ATE516695T1 - System zur thermischer übertragung und verfahren für eine auf kühlkörper angebrachte baugruppe - Google Patents

System zur thermischer übertragung und verfahren für eine auf kühlkörper angebrachte baugruppe

Info

Publication number
ATE516695T1
ATE516695T1 AT05253019T AT05253019T ATE516695T1 AT E516695 T1 ATE516695 T1 AT E516695T1 AT 05253019 T AT05253019 T AT 05253019T AT 05253019 T AT05253019 T AT 05253019T AT E516695 T1 ATE516695 T1 AT E516695T1
Authority
AT
Austria
Prior art keywords
heat sink
thermal transfer
transfer system
mounted assembly
sink mounted
Prior art date
Application number
AT05253019T
Other languages
English (en)
Inventor
George F Barson
Richard M Weber
James L Haws
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Application granted granted Critical
Publication of ATE516695T1 publication Critical patent/ATE516695T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AT05253019T 2004-05-18 2005-05-17 System zur thermischer übertragung und verfahren für eine auf kühlkörper angebrachte baugruppe ATE516695T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/848,336 US6989991B2 (en) 2004-05-18 2004-05-18 Thermal management system and method for electronic equipment mounted on coldplates

Publications (1)

Publication Number Publication Date
ATE516695T1 true ATE516695T1 (de) 2011-07-15

Family

ID=34941340

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05253019T ATE516695T1 (de) 2004-05-18 2005-05-17 System zur thermischer übertragung und verfahren für eine auf kühlkörper angebrachte baugruppe

Country Status (4)

Country Link
US (2) US6989991B2 (de)
EP (2) EP1599081B1 (de)
AT (1) ATE516695T1 (de)
ES (1) ES2367695T3 (de)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004026061B4 (de) * 2004-05-25 2009-09-10 Danfoss Silicon Power Gmbh Leistungshalbleitermodul und Verfahren zum Kühlen eines Leistungshalbleitermoduls
US7983042B2 (en) * 2004-06-15 2011-07-19 Raytheon Company Thermal management system and method for thin membrane type antennas
US7168152B1 (en) * 2004-10-18 2007-01-30 Lockheed Martin Corporation Method for making an integrated active antenna element
US7677299B2 (en) * 2004-11-10 2010-03-16 Wen-Chun Zheng Nearly isothermal heat pipe heat sink
US7292439B2 (en) * 2005-01-19 2007-11-06 Raytheon Company Thermal management system and method for electronic assemblies
US7511372B2 (en) * 2005-06-28 2009-03-31 Intel Corporation Microelectronic die cooling device including bonding posts and method of forming same
US7443354B2 (en) * 2005-08-09 2008-10-28 The Boeing Company Compliant, internally cooled antenna apparatus and method
US7624791B2 (en) * 2006-09-08 2009-12-01 Advanced Energy Industries, Inc. Cooling apparatus for electronics
US7551440B2 (en) * 2007-01-24 2009-06-23 Hewlett-Packard Development Company, L.P. System and method for cooling an electronic component
EP2143139B1 (de) * 2007-04-26 2019-06-19 CeramTec GmbH Kühldose für bauelemente oder schaltungen
US7940524B2 (en) * 2007-10-01 2011-05-10 Raytheon Company Remote cooling of a phased array antenna
US8002021B1 (en) * 2008-02-04 2011-08-23 Advanced Cooling Technologies, Inc. Heat exchanger with internal heat pipe
US8503941B2 (en) 2008-02-21 2013-08-06 The Boeing Company System and method for optimized unmanned vehicle communication using telemetry
TW201036527A (en) * 2009-03-19 2010-10-01 Acbel Polytech Inc Large-area liquid-cooled heat-dissipation device
DK2259310T3 (da) * 2009-06-05 2020-06-22 Siemens Gamesa Renewable Energy As Integreret varmeveksler
US8222541B2 (en) * 2009-06-19 2012-07-17 General Electric Company Avionics chassis
US7911796B2 (en) * 2009-06-19 2011-03-22 General Electric Company Avionics chassis
US8023267B2 (en) * 2009-06-19 2011-09-20 General Electric Company Avionics chassis
US8059409B2 (en) * 2009-06-19 2011-11-15 General Electric Company Avionics chassis
US20110056669A1 (en) * 2009-09-04 2011-03-10 Raytheon Company Heat Transfer Device
US10531594B2 (en) 2010-07-28 2020-01-07 Wieland Microcool, Llc Method of producing a liquid cooled coldplate
US20120026692A1 (en) 2010-07-28 2012-02-02 Wolverine Tube, Inc. Electronics substrate with enhanced direct bonded metal
US9681580B2 (en) 2010-07-28 2017-06-13 Wolverine Tube, Inc. Method of producing an enhanced base plate
US9795057B2 (en) 2010-07-28 2017-10-17 Wolverine Tube, Inc. Method of producing a liquid cooled coldplate
FR2979048B1 (fr) * 2011-08-08 2015-03-20 Valeo Sys Controle Moteur Sas Dispositif comportant un corps presentant une surface de reception d'au moins un composant electronique et une conduite apte a recevoir un fluide de refroidissement
US9255741B2 (en) * 2012-01-26 2016-02-09 Lear Corporation Cooled electric assembly
DE102013212724B3 (de) * 2013-06-28 2014-12-04 TRUMPF Hüttinger GmbH + Co. KG Kühlvorrichtung zur Kühlung eines Elektronikbauteils und Elektronikanordnung mit einer Kühlvorrichtung
US9468131B2 (en) * 2014-04-16 2016-10-11 Raytheon Company Monolithic multi-module electronics chassis with multi-planar embedded fluid cooling channels
US9865522B2 (en) 2014-11-18 2018-01-09 International Business Machines Corporation Composite heat sink structures
US9345169B1 (en) 2014-11-18 2016-05-17 International Business Machines Corporation Liquid-cooled heat sink assemblies
US10265812B2 (en) 2015-08-12 2019-04-23 International Business Machines Corporation Liquid-cooled, composite heat sink assemblies
EP3162731B1 (de) * 2015-10-30 2018-10-03 Ecolean AB Beutelartige verpackung und zugehöriges verfahren zur anpassung solch einr verpackung
DE102016214965A1 (de) * 2016-08-11 2018-02-15 Siemens Aktiengesellschaft Temperiereinheit für einen Schaltungsträger, Verfahren zu deren Herstellung sowie Verfahren zum Bestimmen der Geometrie einer Temperiereinheit
JP7269176B2 (ja) 2017-03-21 2023-05-08 エルジー イノテック カンパニー リミテッド コンバータ
US10840573B2 (en) 2017-12-05 2020-11-17 The United States Of America, As Represented By The Secretary Of The Air Force Linear-to-circular polarizers using cascaded sheet impedances and cascaded waveplates
US10547117B1 (en) 2017-12-05 2020-01-28 Unites States Of America As Represented By The Secretary Of The Air Force Millimeter wave, wideband, wide scan phased array architecture for radiating circular polarization at high power levels
EP3525558A1 (de) * 2018-02-12 2019-08-14 IQ evolution GmbH Leiterplatte
US10433458B1 (en) * 2018-05-08 2019-10-01 Hewlett Packard Enterprise Development Lp Conducting plastic cold plates
CN110146956B (zh) * 2019-04-25 2021-04-27 东南大学 一种光模块的内部热输运微结构
CN110113867B (zh) * 2019-05-31 2021-03-02 维沃移动通信有限公司 散热结构及移动终端
US11252811B2 (en) * 2020-01-15 2022-02-15 Cisco Technology, Inc. Power distribution from point-of-load with cooling
US11270925B2 (en) 2020-05-28 2022-03-08 Google Llc Heat distribution device with flow channels
DE102021104390A1 (de) 2021-02-24 2022-08-25 Scherdel Innotec Forschungs- Und Entwicklungs-Gmbh Spritzgussgehäuse, Leistungselektronik-Bauteil und Thermomanagement-Element damit und Verfahren zum Herstellen eines Spritzgussgehäuses
FR3122547A1 (fr) * 2021-04-29 2022-11-04 Valeo Siemens Eautomotive France Sas Module de refroidissement comprenant une structure de refroidissement pour la dissipation thermique
US12452991B2 (en) 2022-06-25 2025-10-21 EvansWerks, Inc. Cooling system and methods
US12133365B2 (en) 2022-06-25 2024-10-29 EvansWerks, Inc. Cooling system and methods
US12453048B2 (en) 2022-06-25 2025-10-21 EvansWerks, Inc. Cooling system and methods
US12490411B2 (en) 2022-06-25 2025-12-02 EvansWerks, Inc. Cooling system and methods
US12101909B2 (en) 2022-06-25 2024-09-24 EvansWerks, Inc. Cooling system and methods
US12200908B2 (en) 2022-06-25 2025-01-14 EvansWerks, Inc. Cooling system and methods
US12363864B2 (en) 2022-06-25 2025-07-15 EvansWerks, Inc. Cooling system and methods

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03274796A (ja) * 1990-03-23 1991-12-05 Koufu Nippon Denki Kk コールドプレート機構
US5159529A (en) * 1991-05-15 1992-10-27 International Business Machines Corporation Composite liquid cooled plate for electronic equipment
US5453911A (en) * 1994-02-17 1995-09-26 General Motors Corporation Device for cooling power electronics
US6184832B1 (en) 1996-05-17 2001-02-06 Raytheon Company Phased array antenna
DE19643717A1 (de) * 1996-10-23 1998-04-30 Asea Brown Boveri Flüssigkeits-Kühlvorrichtung für ein Hochleistungshalbleitermodul
JP3082738B2 (ja) * 1998-03-13 2000-08-28 日本電気株式会社 高効率液体冷却装置
US6058013A (en) * 1998-07-02 2000-05-02 Motorola Inc. Molded housing with integral heatsink
US6219237B1 (en) * 1998-08-31 2001-04-17 Micron Technology, Inc. Structure and method for an electronic assembly
US6016007A (en) * 1998-10-16 2000-01-18 Northrop Grumman Corp. Power electronics cooling apparatus
US6297775B1 (en) 1999-09-16 2001-10-02 Raytheon Company Compact phased array antenna system, and a method of operating same
DE10006215A1 (de) * 2000-02-11 2001-08-16 Abb Semiconductors Ag Baden Kühlvorrichtung für ein Hochleistungs-Halbleitermodul
FR2809281B1 (fr) * 2000-05-22 2002-07-12 Alstom Dispositif electronique de puissance
US7017651B1 (en) * 2000-09-13 2006-03-28 Raytheon Company Method and apparatus for temperature gradient control in an electronic system
JP4423792B2 (ja) * 2000-09-14 2010-03-03 株式会社デンソー 沸騰冷却装置
US6578626B1 (en) * 2000-11-21 2003-06-17 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
JP3946018B2 (ja) * 2001-09-18 2007-07-18 株式会社日立製作所 液冷却式回路装置
US6679315B2 (en) * 2002-01-14 2004-01-20 Marconi Communications, Inc. Small scale chip cooler assembly
US6819561B2 (en) * 2002-02-22 2004-11-16 Satcon Technology Corporation Finned-tube heat exchangers and cold plates, self-cooling electronic component systems using same, and methods for cooling electronic components using same
US6591898B1 (en) * 2002-06-20 2003-07-15 International Business Machines Corporation Integrated heat sink system for a closed electronics container
DE10246990A1 (de) * 2002-10-02 2004-04-22 Atotech Deutschland Gmbh Mikrostrukturkühler und dessen Verwendung
US20050128705A1 (en) * 2003-12-16 2005-06-16 International Business Machines Corporation Composite cold plate assembly

Also Published As

Publication number Publication date
ES2367695T3 (es) 2011-11-07
EP1599081A3 (de) 2007-05-23
EP2112875A3 (de) 2009-12-02
US6989991B2 (en) 2006-01-24
EP2112875A2 (de) 2009-10-28
US7092255B2 (en) 2006-08-15
EP2112875B1 (de) 2012-05-16
EP1599081A2 (de) 2005-11-23
US20060098410A1 (en) 2006-05-11
EP1599081B1 (de) 2011-07-13
US20050259396A1 (en) 2005-11-24

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Legal Events

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