ATE506635T1 - Imprint-lithografie - Google Patents

Imprint-lithografie

Info

Publication number
ATE506635T1
ATE506635T1 AT06255420T AT06255420T ATE506635T1 AT E506635 T1 ATE506635 T1 AT E506635T1 AT 06255420 T AT06255420 T AT 06255420T AT 06255420 T AT06255420 T AT 06255420T AT E506635 T1 ATE506635 T1 AT E506635T1
Authority
AT
Austria
Prior art keywords
substrate
hold
substrate table
imprint template
imprint lithography
Prior art date
Application number
AT06255420T
Other languages
English (en)
Inventor
Klaus Simon
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Application granted granted Critical
Publication of ATE506635T1 publication Critical patent/ATE506635T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Micromachines (AREA)
  • Saccharide Compounds (AREA)
  • Low-Molecular Organic Synthesis Reactions Using Catalysts (AREA)
AT06255420T 2005-11-04 2006-10-21 Imprint-lithografie ATE506635T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US73317505P 2005-11-04 2005-11-04
US11/364,497 US8011915B2 (en) 2005-11-04 2006-03-01 Imprint lithography

Publications (1)

Publication Number Publication Date
ATE506635T1 true ATE506635T1 (de) 2011-05-15

Family

ID=37670937

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06255420T ATE506635T1 (de) 2005-11-04 2006-10-21 Imprint-lithografie

Country Status (5)

Country Link
US (4) US8011915B2 (de)
EP (1) EP1783547B1 (de)
JP (2) JP4604012B2 (de)
AT (1) ATE506635T1 (de)
DE (1) DE602006021380D1 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7676088B2 (en) * 2004-12-23 2010-03-09 Asml Netherlands B.V. Imprint lithography
US7517211B2 (en) 2005-12-21 2009-04-14 Asml Netherlands B.V. Imprint lithography
JP5082262B2 (ja) * 2006-03-03 2012-11-28 コニカミノルタホールディングス株式会社 樹脂膜の製造方法
US8142702B2 (en) * 2007-06-18 2012-03-27 Molecular Imprints, Inc. Solvent-assisted layer formation for imprint lithography
JP5361309B2 (ja) * 2008-09-25 2013-12-04 キヤノン株式会社 インプリント装置およびインプリント方法
JPWO2010082300A1 (ja) * 2009-01-13 2012-06-28 パイオニア株式会社 転写装置
JPWO2010087082A1 (ja) * 2009-01-30 2012-07-26 コニカミノルタアドバンストレイヤー株式会社 ウエハレンズ製造装置及びウエハレンズの製造方法
JP5404140B2 (ja) * 2009-04-01 2014-01-29 株式会社東芝 テンプレート及び半導体装置の製造方法
JP5443070B2 (ja) * 2009-06-19 2014-03-19 東京エレクトロン株式会社 インプリントシステム
JP5495767B2 (ja) * 2009-12-21 2014-05-21 キヤノン株式会社 インプリント装置及び方法、並びに物品の製造方法
NL2005975A (en) 2010-03-03 2011-09-06 Asml Netherlands Bv Imprint lithography.
JP5539011B2 (ja) 2010-05-14 2014-07-02 キヤノン株式会社 インプリント装置、検出装置、位置合わせ装置、及び物品の製造方法
JP2012009831A (ja) * 2010-05-21 2012-01-12 Tokyo Electron Ltd インプリントシステム、インプリント方法、プログラム及びコンピュータ記憶媒体
JP5611112B2 (ja) * 2010-05-21 2014-10-22 東京エレクトロン株式会社 インプリントシステム、インプリント方法、プログラム及びコンピュータ記憶媒体
JP5411201B2 (ja) * 2010-05-21 2014-02-12 東京エレクトロン株式会社 インプリントシステム、インプリント方法、プログラム及びコンピュータ記憶媒体
US9864279B2 (en) 2010-08-05 2018-01-09 Asml Netherlands B.V. Imprint lithography
FR2974194B1 (fr) * 2011-04-12 2013-11-15 Commissariat Energie Atomique Procede de lithographie
JP6028602B2 (ja) * 2013-02-06 2016-11-16 大日本印刷株式会社 インプリント方法およびインプリント装置
JP6032036B2 (ja) * 2013-02-06 2016-11-24 大日本印刷株式会社 インプリント方法およびインプリント装置
JP6123321B2 (ja) * 2013-02-06 2017-05-10 大日本印刷株式会社 インプリント方法およびインプリント装置
JP5611399B2 (ja) * 2013-03-25 2014-10-22 キヤノン株式会社 加工装置
KR102292465B1 (ko) * 2013-08-19 2021-08-20 보드 오브 레젼츠, 더 유니버시티 오브 텍사스 시스템 나노미터 스케일 정확도를 갖는 사용자 정의 프로파일의 프로그램 가능한 박막 적층 방법
JP6497849B2 (ja) * 2014-04-15 2019-04-10 キヤノン株式会社 インプリント装置、および物品の製造方法
JP6399839B2 (ja) * 2014-07-15 2018-10-03 キヤノン株式会社 インプリント装置、および物品の製造方法
JP6512840B2 (ja) * 2015-01-22 2019-05-15 キヤノン株式会社 インプリント装置及び方法、並びに物品の製造方法
KR102097225B1 (ko) * 2015-09-08 2020-04-03 캐논 가부시끼가이샤 나노임프린트 리소그래피에서의 기재 전처리 및 식각 균일성
CA3001848C (en) * 2015-10-15 2023-09-19 Board Of Regents, The University Of Texas System Versatile process for precision nanoscale manufacturing
KR102410381B1 (ko) * 2015-11-20 2022-06-22 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 리소그래피 장치를 작동시키는 방법
JP6365620B2 (ja) * 2016-10-17 2018-08-01 大日本印刷株式会社 インプリント方法およびインプリント装置
JP6365619B2 (ja) * 2016-10-17 2018-08-01 大日本印刷株式会社 インプリント方法およびインプリント装置
CN120669473B (zh) * 2025-08-20 2025-10-21 普雨科技(苏州)有限公司 一种纳米压印设备及压印方法

