ATE469463T1 - Piezoelektrische elektronische komponente - Google Patents
Piezoelektrische elektronische komponenteInfo
- Publication number
- ATE469463T1 ATE469463T1 AT04726261T AT04726261T ATE469463T1 AT E469463 T1 ATE469463 T1 AT E469463T1 AT 04726261 T AT04726261 T AT 04726261T AT 04726261 T AT04726261 T AT 04726261T AT E469463 T1 ATE469463 T1 AT E469463T1
- Authority
- AT
- Austria
- Prior art keywords
- piezoelectric element
- pad
- electronic component
- shell member
- piezoelectric
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 2
- 230000001413 cellular effect Effects 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 230000010355 oscillation Effects 0.000 abstract 1
- 230000009467 reduction Effects 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02133—Means for compensation or elimination of undesirable effects of stress
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0504—Holders or supports for bulk acoustic wave devices
- H03H9/0514—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps
- H03H9/0523—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps for flip-chip mounting
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/105—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/174—Membranes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/58—Multiple crystal filters
- H03H9/582—Multiple crystal filters implemented with thin-film techniques
- H03H9/586—Means for mounting to a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/588—Membranes
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003147096 | 2003-05-26 | ||
| PCT/JP2004/004992 WO2004105237A1 (ja) | 2003-05-26 | 2004-04-07 | 圧電電子部品、およびその製造方法、通信機 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE469463T1 true ATE469463T1 (de) | 2010-06-15 |
Family
ID=33475356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT04726261T ATE469463T1 (de) | 2003-05-26 | 2004-04-07 | Piezoelektrische elektronische komponente |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US7342351B2 (de) |
| EP (1) | EP1628396B1 (de) |
| JP (1) | JP4229122B2 (de) |
| KR (1) | KR100725010B1 (de) |
| CN (1) | CN1795610B (de) |
| AT (1) | ATE469463T1 (de) |
| DE (1) | DE602004027372D1 (de) |
| WO (1) | WO2004105237A1 (de) |
Families Citing this family (97)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4535778B2 (ja) * | 2004-05-26 | 2010-09-01 | 京セラ株式会社 | デバイス装置の製造方法 |
| JP4544965B2 (ja) * | 2004-10-27 | 2010-09-15 | 京セラ株式会社 | 弾性表面波装置およびその製造方法ならびにその弾性表面波装置を備えた通信装置 |
| DE102005044330A1 (de) * | 2005-09-16 | 2007-03-29 | Epcos Ag | Abstimmbarer Kondensator und Schaltung mit einem solchen Kondensator |
| JP4585419B2 (ja) * | 2005-10-04 | 2010-11-24 | 富士通メディアデバイス株式会社 | 弾性表面波デバイスおよびその製造方法 |
| JP5343301B2 (ja) * | 2005-11-28 | 2013-11-13 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| JP4791181B2 (ja) * | 2005-12-28 | 2011-10-12 | 京セラ株式会社 | 薄膜バルク音響波共振子、それを備えるフィルタおよび通信装置ならびに薄膜バルク音響波共振子の製造方法 |
| JP2007221665A (ja) * | 2006-02-20 | 2007-08-30 | Toshiba Corp | 薄膜圧電共振器及びその製造方法、並びに、これを用いたフィルタ |
| JP2007222956A (ja) * | 2006-02-21 | 2007-09-06 | Seiko Epson Corp | Memsデバイスおよびmemsデバイスの製造方法 |
| JP2007281902A (ja) * | 2006-04-07 | 2007-10-25 | Hitachi Media Electoronics Co Ltd | 立体配線を有する中空構造ウェハレベルパッケージ |
| WO2007125724A1 (ja) * | 2006-04-28 | 2007-11-08 | Murata Manufacturing Co., Ltd. | 電子部品及びその製造方法 |
| US7760049B2 (en) * | 2006-05-30 | 2010-07-20 | Panasonic Corporation | Film bulk acoustic resonator, filter, and fabrication method thereof |
| WO2008084578A1 (ja) * | 2006-12-25 | 2008-07-17 | Murata Manufacturing Co., Ltd. | 圧電薄膜共振子 |
| US7736929B1 (en) | 2007-03-09 | 2010-06-15 | Silicon Clocks, Inc. | Thin film microshells incorporating a getter layer |
| US7923790B1 (en) | 2007-03-09 | 2011-04-12 | Silicon Laboratories Inc. | Planar microshells for vacuum encapsulated devices and damascene method of manufacture |
| US7659150B1 (en) | 2007-03-09 | 2010-02-09 | Silicon Clocks, Inc. | Microshells for multi-level vacuum cavities |
| US7595209B1 (en) * | 2007-03-09 | 2009-09-29 | Silicon Clocks, Inc. | Low stress thin film microshells |
| US7851333B2 (en) * | 2007-03-15 | 2010-12-14 | Infineon Technologies Ag | Apparatus comprising a device and method for producing it |
| JP4961260B2 (ja) * | 2007-05-16 | 2012-06-27 | 株式会社日立製作所 | 半導体装置 |
| JP5080858B2 (ja) * | 2007-05-17 | 2012-11-21 | 太陽誘電株式会社 | 圧電薄膜共振器およびフィルタ |
| JP4324811B2 (ja) * | 2007-06-28 | 2009-09-02 | エプソントヨコム株式会社 | 圧電振動子及びその製造方法 |
| US8193685B2 (en) * | 2007-07-03 | 2012-06-05 | Koninklijke Philips Electronics N.V. | Thin film detector for presence detection |
| US8159056B1 (en) | 2008-01-15 | 2012-04-17 | Rf Micro Devices, Inc. | Package for an electronic device |
| TW200937737A (en) * | 2008-02-21 | 2009-09-01 | En-Yi Chang | Flexible electro-acoustic actuator having the antenna structure |
| US7999635B1 (en) | 2008-07-29 | 2011-08-16 | Silicon Laboratories Inc. | Out-of plane MEMS resonator with static out-of-plane deflection |
| JP2010091467A (ja) * | 2008-10-09 | 2010-04-22 | Rohm Co Ltd | 圧力センサおよび圧力センサの製造方法 |
| US8030823B2 (en) * | 2009-01-26 | 2011-10-04 | Resonance Semiconductor Corporation | Protected resonator |
| US9735338B2 (en) | 2009-01-26 | 2017-08-15 | Cymatics Laboratories Corp. | Protected resonator |
| CN102334290B (zh) * | 2009-03-04 | 2014-09-17 | 株式会社村田制作所 | 表面声波元件及其制造方法 |
| JP5419617B2 (ja) | 2009-09-28 | 2014-02-19 | 太陽誘電株式会社 | フィルタ、通信モジュール、および通信装置 |
| JP5724168B2 (ja) * | 2009-10-21 | 2015-05-27 | 株式会社リコー | 電気−機械変換素子とその製造方法、及び電気−機械変換素子を有する液滴吐出ヘッド、液滴吐出ヘッドを有する液滴吐出装置 |
| KR101286768B1 (ko) * | 2009-12-08 | 2013-07-16 | 한국전자통신연구원 | 압전형 스피커 및 그 제조 방법 |
| JP5213887B2 (ja) * | 2010-02-22 | 2013-06-19 | 京セラ株式会社 | 弾性表面波素子 |
| KR101141353B1 (ko) * | 2010-04-16 | 2012-05-03 | 삼성전기주식회사 | 잉크젯 헤드 어셈블리 및 그 제조방법 |
| JP5540911B2 (ja) | 2010-06-09 | 2014-07-02 | 三菱電機株式会社 | 半導体装置 |
| JP2012043844A (ja) * | 2010-08-13 | 2012-03-01 | Ngk Insulators Ltd | 圧電/電歪アクチュエータ |
| US8836449B2 (en) * | 2010-08-27 | 2014-09-16 | Wei Pang | Vertically integrated module in a wafer level package |
| US8367305B1 (en) | 2010-09-17 | 2013-02-05 | Sandia Corporation | Method for fabricating a microelectromechanical resonator |
| DE102010056562B4 (de) | 2010-12-30 | 2018-10-11 | Snaptrack, Inc. | Elektroakustisches Bauelement und Verfahren zur Herstellung des elektroakustischen Bauelements |
| TWI418004B (zh) * | 2010-12-31 | 2013-12-01 | 原相科技股份有限公司 | 晶片封裝結構以及晶片封裝製程 |
| CN102593085B (zh) * | 2011-01-10 | 2014-08-13 | 原相科技股份有限公司 | 芯片封装结构以及芯片封装制程 |
| JP2012148428A (ja) * | 2011-01-17 | 2012-08-09 | Toshiba Tec Corp | インクジェットヘッドの製造方法 |
| US8497747B1 (en) | 2011-03-02 | 2013-07-30 | Sandia Corporation | Microelectromechanical filter formed from parallel-connected lattice networks of contour-mode resonators |
| US8704428B2 (en) * | 2011-04-20 | 2014-04-22 | Qualcomm Mems Technologies, Inc. | Widening resonator bandwidth using mechanical loading |
| US8471641B2 (en) | 2011-06-30 | 2013-06-25 | Silicon Laboratories Inc. | Switchable electrode for power handling |
| US20130106875A1 (en) * | 2011-11-02 | 2013-05-02 | Qualcomm Mems Technologies, Inc. | Method of improving thin-film encapsulation for an electromechanical systems assembly |
| JP5813471B2 (ja) * | 2011-11-11 | 2015-11-17 | 株式会社東芝 | Mems素子 |
| JP2013214954A (ja) * | 2012-03-07 | 2013-10-17 | Taiyo Yuden Co Ltd | 共振子、周波数フィルタ、デュプレクサ、電子機器及び共振子の製造方法 |
| JP6092535B2 (ja) * | 2012-07-04 | 2017-03-08 | 太陽誘電株式会社 | ラム波デバイスおよびその製造方法 |
| DE102013102217B4 (de) | 2013-03-06 | 2015-11-12 | Epcos Ag | Mikroakustisches Bauelement und Verfahren zur Herstellung |
| DE102013102213B4 (de) * | 2013-03-06 | 2020-01-02 | Snaptrack, Inc. | Miniaturisiertes Bauelement mit Dünnschichtabdeckung und Verfahren zur Herstellung |
| CN103532510B (zh) * | 2013-10-23 | 2016-08-17 | 无锡华普微电子有限公司 | 一种saw器件的腐蚀工艺 |
| US9970831B2 (en) * | 2014-02-10 | 2018-05-15 | Texas Instruments Incorporated | Piezoelectric thin-film sensor |
| US9805966B2 (en) * | 2014-07-25 | 2017-10-31 | Akoustis, Inc. | Wafer scale packaging |
| US9422149B2 (en) | 2014-07-25 | 2016-08-23 | Semiconductor Manufacturing International (Shanghai) Corporation | Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulation |
| JP6451744B2 (ja) * | 2014-10-29 | 2019-01-16 | 株式会社村田製作所 | 圧電モジュール |
| US10333494B2 (en) | 2014-12-24 | 2019-06-25 | Qorvo Us, Inc. | Simplified acoustic RF resonator parallel capacitance compensation |
| US10353503B2 (en) | 2015-10-29 | 2019-07-16 | Texas Instruments Incorporated | Integrated force sensing element |
| US10069474B2 (en) * | 2015-11-17 | 2018-09-04 | Qualcomm Incorporated | Encapsulation of acoustic resonator devices |
| JP6489234B2 (ja) * | 2015-12-02 | 2019-03-27 | 株式会社村田製作所 | 圧電素子、圧電マイクロフォン、圧電共振子及び圧電素子の製造方法 |
| US10581156B2 (en) | 2016-05-04 | 2020-03-03 | Qorvo Us, Inc. | Compensation circuit to mitigate antenna-to-antenna coupling |
| US10581403B2 (en) | 2016-07-11 | 2020-03-03 | Qorvo Us, Inc. | Device having a titanium-alloyed surface |
| US20180019723A1 (en) * | 2016-07-14 | 2018-01-18 | Samsung Electro-Mechanics Co., Ltd. | Bulk acoustic wave filter device |
| US11050412B2 (en) | 2016-09-09 | 2021-06-29 | Qorvo Us, Inc. | Acoustic filter using acoustic coupling |
| US10284174B2 (en) | 2016-09-15 | 2019-05-07 | Qorvo Us, Inc. | Acoustic filter employing inductive coupling |
| CN106441439A (zh) * | 2016-10-18 | 2017-02-22 | 合肥浮点信息科技有限公司 | 一种便于携带并具有监测显示功能的集成电子产品 |
| US10367470B2 (en) | 2016-10-19 | 2019-07-30 | Qorvo Us, Inc. | Wafer-level-packaged BAW devices with surface mount connection structures |
| US11165413B2 (en) | 2017-01-30 | 2021-11-02 | Qorvo Us, Inc. | Coupled resonator structure |
| US11165412B2 (en) | 2017-01-30 | 2021-11-02 | Qorvo Us, Inc. | Zero-output coupled resonator filter and related radio frequency filter circuit |
| US11558031B2 (en) | 2017-03-08 | 2023-01-17 | Samsung Electro-Mechanics Co., Ltd. | Film bulk acoustic resonator and method of manufacturing the same |
| KR102313290B1 (ko) | 2017-03-08 | 2021-10-18 | 삼성전기주식회사 | 박막 벌크 음향 공진기 및 그의 제조 방법 |
| KR101942734B1 (ko) * | 2017-05-18 | 2019-01-28 | 삼성전기 주식회사 | 체적 음향 공진기 |
| JP6909059B2 (ja) * | 2017-06-07 | 2021-07-28 | 太陽誘電株式会社 | 圧電薄膜共振器、フィルタおよびマルチプレクサ |
| US10873318B2 (en) | 2017-06-08 | 2020-12-22 | Qorvo Us, Inc. | Filter circuits having acoustic wave resonators in a transversal configuration |
| US10594298B2 (en) * | 2017-06-19 | 2020-03-17 | Rfhic Corporation | Bulk acoustic wave filter |
| US10361676B2 (en) * | 2017-09-29 | 2019-07-23 | Qorvo Us, Inc. | Baw filter structure with internal electrostatic shielding |
| JP2019165332A (ja) * | 2018-03-19 | 2019-09-26 | 株式会社リコー | 電子デバイスおよび原子発振器 |
| US11152913B2 (en) | 2018-03-28 | 2021-10-19 | Qorvo Us, Inc. | Bulk acoustic wave (BAW) resonator |
| KR20200011141A (ko) * | 2018-07-24 | 2020-02-03 | 삼성전기주식회사 | 체적 음향 공진기 |
| DE102018118701B3 (de) | 2018-08-01 | 2019-10-17 | RF360 Europe GmbH | BAW-Resonator mit verbesserter Verbindung der oberen Elektrode |
| KR20200017739A (ko) * | 2018-08-09 | 2020-02-19 | 삼성전기주식회사 | 체적 음향 공진기 |
| US11146247B2 (en) | 2019-07-25 | 2021-10-12 | Qorvo Us, Inc. | Stacked crystal filter structures |
| WO2021059581A1 (ja) * | 2019-09-26 | 2021-04-01 | 株式会社村田製作所 | 圧電振動子及びその製造方法 |
| US11757430B2 (en) | 2020-01-07 | 2023-09-12 | Qorvo Us, Inc. | Acoustic filter circuit for noise suppression outside resonance frequency |
| US11146246B2 (en) | 2020-01-13 | 2021-10-12 | Qorvo Us, Inc. | Phase shift structures for acoustic resonators |
| US11146245B2 (en) | 2020-01-13 | 2021-10-12 | Qorvo Us, Inc. | Mode suppression in acoustic resonators |
| CN113411064A (zh) * | 2020-03-17 | 2021-09-17 | 济南晶正电子科技有限公司 | 一种薄膜体声波器件及其制备方法 |
| CN117254781A (zh) * | 2020-04-29 | 2023-12-19 | 株式会社村田制作所 | 弹性波器件和梯形滤波器 |
| JP7517012B2 (ja) | 2020-09-16 | 2024-07-17 | セイコーエプソン株式会社 | 超音波デバイス |
| US11632097B2 (en) | 2020-11-04 | 2023-04-18 | Qorvo Us, Inc. | Coupled resonator filter device |
| US12009801B2 (en) * | 2020-11-27 | 2024-06-11 | Seiko Epson Corporation | Resonator device |
| US11575363B2 (en) | 2021-01-19 | 2023-02-07 | Qorvo Us, Inc. | Hybrid bulk acoustic wave filter |
| WO2022209860A1 (ja) | 2021-03-31 | 2022-10-06 | 株式会社村田製作所 | 弾性波装置 |
| CN115603693A (zh) * | 2021-07-08 | 2023-01-13 | 联华电子股份有限公司(Tw) | 表面声波元件及其制作方法 |
| US12170515B2 (en) | 2022-01-31 | 2024-12-17 | Qorvo Us, Inc. | Reversed semilattice filter |
| TWI847124B (zh) * | 2022-04-19 | 2024-07-01 | 瑞峰半導體股份有限公司 | 聲波元件 |
| WO2023223906A1 (ja) * | 2022-05-16 | 2023-11-23 | 株式会社村田製作所 | 弾性波素子 |
| US12587172B2 (en) | 2023-03-15 | 2026-03-24 | Qorvo Us, Inc. | Pin reconfigurable baw filters |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US724133A (en) * | 1902-01-02 | 1903-03-31 | Smith Warren Company | Metallic window frame and sash. |
| JPS58175314A (ja) * | 1982-03-11 | 1983-10-14 | Nec Corp | 薄膜圧電振動子 |
| JPH07114340B2 (ja) | 1987-01-19 | 1995-12-06 | 株式会社東芝 | 圧電薄膜共振子 |
| JPH01179514A (ja) | 1988-01-11 | 1989-07-17 | Toyo Commun Equip Co Ltd | 発振回路の構成部品を内蔵した圧電共振子 |
| US5177661A (en) * | 1989-01-13 | 1993-01-05 | Kopin Corporation | SOI diaphgram sensor |
| JPH0497612A (ja) | 1990-08-15 | 1992-03-30 | Hitachi Ltd | 弾性表面波素子及びその実装方法 |
| JPH0527565A (ja) | 1991-07-18 | 1993-02-05 | Canon Inc | ランプ光量制御装置 |
| US5313535A (en) * | 1992-02-27 | 1994-05-17 | Nynex Corporation | Optical path length modulator |
| JPH05267975A (ja) | 1992-03-19 | 1993-10-15 | Nec Corp | 弾性表面波装置およびその製造方法 |
| KR0171921B1 (ko) * | 1993-09-13 | 1999-03-30 | 모리시타 요이찌 | 전자부품과 그 제조방법 |
| JP3582106B2 (ja) * | 1994-08-31 | 2004-10-27 | 松下電器産業株式会社 | 電子部品の製造方法 |
| JP3239695B2 (ja) * | 1995-07-17 | 2001-12-17 | 株式会社村田製作所 | 電子部品 |
| JPH09107263A (ja) | 1995-10-09 | 1997-04-22 | Matsushita Electric Ind Co Ltd | 電子部品 |
| JP3487414B2 (ja) | 1998-05-29 | 2004-01-19 | 富士通株式会社 | 弾性表面波フィルタ装置 |
| JP3511929B2 (ja) * | 1999-01-25 | 2004-03-29 | 株式会社村田製作所 | 電子部品の製造方法、圧電共振部品の製造方法、電子部品及び圧電共振部品 |
| JP2001111371A (ja) * | 1999-08-03 | 2001-04-20 | Ngk Spark Plug Co Ltd | ラダー型圧電セラミックフィルタの製造方法 |
| US7008812B1 (en) * | 2000-05-30 | 2006-03-07 | Ic Mechanics, Inc. | Manufacture of MEMS structures in sealed cavity using dry-release MEMS device encapsulation |
| JP4404450B2 (ja) * | 2000-06-30 | 2010-01-27 | 京セラ株式会社 | 弾性表面波装置及びその製造方法 |
| US6703768B2 (en) * | 2000-09-27 | 2004-03-09 | Citizen Watch Co., Ltd. | Piezoelectric generator and mounting structure therefor |
| JP2002261582A (ja) | 2000-10-04 | 2002-09-13 | Matsushita Electric Ind Co Ltd | 弾性表面波デバイスおよびその製造方法ならびにそれを用いた回路モジュール |
| US6550664B2 (en) | 2000-12-09 | 2003-04-22 | Agilent Technologies, Inc. | Mounting film bulk acoustic resonators in microwave packages using flip chip bonding technology |
| JP2003037473A (ja) | 2001-07-24 | 2003-02-07 | Toshiba Corp | 弾性表面波装置及びその製造方法 |
| JP2003101376A (ja) | 2001-09-25 | 2003-04-04 | Tdk Corp | 共振デバイス、共振フィルタ、デュプレクサならびにこれらの特性調整方法 |
| JP2004248243A (ja) * | 2002-12-19 | 2004-09-02 | Murata Mfg Co Ltd | 電子部品およびその製造方法 |
| JP2004222244A (ja) * | 2002-12-27 | 2004-08-05 | Toshiba Corp | 薄膜圧電共振器およびその製造方法 |
| GB2431512B (en) * | 2004-06-25 | 2008-05-21 | Murata Manufacturing Co | Piezoelectric device |
| US7248133B2 (en) * | 2004-06-28 | 2007-07-24 | Kyocera Corporation | Method for manufacturing surface acoustic wave device |
| JP2006197554A (ja) * | 2004-12-17 | 2006-07-27 | Seiko Epson Corp | 弾性表面波デバイス及びその製造方法、icカード、携帯用電子機器 |
-
2004
- 2004-04-07 WO PCT/JP2004/004992 patent/WO2004105237A1/ja not_active Ceased
- 2004-04-07 EP EP20040726261 patent/EP1628396B1/de not_active Expired - Lifetime
- 2004-04-07 KR KR20057022383A patent/KR100725010B1/ko not_active Expired - Fee Related
- 2004-04-07 AT AT04726261T patent/ATE469463T1/de not_active IP Right Cessation
- 2004-04-07 DE DE200460027372 patent/DE602004027372D1/de not_active Expired - Lifetime
- 2004-04-07 CN CN200480014533XA patent/CN1795610B/zh not_active Expired - Fee Related
- 2004-04-07 JP JP2005506311A patent/JP4229122B2/ja not_active Expired - Fee Related
- 2004-04-07 US US10/558,592 patent/US7342351B2/en not_active Expired - Fee Related
-
2007
- 2007-12-14 US US11/956,699 patent/US8123966B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US7342351B2 (en) | 2008-03-11 |
| EP1628396A1 (de) | 2006-02-22 |
| US8123966B2 (en) | 2012-02-28 |
| DE602004027372D1 (de) | 2010-07-08 |
| JP4229122B2 (ja) | 2009-02-25 |
| EP1628396A4 (de) | 2009-01-07 |
| WO2004105237A1 (ja) | 2004-12-02 |
| CN1795610A (zh) | 2006-06-28 |
| EP1628396B1 (de) | 2010-05-26 |
| JPWO2004105237A1 (ja) | 2006-07-20 |
| US20080099428A1 (en) | 2008-05-01 |
| KR100725010B1 (ko) | 2007-06-04 |
| KR20060013678A (ko) | 2006-02-13 |
| US20070013268A1 (en) | 2007-01-18 |
| CN1795610B (zh) | 2011-11-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ATE469463T1 (de) | Piezoelektrische elektronische komponente | |
| ATE510252T1 (de) | Verbesserte einrichtungsschnittstelle | |
| ATE520141T1 (de) | Elektronische vorrichtung und impedanzanpassungsverfahren dafür | |
| WO2007009465A3 (en) | Programmable microphone | |
| WO2004055828A3 (en) | Memory and access devices | |
| WO2001067602A3 (en) | Electronic switch | |
| WO2006096748A3 (en) | Bootstrapping circuit capable of sampling inputs beyond supply voltage | |
| TW200644417A (en) | Low-voltage MEMS oscillator | |
| MY128184A (en) | Pulse output circuit, shift register, and display device | |
| ATE419576T1 (de) | Zeigeeinrichtung | |
| WO2005046108A3 (en) | Acoustic wave device with digital data transmission functionality | |
| WO2004062238A3 (en) | Method and apparatus of alerting a user of a mobile electronic device | |
| US9337883B1 (en) | Protection case for mobile communication device | |
| WO2003103018A3 (en) | Portable electronic apparatus | |
| WO2004017036A3 (en) | Pressure measurement device including a capacitive pressure sensor in an amplifier feedback path | |
| DE50305801D1 (de) | Oszillatoranordnung für frequenzmodulation | |
| WO2002101927A3 (en) | A circuit to charge a capacitor | |
| DE60229368D1 (de) | Verstärker-mischerschaltung | |
| DK1361660T3 (da) | Elektronisk strömkreds med mindst en indgang til udvælgelse af en tilstand af den elektroniske strömkreds | |
| DK0858844T3 (da) | Lydhoved | |
| DE50310754D1 (de) | Elektronische schaltungsanordnung mit integrierter antenne | |
| ATE436085T1 (de) | Selbstspeisendes schaltbauelement | |
| EP1588374A4 (de) | Floating-gate-analogspannungsrückkopplungsschaltung | |
| CN104865822A (zh) | 一种可动态进行超声波驱蚊的腕表结构 | |
| ATE528909T1 (de) | Tragbares elektronisches gerät mit erweiterbarem schallkanal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |