ATE497160T1 - Verfahren zur in-situ überwachung und kontrolle von filmdicke und grabentiefe - Google Patents

Verfahren zur in-situ überwachung und kontrolle von filmdicke und grabentiefe

Info

Publication number
ATE497160T1
ATE497160T1 AT04718815T AT04718815T ATE497160T1 AT E497160 T1 ATE497160 T1 AT E497160T1 AT 04718815 T AT04718815 T AT 04718815T AT 04718815 T AT04718815 T AT 04718815T AT E497160 T1 ATE497160 T1 AT E497160T1
Authority
AT
Austria
Prior art keywords
data
reflectivity
model
wafer
merit function
Prior art date
Application number
AT04718815T
Other languages
English (en)
Inventor
Andrew Kueny
Original Assignee
Verity Instr Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Verity Instr Inc filed Critical Verity Instr Inc
Application granted granted Critical
Publication of ATE497160T1 publication Critical patent/ATE497160T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/0095—Testing the sensing arrangement, e.g. testing if a magnetic card reader, bar code reader, RFID interrogator or smart card reader functions properly
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/8422—Investigating thin films, e.g. matrix isolation method
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Artificial Intelligence (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Drying Of Semiconductors (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
AT04718815T 2003-03-19 2004-03-09 Verfahren zur in-situ überwachung und kontrolle von filmdicke und grabentiefe ATE497160T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/392,991 US7049156B2 (en) 2003-03-19 2003-03-19 System and method for in-situ monitor and control of film thickness and trench depth
PCT/US2004/007118 WO2004086068A1 (en) 2003-03-19 2004-03-09 System and method for in-situ monitor and control of film thickness and trench depth

Publications (1)

Publication Number Publication Date
ATE497160T1 true ATE497160T1 (de) 2011-02-15

Family

ID=32988016

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04718815T ATE497160T1 (de) 2003-03-19 2004-03-09 Verfahren zur in-situ überwachung und kontrolle von filmdicke und grabentiefe

Country Status (9)

Country Link
US (1) US7049156B2 (de)
EP (1) EP1611447B1 (de)
JP (2) JP4958546B2 (de)
KR (1) KR100782192B1 (de)
CN (1) CN1774639B (de)
AT (1) ATE497160T1 (de)
DE (1) DE602004031201D1 (de)
TW (1) TWI287080B (de)
WO (1) WO2004086068A1 (de)

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Also Published As

Publication number Publication date
CN1774639A (zh) 2006-05-17
TW200422589A (en) 2004-11-01
US7049156B2 (en) 2006-05-23
TWI287080B (en) 2007-09-21
JP2006521014A (ja) 2006-09-14
EP1611447A1 (de) 2006-01-04
KR20050110011A (ko) 2005-11-22
KR100782192B1 (ko) 2007-12-04
WO2004086068A1 (en) 2004-10-07
EP1611447A4 (de) 2009-11-11
DE602004031201D1 (de) 2011-03-10
EP1611447B1 (de) 2011-01-26
US20040185582A1 (en) 2004-09-23
JP4958546B2 (ja) 2012-06-20
JP2010199557A (ja) 2010-09-09
CN1774639B (zh) 2010-12-15

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