Family Cites Families (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5512131A (en) 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles
US5772905A (en) 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
US6309580B1 (en) 1995-11-15 2001-10-30 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
US6482742B1 (en) 2000-07-18 2002-11-19 Stephen Y. Chou Fluid pressure imprint lithography
US20040036201A1 (en) 2000-07-18 2004-02-26 Princeton University Methods and apparatus of field-induced pressure imprint lithography
US6518189B1 (en) 1995-11-15 2003-02-11 Regents Of The University Of Minnesota Method and apparatus for high density nanostructures
JPH09192573A (ja) * 1996-01-22 1997-07-29 Matsushita Electric Ind Co Ltd 薄膜形成方法及び薄膜形成装置
EP0900412B1 (de) * 1997-03-10 2005-04-06 ASML Netherlands B.V. Lithographiegerät mit einer positioniervorrichtung mit zwei objekthaltern
US6208407B1 (en) * 1997-12-22 2001-03-27 Asm Lithography B.V. Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement
JPH11340129A (ja) 1998-05-28 1999-12-10 Seiko Epson Corp パターン製造方法およびパターン製造装置
EP1003078A3 (de) 1998-11-17 2001-11-07 Corning Incorporated Verfahren zur Vervielfältigung eines Nanomusters
JP2000182253A (ja) 1998-12-15 2000-06-30 Sony Corp 情報記録再生装置
US6334960B1 (en) 1999-03-11 2002-01-01 Board Of Regents, The University Of Texas System Step and flash imprint lithography
JP2000289037A (ja) 1999-04-05 2000-10-17 Toshiba Corp 光学部品の成形方法とそれによる光学部品と光ヘッド装置およびそれらの製造方法および光ディスク装置
JP4440370B2 (ja) 1999-05-21 2010-03-24 大日本印刷株式会社 可撓性シート基材へのパターン複製装置
WO2001008678A1 (en) 1999-07-30 2001-02-08 University Of Kentucky Research Foundation Cis-2,6-disubstituted piperidines for the treatment of psychostimulant abuse and withdrawal, eating disorders, and central nervous system diseases and pathologies
US6517995B1 (en) 1999-09-14 2003-02-11 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
SE515607C2 (sv) 1999-12-10 2001-09-10 Obducat Ab Anordning och metod vid tillverkning av strukturer
US6165911A (en) 1999-12-29 2000-12-26 Calveley; Peter Braden Method of patterning a metal layer
ATE332517T1 (de) 2000-01-21 2006-07-15 Obducat Ab Form zur nanobedruckung
SE515785C2 (sv) 2000-02-23 2001-10-08 Obducat Ab Anordning för homogen värmning av ett objekt och användning av anordningen
SE515962C2 (sv) 2000-03-15 2001-11-05 Obducat Ab Anordning för överföring av mönster till objekt
SE0001368L (sv) 2000-04-13 2001-10-14 Obducat Ab Apparat och förfarande för elektrokemisk bearbetning av substrat
SE0001367L (sv) 2000-04-13 2001-10-14 Obducat Ab Apparat och förfarande för elektrokemisk bearbetning av substrat
SE516194C2 (sv) 2000-04-18 2001-12-03 Obducat Ab Substrat för samt process vid tillverkning av strukturer
US6365059B1 (en) 2000-04-28 2002-04-02 Alexander Pechenik Method for making a nano-stamp and for forming, with the stamp, nano-size elements on a substrate
SE516414C2 (sv) 2000-05-24 2002-01-15 Obducat Ab Metod vid tillverkning av en mall, samt mallen tillverkad därav
SG142150A1 (en) 2000-07-16 2008-05-28 Univ Texas High-resolution overlay alignment systems for imprint lithography
KR100827741B1 (ko) 2000-07-17 2008-05-07 보드 오브 리전츠, 더 유니버시티 오브 텍사스 시스템 임프린트 리소그래피 공정을 위한 자동 유체 분배 방법 및시스템
US20050160011A1 (en) 2004-01-20 2005-07-21 Molecular Imprints, Inc. Method for concurrently employing differing materials to form a layer on a substrate
US7211214B2 (en) 2000-07-18 2007-05-01 Princeton University Laser assisted direct imprint lithography
JP2004505273A (ja) 2000-08-01 2004-02-19 ボード・オブ・リージエンツ，ザ・ユニバーシテイ・オブ・テキサス・システム 転写リソグラフィのための透明テンプレートと基板の間のギャップおよび配向を高精度でセンシングするための方法
SE519478C2 (sv) 2000-09-19 2003-03-04 Obducat Ab Etsförfarande, såväl som ramelement, mask och förtillverkat substratelement för användning i sådan etsning
JP2002093748A (ja) 2000-09-19 2002-03-29 Nippon Telegr & Teleph Corp <Ntt> インプリント装置及びインプリント方法
CN100365507C (zh) 2000-10-12 2008-01-30 德克萨斯州大学系统董事会 用于室温下低压微刻痕和毫微刻痕光刻的模板
US6964793B2 (en) 2002-05-16 2005-11-15 Board Of Regents, The University Of Texas System Method for fabricating nanoscale patterns in light curable compositions using an electric field
US6847433B2 (en) 2001-06-01 2005-01-25 Agere Systems, Inc. Holder, system, and process for improving overlay in lithography
SE519573C2 (sv) 2001-07-05 2003-03-11 Obducat Ab Stamp med antividhäftningsskikt samt sätt att framställa och sätt att reparera en sådan stamp
JP3808741B2 (ja) 2001-10-01 2006-08-16 東京エレクトロン株式会社 処理装置
US20030080472A1 (en) 2001-10-29 2003-05-01 Chou Stephen Y. Lithographic method with bonded release layer for molding small patterns
JP2003249443A (ja) 2001-12-21 2003-09-05 Nikon Corp ステージ装置、ステージ位置管理方法、露光方法及び露光装置、並びにデバイス製造方法
US7144539B2 (en) 2002-04-04 2006-12-05 Obducat Ab Imprint method and device
EP1353229A1 (de) * 2002-04-09 2003-10-15 ASML Netherlands B.V. Lithographischer Apparat, Verfahren zur Herstellung eines Artikels und dabei hergesteller Artikel
US7252492B2 (en) 2002-06-20 2007-08-07 Obducat Ab Devices and methods for aligning a stamp and a substrate
US6908861B2 (en) 2002-07-11 2005-06-21 Molecular Imprints, Inc. Method for imprint lithography using an electric field
US7077992B2 (en) 2002-07-11 2006-07-18 Molecular Imprints, Inc. Step and repeat imprint lithography processes
US7027156B2 (en) 2002-08-01 2006-04-11 Molecular Imprints, Inc. Scatterometry alignment for imprint lithography
US7070405B2 (en) 2002-08-01 2006-07-04 Molecular Imprints, Inc. Alignment systems for imprint lithography
US6755984B2 (en) 2002-10-24 2004-06-29 Hewlett-Packard Development Company, L.P. Micro-casted silicon carbide nano-imprinting stamp
US6916511B2 (en) 2002-10-24 2005-07-12 Hewlett-Packard Development Company, L.P. Method of hardening a nano-imprinting stamp
WO2004086471A1 (en) 2003-03-27 2004-10-07 Korea Institute Of Machinery & Materials Uv nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization
US20040209123A1 (en) 2003-04-17 2004-10-21 Bajorek Christopher H. Method of fabricating a discrete track recording disk using a bilayer resist for metal lift-off
TW568349U (en) 2003-05-02 2003-12-21 Ind Tech Res Inst Parallelism adjusting device for nano-transferring
TW570290U (en) 2003-05-02 2004-01-01 Ind Tech Res Inst Uniform pressing device for nanometer transfer-print
US6876439B2 (en) 2003-05-29 2005-04-05 Asml Holding N.V. Method to increase throughput in a dual substrate stage double exposure lithography system
KR101520591B1 (ko) * 2003-06-13 2015-05-14 가부시키가이샤 니콘 노광 방법, 기판 스테이지, 노광 장치, 및 디바이스 제조 방법
JP2005045168A (ja) 2003-07-25 2005-02-17 Tokyo Electron Ltd インプリント方法およびインプリント装置
TWI263859B (en) 2003-08-29 2006-10-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
JP2005101201A (ja) 2003-09-24 2005-04-14 Canon Inc ナノインプリント装置
JP2005153091A (ja) * 2003-11-27 2005-06-16 Hitachi Ltd 転写方法及び転写装置
KR100585951B1 (ko) 2004-02-18 2006-06-01 한국기계연구원 조합/분리형 독립구동이 가능한 복수 개의 모듈을 갖는 임프린팅 장치
JP4393244B2 (ja) 2004-03-29 2010-01-06 キヤノン株式会社 インプリント装置
US7878791B2 (en) 2005-11-04 2011-02-01 Asml Netherlands B.V. Imprint lithography
US7670530B2 (en) 2006-01-20 2010-03-02 Molecular Imprints, Inc. Patterning substrates employing multiple chucks
MY144847A (en) 2005-12-08 2011-11-30 Molecular Imprints Inc Method and system for double-sided patterning of substrates
JP5194859B2 (ja) 2008-02-12 2013-05-08 凸版印刷株式会社 光学シート及びバックライトユニット並びにディスプレイ装置

