ATE453310T1 - Verfahren zur herstellung musterbildender metallstrukturen auf einem trägersubstrat - Google Patents

Verfahren zur herstellung musterbildender metallstrukturen auf einem trägersubstrat

Info

Publication number
ATE453310T1
ATE453310T1 AT06776606T AT06776606T ATE453310T1 AT E453310 T1 ATE453310 T1 AT E453310T1 AT 06776606 T AT06776606 T AT 06776606T AT 06776606 T AT06776606 T AT 06776606T AT E453310 T1 ATE453310 T1 AT E453310T1
Authority
AT
Austria
Prior art keywords
carrier substrate
metal structures
pattern
forming metal
support substrate
Prior art date
Application number
AT06776606T
Other languages
English (en)
Inventor
Franz Kohnle
Michael Guggemos
Matthias Dammasch
Wolfgang Ptak
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Application granted granted Critical
Publication of ATE453310T1 publication Critical patent/ATE453310T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/073—Displacement plating, substitution plating or immersion plating, e.g. for finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Aerials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
AT06776606T 2005-08-09 2006-08-04 Verfahren zur herstellung musterbildender metallstrukturen auf einem trägersubstrat ATE453310T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005038392A DE102005038392B4 (de) 2005-08-09 2005-08-09 Verfahren zum Herstellen von Muster bildenden Kupferstrukturen auf einem Trägersubstrat
PCT/EP2006/007734 WO2007017192A1 (en) 2005-08-09 2006-08-04 Method of manufacturing pattern-forming metal structures on a carrier substrate

Publications (1)

Publication Number Publication Date
ATE453310T1 true ATE453310T1 (de) 2010-01-15

Family

ID=37307595

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06776606T ATE453310T1 (de) 2005-08-09 2006-08-04 Verfahren zur herstellung musterbildender metallstrukturen auf einem trägersubstrat

Country Status (13)

Country Link
US (1) US8202567B2 (de)
EP (1) EP1913801B1 (de)
JP (1) JP4802244B2 (de)
KR (1) KR101225383B1 (de)
CN (1) CN101243735B (de)
AT (1) ATE453310T1 (de)
BR (1) BRPI0614296A2 (de)
DE (2) DE102005038392B4 (de)
ES (1) ES2335693T3 (de)
MY (1) MY143624A (de)
PL (1) PL1913801T3 (de)
TW (1) TWI415534B (de)
WO (1) WO2007017192A1 (de)

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US8786510B2 (en) 2006-01-24 2014-07-22 Avery Dennison Corporation Radio frequency (RF) antenna containing element and methods of making the same
DE102008035522A1 (de) * 2008-07-30 2010-02-04 Mühlbauer Ag Verfahren zur Herstellung einer Vorrichtung zur drahtlosen Kommunikation bzw. eines Prelaminats für eine solche Vorrichtung
EP2580715B1 (de) 2010-06-14 2019-05-22 Avery Dennison Corporation Verfahren, system und vorrichtung zur herstellung von kurzfristigen rfid etiketten
TW201249275A (en) * 2011-05-16 2012-12-01 Jieng Tai Internat Electric Corp Method for forming component-mounting device with antenna
FI125720B (fi) 2011-05-19 2016-01-29 Tecnomar Oy Rullalta rullalle -massavalmistukseen soveltuva sähköisten siltojen valmistusmenetelmä
CN102790259A (zh) * 2011-05-20 2012-11-21 晶钛国际电子股份有限公司 形成具有天线的载件的方法
CN102880898A (zh) * 2011-07-13 2013-01-16 上海铁勋智能识别系统有限公司 一种覆盖uhf全频段、自由空间和金属表面共用的超高频电子标签
CA2977858A1 (en) * 2015-02-26 2016-09-01 Dynamic Solar Systems Ag Room temperature method for the production of electrotechnical thin layers, the use of same, and a thin layer heating system obtained in this manner
EP3262673B1 (de) 2015-02-26 2025-10-01 Dynamic Solar Systems AG Raumtemperatur-verfahren zur herstellung einer pv-schichtfolge
US12163039B2 (en) 2015-02-26 2024-12-10 Dynamic Solar Systems Ag Room temperature method for the production of inorganic electrotechnical thin layers and a thin layer heating system obtained in this manner
JP2018512267A (ja) 2015-02-26 2018-05-17 ダイナミック ソーラー システムズ アクツィエンゲゼルシャフトＤｙｎａｍｉｃ Ｓｏｌａｒ Ｓｙｓｔｅｍｓ Ａｇ 室温における電気工学的薄層の製造方法、および電気工学的薄層
US10846494B2 (en) 2019-01-03 2020-11-24 The Boeing Company Radio-frequency identification device for indicating a temperature history of a composite structure

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Also Published As

Publication number Publication date
TWI415534B (zh) 2013-11-11
DE102005038392B4 (de) 2008-07-10
US8202567B2 (en) 2012-06-19
JP2009505383A (ja) 2009-02-05
DE102005038392A1 (de) 2007-03-15
KR20080033385A (ko) 2008-04-16
EP1913801A1 (de) 2008-04-23
DE602006011335D1 (de) 2010-02-04
TW200726349A (en) 2007-07-01
EP1913801B1 (de) 2009-12-23
WO2007017192A1 (en) 2007-02-15
JP4802244B2 (ja) 2011-10-26
CN101243735B (zh) 2012-09-26
PL1913801T3 (pl) 2010-06-30
ES2335693T3 (es) 2010-03-31
MY143624A (en) 2011-06-15
US20100136252A1 (en) 2010-06-03
BRPI0614296A2 (pt) 2011-03-22
CN101243735A (zh) 2008-08-13
KR101225383B1 (ko) 2013-01-22

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