (ja) * 2001-08-29 2008-05-28 東京エレクトロン株式会社 半導体装置の製造方法、及び、基板処理方法
JP3746968B2 (ja) * 2001-08-29 2006-02-22 東京エレクトロン株式会社 絶縁膜の形成方法および形成システム
JP4421150B2 (ja) * 2001-09-04 2010-02-24 パナソニック株式会社 絶縁膜の形成方法
US6756318B2 (en) * 2001-09-10 2004-06-29 Tegal Corporation Nanolayer thick film processing system and method
JP4147017B2 (ja) * 2001-10-19 2008-09-10 東京エレクトロン株式会社 マイクロ波プラズマ基板処理装置
KR100744590B1 (ko) * 2002-03-29 2007-08-01 동경 엘렉트론 주식회사 하지 절연막의 형성 방법 및 반도체 제조 장치
JP4001498B2 (ja) * 2002-03-29 2007-10-31 東京エレクトロン株式会社 絶縁膜の形成方法及び絶縁膜の形成システム
TWI225668B (en) * 2002-05-13 2004-12-21 Tokyo Electron Ltd Substrate processing method
JP4256340B2 (ja) * 2002-05-16 2009-04-22 東京エレクトロン株式会社 基板処理方法
EP1512165A2 (de) * 2002-06-12 2005-03-09 Applied Materials, Inc. Plasma-vorrichtung und verfahren zur behandlung eines substrats
US6660659B1 (en) * 2002-06-12 2003-12-09 Applied Materials, Inc. Plasma method and apparatus for processing a substrate
JP2004266075A (ja) * 2003-02-28 2004-09-24 Tokyo Electron Ltd 基板処理方法
JP4408653B2 (ja) * 2003-05-30 2010-02-03 東京エレクトロン株式会社 基板処理方法および半導体装置の製造方法
KR100956467B1 (ko) * 2004-03-03 2010-05-07 도쿄엘렉트론가부시키가이샤 플라즈마 처리 방법
CN101044626B (zh) * 2004-10-28 2012-01-25 东京毅力科创株式会社 栅极绝缘膜的形成方法、半导体装置和计算机记录介质
JP2006310736A (ja) * 2005-03-30 2006-11-09 Tokyo Electron Ltd ゲート絶縁膜の製造方法および半導体装置の製造方法
KR101028625B1 (ko) * 2005-03-31 2011-04-12 도쿄엘렉트론가부시키가이샤 기판의 질화 처리 방법 및 절연막의 형성 방법
JP4509864B2 (ja) * 2005-05-30 2010-07-21 東京エレクトロン株式会社 プラズマ処理方法およびプラズマ処理装置
EP1898456A4 (de) * 2005-06-08 2009-11-18 Univ Tohoku Plasmanitrierungsverfahren, verfahren zur herstellung eines halbleiterbauelements und plasmaverarbeitungsvorrichtung
WO2007034871A1 (ja) * 2005-09-22 2007-03-29 Tokyo Electron Limited 選択的プラズマ処理方法
CN101454881B (zh) * 2006-05-31 2012-09-05 东京毅力科创株式会社 绝缘膜的形成方法和半导体装置的制造方法
WO2007139142A1 (ja) * 2006-05-31 2007-12-06 Tokyo Electron Limited プラズマｃｖｄ方法、窒化珪素膜の形成方法、半導体装置の製造方法およびプラズマｃｖｄ装置
WO2008081724A1 (ja) * 2006-12-28 2008-07-10 Tokyo Electron Limited 絶縁膜の形成方法および半導体装置の製造方法
US8318614B2 (en) * 2007-03-26 2012-11-27 Tokyo Electron Limited Method for forming silicon nitride film, method for manufacturing nonvolatile semiconductor memory device, nonvolatile semiconductor memory device and plasma apparatus
US8968588B2 (en) * 2012-03-30 2015-03-03 Tokyo Electron Limited Low electron temperature microwave surface-wave plasma (SWP) processing method and apparatus

Also Published As

Publication number Publication date
EP1632994A4 (de) 2007-06-13
KR20060036053A (ko) 2006-04-27
CN1799127B (zh) 2012-06-27
DE602004024675D1 (de) 2010-01-28
KR100843018B1 (ko) 2008-07-01
JPWO2004107430A1 (ja) 2006-07-20
US20060156984A1 (en) 2006-07-20
CN1799127A (zh) 2006-07-05
JP2010192934A (ja) 2010-09-02
JP4615442B2 (ja) 2011-01-19
KR100921871B1 (ko) 2009-10-13
TW200511430A (en) 2005-03-16
KR20080015056A (ko) 2008-02-15
EP1632994A1 (de) 2006-03-08
TWI300248B (de) 2008-08-21
EP1632994B1 (de) 2009-12-16
JP5261436B2 (ja) 2013-08-14
WO2004107430A1 (ja) 2004-12-09

Similar Documents

Publication Publication Date Title
ATE452421T1 (de) Plasmaverarbeitungsvorrichtung und plasmaverarbeitungsverfahren
WO2010077018A3 (en) Laser firing apparatus for high efficiency solar cell and fabrication method thereof
ATE397511T1 (de) Verfahren und vorrichtung zum strahlungsunterstützten drehenden reibungsschweissen
WO2011100322A3 (en) Laser-driven light source
GB2450045A (en) Laser driven light source
EP2618366A3 (de) Ätzverfahren und Ätzvorrichtung
JP2014107363A5 (de)
SG152215A1 (en) Pulse train annealing method and apparatus
WO2010127932A3 (de) Verfahren zur erzeugung elektrischer energie sowie verwendung eines arbeitsmittels
RU2010135815A (ru) Способ эксплуатации блока генерирования озона
ATE518237T1 (de) Verfahren zum erkennen einer bogenentladung in einem plasmaprozess und bogenentladungserkennungsvorrichtung
TW200614368A (en) Plasma processing device amd method
MY155509A (en) Plasma temperature control apparatus and plasma temperature control method
IL175732A0 (en) Gas generation arrangement and method for generating gas and power source utilizing generated gas
TW200731879A (en) Plasma producing method and apparatus as well as plasma processing apparatus
TW200723338A (en) Method of operating ion source and ion implanting apparatus
WO2004045815A3 (en) Apparatus and method for the heat treatment of lignocellulosic material
TW200644733A (en) Apparatus, system and method capable of enhancing lamp ignition
WO2009009272A3 (en) Conformal doping using high neutral plasma implant
WO2009104919A3 (en) Apparatus and method for processing substrate
TW200710251A (en) Sputtering apparatus and sputtering method
TW200636740A (en) Apparatus for generating internal voltage
TW200701346A (en) Plasma processing apparatus
WO2009120000A3 (en) Substrate processing apparatus and method
TW200512308A (en) Method and apparatus for treating sputtering target to reduce burn-in time

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties