ATE532103T1 - Auf sensitivität basierendes evaluierungsverfahren für eine harzzusammensetzung - Google Patents

Auf sensitivität basierendes evaluierungsverfahren für eine harzzusammensetzung

Info

Publication number: ATE532103T1
Authority: AT; Austria
Prior art keywords: resist composition; acid; structural units; component; resin composition
Prior art date: 2003-01-31

Application number

AT05111460T

Other languages

English (en)

Inventor

Taku Hirayama

Tomotaka Yamada

Toshikazu Takayama

Masaaki Yoshida

Hideo Hada

Satoshi Fujimura

Takeshi Iwai

Mitsuru Sato

Ryoichi Takasu

Toshikazu Tachikawa

Jun Iwashita

Keita Ishiduka

Original Assignee

Tokyo Ohka Kogyo Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2003-01-31

Filing date

2004-01-27

Publication date

2011-11-15

2004-01-27 Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd

2011-11-15 Application granted granted Critical

2011-11-15 Publication of ATE532103T1 publication Critical patent/ATE532103T1/de

Links

230000035945 sensitivity Effects 0.000 title abstract 2
238000011156 evaluation Methods 0.000 title 1
239000011342 resin composition Substances 0.000 title 1
239000002253 acid Substances 0.000 abstract 4
238000004090 dissolution Methods 0.000 abstract 2
230000002401 inhibitory effect Effects 0.000 abstract 2
238000000034 method Methods 0.000 abstract 2
OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 abstract 1
-1 acrylate ester Chemical class 0.000 abstract 1
239000003513 alkali Substances 0.000 abstract 1
150000008064 anhydrides Chemical class 0.000 abstract 1
125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
238000000671 immersion lithography Methods 0.000 abstract 1
239000003960 organic solvent Substances 0.000 abstract 1
ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
239000011347 resin Substances 0.000 abstract 1
229920005989 resin Polymers 0.000 abstract 1
239000002904 solvent Substances 0.000 abstract 1

Classifications

- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/111—Polymer of unsaturated acid or ester

Landscapes

Physics & Mathematics (AREA)
Spectroscopy & Molecular Physics (AREA)
General Physics & Mathematics (AREA)
Materials For Photolithography (AREA)
Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Photosensitive Polymer And Photoresist Processing (AREA)
Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)

AT05111460T 2003-01-31 2004-01-27 Auf sensitivität basierendes evaluierungsverfahren für eine harzzusammensetzung ATE532103T1 (de)

Applications Claiming Priority (8)

Application Number	Priority Date	Filing Date	Title
JP2003025152		2003-01-31
JP2003045000		2003-02-21
JP2003062531		2003-03-07
JP2003125244		2003-04-30
JP2003157257		2003-06-02
JP2003195403		2003-07-10
JP2003426939		2003-12-24
JP2004017355A JP4434762B2 (ja)	2003-01-31	2004-01-26	レジスト組成物

Publications (1)

Publication Number	Publication Date
ATE532103T1 true ATE532103T1 (de)	2011-11-15

Family

ID=32831263

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
AT05111460T ATE532103T1 (de)	2003-01-31	2004-01-27	Auf sensitivität basierendes evaluierungsverfahren für eine harzzusammensetzung
AT04705532T ATE529780T1 (de)	2003-01-31	2004-01-27	Resistzusammensetzung

Family Applications After (1)

Application Number	Title	Priority Date	Filing Date
AT04705532T ATE529780T1 (de)	2003-01-31	2004-01-27	Resistzusammensetzung

Country Status (9)

Country	Link
US (4)	US7501220B2 (de)
EP (3)	EP1589375B1 (de)
JP (1)	JP4434762B2 (de)
KR (3)	KR100660791B1 (de)
CN (3)	CN100533143C (de)
AT (2)	ATE532103T1 (de)
SG (1)	SG133444A1 (de)
TW (3)	TWI338192B (de)
WO (1)	WO2004068242A1 (de)

Families Citing this family (113)

* Cited by examiner, † Cited by third party
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Publication number	Publication date
CN1800846A (zh)	2006-07-12
EP1589375A4 (de)	2010-02-17
CN1800847A (zh)	2006-07-12
EP1653284B1 (de)	2011-11-02
TW200426509A (en)	2004-12-01
CN1742234A (zh)	2006-03-01
CN100523804C (zh)	2009-08-05
US8198004B2 (en)	2012-06-12
JP2005208509A (ja)	2005-08-04
TW200613918A (en)	2006-05-01
WO2004068242A1 (ja)	2004-08-12
KR20060006100A (ko)	2006-01-18
SG133444A1 (en)	2007-07-30
KR20050098874A (ko)	2005-10-12
EP1653285A3 (de)	2010-01-20
JP4434762B2 (ja)	2010-03-17
KR100660791B1 (ko)	2006-12-22
ATE529780T1 (de)	2011-11-15
US20070190436A1 (en)	2007-08-16
CN100565341C (zh)	2009-12-02
KR100743416B1 (ko)	2007-07-30
EP1653285B1 (de)	2015-05-27
KR100660792B1 (ko)	2006-12-22
TW200538879A (en)	2005-12-01
US7527909B2 (en)	2009-05-05
US20070178394A1 (en)	2007-08-02
KR20060006101A (ko)	2006-01-18
EP1653284A3 (de)	2010-01-27
US7541138B2 (en)	2009-06-02
EP1653285A2 (de)	2006-05-03
CN100533143C (zh)	2009-08-26
US20090130605A1 (en)	2009-05-21
TWI304518B (en)	2008-12-21
EP1589375A1 (de)	2005-10-26
TWI317461B (en)	2009-11-21
US7501220B2 (en)	2009-03-10
US20050014090A1 (en)	2005-01-20
EP1653284A2 (de)	2006-05-03
EP1589375B1 (de)	2011-10-19
TWI338192B (en)	2011-03-01

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