ATE512462T1 - Mikroelektronische wärmeabfuhrgehäusung und deren herstellungsverfahren - Google Patents

Mikroelektronische wärmeabfuhrgehäusung und deren herstellungsverfahren

Info

Publication number
ATE512462T1
ATE512462T1 AT02392016T AT02392016T ATE512462T1 AT E512462 T1 ATE512462 T1 AT E512462T1 AT 02392016 T AT02392016 T AT 02392016T AT 02392016 T AT02392016 T AT 02392016T AT E512462 T1 ATE512462 T1 AT E512462T1
Authority
AT
Austria
Prior art keywords
chip
heat dissipation
enclosure
production process
cavities
Prior art date
Application number
AT02392016T
Other languages
English (en)
Inventor
Randall M German
Lye-King Tan
John Johnson
Original Assignee
Advanced Materials Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Materials Tech filed Critical Advanced Materials Tech
Application granted granted Critical
Publication of ATE512462T1 publication Critical patent/ATE512462T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0225—Microheat pipes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
AT02392016T 2001-08-28 2002-08-28 Mikroelektronische wärmeabfuhrgehäusung und deren herstellungsverfahren ATE512462T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US31530601P 2001-08-28 2001-08-28

Publications (1)

Publication Number Publication Date
ATE512462T1 true ATE512462T1 (de) 2011-06-15

Family

ID=23223806

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02392016T ATE512462T1 (de) 2001-08-28 2002-08-28 Mikroelektronische wärmeabfuhrgehäusung und deren herstellungsverfahren

Country Status (6)

Country Link
US (3) US6935022B2 (de)
EP (1) EP1296373B1 (de)
JP (1) JP2003193114A (de)
AT (1) ATE512462T1 (de)
ES (1) ES2371726T3 (de)
SG (2) SG152908A1 (de)

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CN103415192B (zh) * 2013-08-20 2015-09-23 南京理工大学 蒸汽腔热管/微通道冷板复合结构均温装置
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CN105157460A (zh) * 2015-08-24 2015-12-16 东华大学 一种以氨水为介质，不锈钢为材质的脉动热管换热器
BE1024200B1 (fr) * 2016-05-13 2017-12-12 Centre De Recherches Metallurgiques Asbl - Centrum Voor Research In De Metallurgie Vzw Système de contrôle thermique dynamique par matériaux à changement de phase
CN112191842B (zh) * 2020-09-10 2023-09-29 安徽德诠新材料科技有限公司 一种可多管烧结的导热管烧结模
CN114054749B (zh) * 2021-11-09 2024-06-18 深圳市长盈精密技术股份有限公司 填粉机

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Also Published As

Publication number Publication date
US6935022B2 (en) 2005-08-30
EP1296373A2 (de) 2003-03-26
EP1296373B1 (de) 2011-06-08
SG152908A1 (en) 2009-06-29
US20050284616A1 (en) 2005-12-29
US20030042006A1 (en) 2003-03-06
ES2371726T3 (es) 2012-01-09
SG120884A1 (en) 2006-04-26
JP2003193114A (ja) 2003-07-09
US20060000584A1 (en) 2006-01-05
EP1296373A3 (de) 2006-10-04

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