ATE487238T1 - Verfahren und gerät zur automatischen lötung von einem anschlussdraht an einer sonnenzellenbatterie - Google Patents

Verfahren und gerät zur automatischen lötung von einem anschlussdraht an einer sonnenzellenbatterie

Info

Publication number
ATE487238T1
ATE487238T1 AT00105317T AT00105317T ATE487238T1 AT E487238 T1 ATE487238 T1 AT E487238T1 AT 00105317 T AT00105317 T AT 00105317T AT 00105317 T AT00105317 T AT 00105317T AT E487238 T1 ATE487238 T1 AT E487238T1
Authority
AT
Austria
Prior art keywords
lead wire
soldering
solar cell
connection wire
cell battery
Prior art date
Application number
AT00105317T
Other languages
English (en)
Inventor
Toshihide Okatsu
Masataka Kondo
Akimine Hayashi
Eiji Kuribe
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP27636099A external-priority patent/JP2001102610A/ja
Priority claimed from JP29273099A external-priority patent/JP2001111085A/ja
Priority claimed from JP30553399A external-priority patent/JP4504485B2/ja
Priority claimed from JP31239999A external-priority patent/JP4459339B2/ja
Priority claimed from JP35740099A external-priority patent/JP4451950B2/ja
Application filed by Kaneka Corp filed Critical Kaneka Corp
Application granted granted Critical
Publication of ATE487238T1 publication Critical patent/ATE487238T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0615—Solder feeding devices forming part of a soldering iron
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/30—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising thin-film photovoltaic cells
    • H10F19/31—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising thin-film photovoltaic cells having multiple laterally adjacent thin-film photovoltaic cells deposited on the same substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/137—Batch treatment of the devices
    • H10F71/1375—Apparatus for automatic interconnection of photovoltaic cells in a module
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/93—Interconnections
    • H10F77/933—Interconnections for devices having potential barriers
    • H10F77/935—Interconnections for devices having potential barriers for photovoltaic devices or modules
    • H10F77/937—Busbar structures for modules
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Photovoltaic Devices (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
AT00105317T 1999-09-29 2000-03-16 Verfahren und gerät zur automatischen lötung von einem anschlussdraht an einer sonnenzellenbatterie ATE487238T1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP27636099A JP2001102610A (ja) 1999-09-29 1999-09-29 半田バンプ付きリード線、太陽電池用リード線取付け装置及び太陽電池の製造方法
JP29273099A JP2001111085A (ja) 1999-10-14 1999-10-14 太陽電池モジュールの製造方法
JP30553399A JP4504485B2 (ja) 1999-10-27 1999-10-27 太陽電池用リード線半田付け装置
JP31239999A JP4459339B2 (ja) 1999-11-02 1999-11-02 太陽電池用リード線取付け方法及びその装置
JP35740099A JP4451950B2 (ja) 1999-12-16 1999-12-16 太陽電池用リード線自動半田付け方法及びその装置

Publications (1)

Publication Number Publication Date
ATE487238T1 true ATE487238T1 (de) 2010-11-15

Family

ID=27530619

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00105317T ATE487238T1 (de) 1999-09-29 2000-03-16 Verfahren und gerät zur automatischen lötung von einem anschlussdraht an einer sonnenzellenbatterie

Country Status (5)

Country Link
US (1) US6357649B1 (de)
EP (2) EP2259338B1 (de)
AT (1) ATE487238T1 (de)
AU (1) AU767276B2 (de)
DE (1) DE60045182D1 (de)

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CN103252551B (zh) * 2012-11-29 2017-05-17 东莞市亘高自动化机械有限公司 一种线材自动焊接工艺及线材自动焊接机
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KR102101429B1 (ko) * 2016-05-18 2020-04-16 주식회사 엘지화학 리드 용접 장치, 이러한 리드 용접 장치를 통해 제조되는 배터리 모듈 및 이러한 배터리 모듈을 포함하는 배터리 팩
CN106238854B (zh) * 2016-10-19 2018-10-09 惠州市锐达电子有限公司 一种连接线自动铆接、焊接设备
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CN106825839A (zh) * 2017-03-22 2017-06-13 无锡先导智能装备股份有限公司 汇流条的供料机构以及供料方法
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CN108838590A (zh) * 2018-07-13 2018-11-20 无锡奥特维科技股份有限公司 一种太阳能电池片焊接方法和装置
CN109952016B (zh) * 2019-01-29 2020-08-14 深圳市邦正精密机械有限公司 一种全自动四头补强片贴合机
CN110473932B (zh) * 2019-07-23 2020-11-24 杭州康奋威科技股份有限公司 一种太阳能光伏组件的汇流条焊接装置及其焊接方法
CN112975026A (zh) * 2021-02-26 2021-06-18 宁夏小牛自动化设备有限公司 一种修复太阳能电池串的方法
CN115117203B (zh) * 2022-07-05 2023-06-23 苏州伟昇智能装备有限公司 一种太阳能电池接线点位放高温布折引线一体设备
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Also Published As

Publication number Publication date
AU767276B2 (en) 2003-11-06
EP2259338A1 (de) 2010-12-08
US6357649B1 (en) 2002-03-19
EP1089347B1 (de) 2010-11-03
EP1089347A2 (de) 2001-04-04
DE60045182D1 (de) 2010-12-16
EP1089347A3 (de) 2008-07-09
AU2237800A (en) 2001-04-05
EP2259338B1 (de) 2014-09-17

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