Also Published As

Publication number Publication date
JP4629147B2 (ja) 2011-02-09
JP2010016405A (ja) 2010-01-21
US10025206B2 (en) 2018-07-17
US20180095361A1 (en) 2018-04-05
US9778563B2 (en) 2017-10-03
EP1783547A2 (de) 2007-05-09
EP1783547A3 (de) 2007-05-30
DE602006021380D1 (de) 2011-06-01
US9864271B2 (en) 2018-01-09
JP4604012B2 (ja) 2010-12-22
US20070102838A1 (en) 2007-05-10
US20170329218A1 (en) 2017-11-16
EP1783547B1 (de) 2011-04-20
US8011915B2 (en) 2011-09-06
JP2007182063A (ja) 2007-07-19
US20110283937A1 (en) 2011-11-24

Similar Documents

Publication Publication Date Title
ATE506635T1 (de) Imprint-lithografie
EP1801649A3 (de) Imprint-Lithographie
AU2003261317A8 (en) Scatterometry alignment for imprint lithography
TW200613927A (en) Imprint lithographic apparatus, device manufacturing method and device manufactured thereby
SG127817A1 (en) Imprint lithography
MY154538A (en) Imprint lithography templates having alignment marks
DK2277707T3 (da) Printmaterialebeholder og printkort, som er monteret på printmaterialebeholderen
ATE493267T1 (de) Flachdruckplattenvorläufer und flachdruckprozess
TW200625504A (en) Substrate holder, stage device and exposure device
ATE490083T1 (de) Rotationsdruckmaschine
EP2026131A3 (de) Gewundene Lithographiereihenfolge
DE602005004320D1 (de) Lithographischer Druckplattenvorläufer und einen solchen verwendendes lithographisches Druckverfahren
TW200639585A (en) Resist composition and patterning process
ATE395291T1 (de) Längsfalzvorrichtung mit unterschiedlich breiten falztrichtern
ATE448089T1 (de) Stanzzylinder
ES2187285A1 (es) Procedimiento de multifresado para la fabricacion de circuitos impresos y circuito impreso asi obtenido.
TW200725194A (en) Lithographic apparatus and device manufacturing method
GB2432579B (en) A page turner
DK2231633T3 (da) Antitumorale forbindelser
TW200703548A (en) Exposing apparatus having substrate chuck of good flatness
ATE369256T1 (de) Flachdruckplattenvorläufer und flachdruckverfahren.
TW200942986A (en) A lithographic apparatus having a chuck with a visco-elastic damping layer
TW200506539A (en) Intermediate layer composition for multilayer resist process, pattern-forming process using the same, and laminate
DE602007008455D1 (de) Blatt für die zusammenstellung eines fotoalbums und fotoalbum mit derartigem blatt
DE60215896D1 (de) Quellenblatt für Schablonendruckverfahren, Druckplattenherstellungsverfahren und Schablonendruckverfahren

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties