ATE470235T1 - Belichtungsgeräte, belichtungsverfahren und bauelemente-herstellungsverfahren - Google Patents
Belichtungsgeräte, belichtungsverfahren und bauelemente-herstellungsverfahrenInfo
- Publication number
- ATE470235T1 ATE470235T1 AT05767342T AT05767342T ATE470235T1 AT E470235 T1 ATE470235 T1 AT E470235T1 AT 05767342 T AT05767342 T AT 05767342T AT 05767342 T AT05767342 T AT 05767342T AT E470235 T1 ATE470235 T1 AT E470235T1
- Authority
- AT
- Austria
- Prior art keywords
- exposure
- processes
- liquid immersion
- optical system
- projection optical
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/706843—Metrology apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
- G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Toxicology (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Liquid Crystal Substances (AREA)
- Prostheses (AREA)
- Exposure Control For Cameras (AREA)
- Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
- Eyeglasses (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004227226 | 2004-08-03 | ||
| JP2005079113 | 2005-03-18 | ||
| PCT/JP2005/014011 WO2006013806A1 (ja) | 2004-08-03 | 2005-08-01 | 露光装置、露光方法及びデバイス製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE470235T1 true ATE470235T1 (de) | 2010-06-15 |
Family
ID=35787091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT05767342T ATE470235T1 (de) | 2004-08-03 | 2005-08-01 | Belichtungsgeräte, belichtungsverfahren und bauelemente-herstellungsverfahren |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US8169591B2 (de) |
| EP (5) | EP2226682A3 (de) |
| JP (2) | JP5152356B2 (de) |
| KR (3) | KR101337007B1 (de) |
| CN (3) | CN102998910A (de) |
| AT (1) | ATE470235T1 (de) |
| DE (1) | DE602005021653D1 (de) |
| HK (2) | HK1243776B (de) |
| TW (1) | TWI460544B (de) |
| WO (1) | WO2006013806A1 (de) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4543767B2 (ja) * | 2004-06-10 | 2010-09-15 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
| CN102998910A (zh) | 2004-08-03 | 2013-03-27 | 株式会社尼康 | 曝光装置的控制方法、曝光方法及组件制造方法 |
| US7701550B2 (en) * | 2004-08-19 | 2010-04-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| EP1833081A4 (de) * | 2004-12-07 | 2010-11-24 | Nikon Corp | Belichtungsvorrichtung und verfahren zur bauelementeherstellung |
| WO2006080516A1 (ja) * | 2005-01-31 | 2006-08-03 | Nikon Corporation | 露光装置及びデバイス製造方法 |
| US8692973B2 (en) * | 2005-01-31 | 2014-04-08 | Nikon Corporation | Exposure apparatus and method for producing device |
| US9239524B2 (en) | 2005-03-30 | 2016-01-19 | Nikon Corporation | Exposure condition determination method, exposure method, exposure apparatus, and device manufacturing method involving detection of the situation of a liquid immersion region |
| EP2037486A4 (de) | 2006-05-18 | 2012-01-11 | Nikon Corp | Belichtungsverfahren und- vorrichtung, wartungsverfahren und bauelementeherstellungsverfahren |
| TW200818256A (en) | 2006-05-22 | 2008-04-16 | Nikon Corp | Exposure method and apparatus, maintenance method, and device manufacturing method |
| EP2034515A4 (de) | 2006-05-23 | 2012-01-18 | Nikon Corp | Wartungsverfahren, belichtungsverfahren und vorrichtung und bauelementeherstellungsverfahren |
| JP2008034801A (ja) * | 2006-06-30 | 2008-02-14 | Canon Inc | 露光装置およびデバイス製造方法 |
| WO2008001871A1 (en) | 2006-06-30 | 2008-01-03 | Nikon Corporation | Maintenance method, exposure method and apparatus and device manufacturing method |
| WO2008026593A1 (en) | 2006-08-30 | 2008-03-06 | Nikon Corporation | Exposure apparatus, device production method, cleaning method, and cleaning member |
| US7872730B2 (en) | 2006-09-15 | 2011-01-18 | Nikon Corporation | Immersion exposure apparatus and immersion exposure method, and device manufacturing method |
| US20080158531A1 (en) | 2006-11-15 | 2008-07-03 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
| WO2008059916A1 (en) * | 2006-11-15 | 2008-05-22 | Nikon Corporation | Exposure apparatus, exposure method and device manufacturing method |
| US20080156356A1 (en) | 2006-12-05 | 2008-07-03 | Nikon Corporation | Cleaning liquid, cleaning method, liquid generating apparatus, exposure apparatus, and device fabricating method |
| KR100830586B1 (ko) | 2006-12-12 | 2008-05-21 | 삼성전자주식회사 | 기판을 노광하는 장치 및 방법 |
| US8164736B2 (en) * | 2007-05-29 | 2012-04-24 | Nikon Corporation | Exposure method, exposure apparatus, and method for producing device |
| JP2009031603A (ja) * | 2007-07-27 | 2009-02-12 | Canon Inc | 投影光学系、露光装置及びデバイス製造方法 |
| DE102007043896A1 (de) | 2007-09-14 | 2009-04-02 | Carl Zeiss Smt Ag | Mikrooptik zur Messung der Position eines Luftbildes |
| JP2009086038A (ja) * | 2007-09-27 | 2009-04-23 | Canon Inc | 投影光学系、露光装置及びデバイス製造方法 |
| US8654306B2 (en) | 2008-04-14 | 2014-02-18 | Nikon Corporation | Exposure apparatus, cleaning method, and device fabricating method |
| US20110008734A1 (en) * | 2009-06-19 | 2011-01-13 | Nikon Corporation | Exposure apparatus and device manufacturing method |
| US9651873B2 (en) * | 2012-12-27 | 2017-05-16 | Nikon Corporation | Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium |
| KR102410381B1 (ko) * | 2015-11-20 | 2022-06-22 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 장치 및 리소그래피 장치를 작동시키는 방법 |
| US10345713B2 (en) | 2016-07-04 | 2019-07-09 | Asml Netherlands B.V. | Inspection substrate and an inspection method |
| CN107991843B (zh) * | 2017-12-21 | 2023-07-21 | 浙江启尔机电技术有限公司 | 一种用于浸没式光刻机的微流道气液分离回收装置 |
| US10690486B2 (en) | 2018-07-03 | 2020-06-23 | Amo Development, Llc | Water-immersed high precision laser focus spot size measurement apparatus |
| JP7252322B2 (ja) | 2018-09-24 | 2023-04-04 | エーエスエムエル ネザーランズ ビー.ブイ. | プロセスツール及び検査方法 |
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