ATE539446T1 - Herstellung von einem abnehmbaren halbleitersubstrat und einem halbleiterelement - Google Patents

Herstellung von einem abnehmbaren halbleitersubstrat und einem halbleiterelement

Info

Publication number
ATE539446T1
ATE539446T1 AT03780289T AT03780289T ATE539446T1 AT E539446 T1 ATE539446 T1 AT E539446T1 AT 03780289 T AT03780289 T AT 03780289T AT 03780289 T AT03780289 T AT 03780289T AT E539446 T1 ATE539446 T1 AT E539446T1
Authority
AT
Austria
Prior art keywords
substrate
layer
face
semiconductor
production
Prior art date
Application number
AT03780289T
Other languages
English (en)
Inventor
Chrystelle Lagahe
Bernard Aspar
Aurelie Beaumont
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR0212443A external-priority patent/FR2845517B1/fr
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of ATE539446T1 publication Critical patent/ATE539446T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H10P90/1914—Preparing SOI wafers using bonding
    • H10P90/1916—Preparing SOI wafers using bonding with separation or delamination along an ion implanted layer, e.g. Smart-cut
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/181—Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers
AT03780289T 2002-10-07 2003-10-03 Herstellung von einem abnehmbaren halbleitersubstrat und einem halbleiterelement ATE539446T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0212443A FR2845517B1 (fr) 2002-10-07 2002-10-07 Realisation d'un substrat semiconducteur demontable et obtention d'un element semiconducteur
FR0350130A FR2845518B1 (fr) 2002-10-07 2003-04-25 Realisation d'un substrat semiconducteur demontable et obtention d'un element semiconducteur
PCT/FR2003/050077 WO2004032183A2 (fr) 2002-10-07 2003-10-03 Realisation d'un substrat semiconducteur demontable et obtention d'un element semiconducteur.

Publications (1)

Publication Number Publication Date
ATE539446T1 true ATE539446T1 (de) 2012-01-15

Family

ID=32031847

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03780289T ATE539446T1 (de) 2002-10-07 2003-10-03 Herstellung von einem abnehmbaren halbleitersubstrat und einem halbleiterelement

Country Status (6)

Country Link
US (1) US7238598B2 (de)
EP (1) EP1550158B1 (de)
JP (1) JP4777774B2 (de)
AT (1) ATE539446T1 (de)
FR (1) FR2845518B1 (de)
WO (1) WO2004032183A2 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4277481B2 (ja) * 2002-05-08 2009-06-10 日本電気株式会社 半導体基板の製造方法、半導体装置の製造方法
JP2006270000A (ja) * 2005-03-25 2006-10-05 Sumco Corp 歪Ｓｉ−ＳＯＩ基板の製造方法および該方法により製造された歪Ｓｉ−ＳＯＩ基板
FR2898431B1 (fr) 2006-03-13 2008-07-25 Soitec Silicon On Insulator Procede de fabrication de film mince
FR2913968B1 (fr) 2007-03-23 2009-06-12 Soitec Silicon On Insulator Procede de realisation de membranes autoportees.
US7856212B2 (en) * 2007-08-07 2010-12-21 Intel Corporation Millimeter-wave phase-locked loop with injection-locked frequency divider using quarter-wavelength transmission line and method of calibration
US7977221B2 (en) * 2007-10-05 2011-07-12 Sumco Corporation Method for producing strained Si-SOI substrate and strained Si-SOI substrate produced by the same
US20090124038A1 (en) * 2007-11-14 2009-05-14 Mark Ewing Tuttle Imager device, camera, and method of manufacturing a back side illuminated imager
US20090212397A1 (en) * 2008-02-22 2009-08-27 Mark Ewing Tuttle Ultrathin integrated circuit and method of manufacturing an ultrathin integrated circuit
JP5347345B2 (ja) * 2008-06-16 2013-11-20 旭硝子株式会社 導電性マイエナイト型化合物の製造方法
US20100102419A1 (en) * 2008-10-28 2010-04-29 Eric Ting-Shan Pan Epitaxy-Level Packaging (ELP) System
WO2010062659A1 (en) * 2008-10-28 2010-06-03 Athenaeum, Llc Epitaxial film assembly system & method
US7905197B2 (en) * 2008-10-28 2011-03-15 Athenaeum, Llc Apparatus for making epitaxial film
US7967936B2 (en) * 2008-12-15 2011-06-28 Twin Creeks Technologies, Inc. Methods of transferring a lamina to a receiver element
US7927975B2 (en) 2009-02-04 2011-04-19 Micron Technology, Inc. Semiconductor material manufacture
KR101963420B1 (ko) * 2011-04-11 2019-03-28 엔디에스유 리서치 파운데이션 별개의 구성요소의 선택적인 레이저 보조 전사
US9023729B2 (en) * 2011-12-23 2015-05-05 Athenaeum, Llc Epitaxy level packaging
US9184094B1 (en) * 2012-01-26 2015-11-10 Skorpios Technologies, Inc. Method and system for forming a membrane over a cavity
WO2014020387A1 (en) 2012-07-31 2014-02-06 Soitec Methods of forming semiconductor structures including mems devices and integrated circuits on opposing sides of substrates, and related structures and devices
JP6757953B2 (ja) * 2016-08-09 2020-09-23 学校法人 名古屋電気学園 表面加工方法、構造体の製造方法
CN106896410B (zh) * 2017-03-09 2019-08-23 成都理工大学 利用声波测井资料解释岩石的变形模量和脆性指数的方法
FR3073082B1 (fr) * 2017-10-31 2019-10-11 Soitec Procede de fabrication d'un film sur un support presentant une surface non plane
FR3073083B1 (fr) * 2017-10-31 2019-10-11 Soitec Procede de fabrication d'un film sur un feuillet flexible
FR3094559B1 (fr) 2019-03-29 2024-06-21 Soitec Silicon On Insulator Procédé de transfert de paves d’un substrat donneur sur un substrat receveur

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2748851B1 (fr) * 1996-05-15 1998-08-07 Commissariat Energie Atomique Procede de realisation d'une couche mince de materiau semiconducteur
US5877070A (en) * 1997-05-31 1999-03-02 Max-Planck Society Method for the transfer of thin layers of monocrystalline material to a desirable substrate
JP3412470B2 (ja) * 1997-09-04 2003-06-03 三菱住友シリコン株式会社 Ｓｏｉ基板の製造方法
US6306729B1 (en) * 1997-12-26 2001-10-23 Canon Kabushiki Kaisha Semiconductor article and method of manufacturing the same
JPH11233449A (ja) * 1998-02-13 1999-08-27 Denso Corp 半導体基板の製造方法
JP3697106B2 (ja) * 1998-05-15 2005-09-21 キヤノン株式会社 半導体基板の作製方法及び半導体薄膜の作製方法
US6291326B1 (en) * 1998-06-23 2001-09-18 Silicon Genesis Corporation Pre-semiconductor process implant and post-process film separation
FR2784795B1 (fr) * 1998-10-16 2000-12-01 Commissariat Energie Atomique Structure comportant une couche mince de materiau composee de zones conductrices et de zones isolantes et procede de fabrication d'une telle structure
US6255195B1 (en) * 1999-02-22 2001-07-03 Intersil Corporation Method for forming a bonded substrate containing a planar intrinsic gettering zone and substrate formed by said method
US6323108B1 (en) * 1999-07-27 2001-11-27 The United States Of America As Represented By The Secretary Of The Navy Fabrication ultra-thin bonded semiconductor layers
FR2797347B1 (fr) * 1999-08-04 2001-11-23 Commissariat Energie Atomique Procede de transfert d'une couche mince comportant une etape de surfragililisation
JP4450126B2 (ja) * 2000-01-21 2010-04-14 日新電機株式会社 シリコン系結晶薄膜の形成方法
TW452866B (en) * 2000-02-25 2001-09-01 Lee Tien Hsi Manufacturing method of thin film on a substrate
FR2809867B1 (fr) * 2000-05-30 2003-10-24 Commissariat Energie Atomique Substrat fragilise et procede de fabrication d'un tel substrat
FR2811807B1 (fr) * 2000-07-12 2003-07-04 Commissariat Energie Atomique Procede de decoupage d'un bloc de materiau et de formation d'un film mince
FR2816445B1 (fr) * 2000-11-06 2003-07-25 Commissariat Energie Atomique Procede de fabrication d'une structure empilee comprenant une couche mince adherant a un substrat cible
US20020187619A1 (en) * 2001-05-04 2002-12-12 International Business Machines Corporation Gettering process for bonded SOI wafers

Also Published As

Publication number Publication date
US20060019476A1 (en) 2006-01-26
WO2004032183A2 (fr) 2004-04-15
JP4777774B2 (ja) 2011-09-21
FR2845518A1 (fr) 2004-04-09
EP1550158A2 (de) 2005-07-06
FR2845518B1 (fr) 2005-10-14
US7238598B2 (en) 2007-07-03
JP2006502593A (ja) 2006-01-19
EP1550158B1 (de) 2011-12-28
WO2004032183A3 (fr) 2004-07-29

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