ATE469463T1 - Piezoelektrische elektronische komponente - Google Patents

Piezoelektrische elektronische komponente

Info

Publication number
ATE469463T1
ATE469463T1 AT04726261T AT04726261T ATE469463T1 AT E469463 T1 ATE469463 T1 AT E469463T1 AT 04726261 T AT04726261 T AT 04726261T AT 04726261 T AT04726261 T AT 04726261T AT E469463 T1 ATE469463 T1 AT E469463T1
Authority
AT
Austria
Prior art keywords
piezoelectric element
pad
electronic component
shell member
piezoelectric
Prior art date
Application number
AT04726261T
Other languages
English (en)
Inventor
Ryuichi Kubo
Hidetoshi Fujii
Naoko Aizawa
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Application granted granted Critical
Publication of ATE469463T1 publication Critical patent/ATE469463T1/de

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02007Details of bulk acoustic wave devices
    • H03H9/02086Means for compensation or elimination of undesirable effects
    • H03H9/02133Means for compensation or elimination of undesirable effects of stress
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders or supports
    • H03H9/0504Holders or supports for bulk acoustic wave devices
    • H03H9/0514Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps
    • H03H9/0523Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps for flip-chip mounting
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders or supports
    • H03H9/10Mounting in enclosures
    • H03H9/1007Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/105Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the BAW device
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders or supports
    • H03H9/10Mounting in enclosures
    • H03H9/1064Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H03H9/174Membranes
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46Filters
    • H03H9/54Filters comprising resonators of piezoelectric or electrostrictive material
    • H03H9/58Multiple crystal filters
    • H03H9/582Multiple crystal filters implemented with thin-film techniques
    • H03H9/586Means for mounting to a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H03H9/588Membranes

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
AT04726261T 2003-05-26 2004-04-07 Piezoelektrische elektronische komponente ATE469463T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003147096 2003-05-26
PCT/JP2004/004992 WO2004105237A1 (ja) 2003-05-26 2004-04-07 圧電電子部品、およびその製造方法、通信機

Publications (1)

Publication Number Publication Date
ATE469463T1 true ATE469463T1 (de) 2010-06-15

Family

ID=33475356

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04726261T ATE469463T1 (de) 2003-05-26 2004-04-07 Piezoelektrische elektronische komponente

Country Status (8)

Country Link
US (2) US7342351B2 (de)
EP (1) EP1628396B1 (de)
JP (1) JP4229122B2 (de)
KR (1) KR100725010B1 (de)
CN (1) CN1795610B (de)
AT (1) ATE469463T1 (de)
DE (1) DE602004027372D1 (de)
WO (1) WO2004105237A1 (de)

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US7342351B2 (en) 2008-03-11
EP1628396A1 (de) 2006-02-22
US8123966B2 (en) 2012-02-28
DE602004027372D1 (de) 2010-07-08
JP4229122B2 (ja) 2009-02-25
EP1628396A4 (de) 2009-01-07
WO2004105237A1 (ja) 2004-12-02
CN1795610A (zh) 2006-06-28
EP1628396B1 (de) 2010-05-26
JPWO2004105237A1 (ja) 2006-07-20
US20080099428A1 (en) 2008-05-01
KR100725010B1 (ko) 2007-06-04
KR20060013678A (ko) 2006-02-13
US20070013268A1 (en) 2007-01-18
CN1795610B (zh) 2011-11-16

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