ATE557053T1 - Epoxidharzzusammensetzung - Google Patents

Epoxidharzzusammensetzung

Info

Publication number
ATE557053T1
ATE557053T1 AT05730444T AT05730444T ATE557053T1 AT E557053 T1 ATE557053 T1 AT E557053T1 AT 05730444 T AT05730444 T AT 05730444T AT 05730444 T AT05730444 T AT 05730444T AT E557053 T1 ATE557053 T1 AT E557053T1
Authority
AT
Austria
Prior art keywords
epoxy resin
resin composition
phenolic
low dielectric
hydroxyl group
Prior art date
Application number
AT05730444T
Other languages
English (en)
Inventor
Toshiaki Yamada
Taku Fujino
Shin Teraki
Masaki Yoshida
Kenichi Suzuki
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Application granted granted Critical
Publication of ATE557053T1 publication Critical patent/ATE557053T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
AT05730444T 2004-04-14 2005-04-14 Epoxidharzzusammensetzung ATE557053T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004119513 2004-04-14
PCT/JP2005/007202 WO2005100435A1 (ja) 2004-04-14 2005-04-14 エポキシ樹脂組成物

Publications (1)

Publication Number Publication Date
ATE557053T1 true ATE557053T1 (de) 2012-05-15

Family

ID=35149957

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05730444T ATE557053T1 (de) 2004-04-14 2005-04-14 Epoxidharzzusammensetzung

Country Status (8)

Country Link
US (1) US20080020231A1 (de)
EP (1) EP1762582B1 (de)
JP (1) JP5015591B2 (de)
KR (1) KR101115598B1 (de)
CN (1) CN100564423C (de)
AT (1) ATE557053T1 (de)
CA (1) CA2562936A1 (de)
WO (1) WO2005100435A1 (de)

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CN1962713B (zh) * 2005-11-07 2010-05-05 中国科学院化学研究所 含氟酚醛树脂衍生物及其组合物与制备方法
JP4892295B2 (ja) * 2006-08-08 2012-03-07 ナミックス株式会社 帯電防止性絶縁材フィルム及びその製造方法
JP5159061B2 (ja) * 2006-08-08 2013-03-06 ナミックス株式会社 フィルムの製造方法
JP4980097B2 (ja) * 2007-02-28 2012-07-18 ナミックス株式会社 回転砥石用保護フィルム、回転砥石および回転砥石の製造方法
JP5080881B2 (ja) * 2007-06-27 2012-11-21 ナミックス株式会社 発光ダイオードチップの封止体の製造方法
JP5309788B2 (ja) * 2008-08-25 2013-10-09 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、プリプレグ、銅張積層板、及びビルドアップ接着フィルム用樹脂組成物
CN102030913B (zh) * 2009-09-29 2012-09-05 中国科学院理化技术研究所 一种环氧树脂薄膜的制备方法
TWI388623B (zh) * 2009-10-02 2013-03-11 Nanya Plastics Corp A thermosetting epoxy resin composition for improving the drilling processability of printed circuit boards
KR101749369B1 (ko) * 2010-03-11 2017-06-20 나믹스 가부시끼가이샤 필름용 조성물, 및 그것에 의한 접착 필름 및 커버레이 필름
KR102002161B1 (ko) 2010-10-15 2019-10-01 시리트 엘엘씨 표면 산란 안테나
US20120305291A1 (en) * 2011-05-31 2012-12-06 Daisuke Fujimoto Primer layer for plating process, laminate for wiring board and method for manufacture thereof, multilayer wiring board and method for manufacture thereof
KR101139280B1 (ko) 2012-02-10 2012-04-26 주식회사 신아티앤씨 결정성 에폭시 수지
JP5469210B2 (ja) * 2012-07-05 2014-04-16 ナミックス株式会社 フィルムの製造方法
US9385435B2 (en) 2013-03-15 2016-07-05 The Invention Science Fund I, Llc Surface scattering antenna improvements
US9923271B2 (en) 2013-10-21 2018-03-20 Elwha Llc Antenna system having at least two apertures facilitating reduction of interfering signals
US9935375B2 (en) * 2013-12-10 2018-04-03 Elwha Llc Surface scattering reflector antenna
US9825358B2 (en) 2013-12-17 2017-11-21 Elwha Llc System wirelessly transferring power to a target device over a modeled transmission pathway without exceeding a radiation limit for human beings
US9843103B2 (en) 2014-03-26 2017-12-12 Elwha Llc Methods and apparatus for controlling a surface scattering antenna array
US9882288B2 (en) 2014-05-02 2018-01-30 The Invention Science Fund I Llc Slotted surface scattering antennas
US9853361B2 (en) 2014-05-02 2017-12-26 The Invention Science Fund I Llc Surface scattering antennas with lumped elements
US10446903B2 (en) 2014-05-02 2019-10-15 The Invention Science Fund I, Llc Curved surface scattering antennas
JP6443735B2 (ja) * 2014-11-11 2018-12-26 ナミックス株式会社 樹脂組成物、それを用いた絶縁フィルムおよび半導体装置
KR20190087292A (ko) 2015-06-15 2019-07-24 시리트 엘엘씨 빔형성 안테나를 이용한 통신을 위한 방법 및 시스템
US9809720B2 (en) * 2015-07-06 2017-11-07 University Of Massachusetts Ferroelectric nanocomposite based dielectric inks for reconfigurable RF and microwave applications
DE102015213537A1 (de) * 2015-07-17 2017-01-19 Siemens Aktiengesellschaft Fester, insbesondere bandförmiger, Isolationswerkstoff, Formulierung für ein Imprägniermittel zur Herstellung eines Isolationssystems in einem Vakuumimprägnierverfahren damit und Maschinen mit derartigem Isolationssystem
CN109313963B (zh) * 2016-06-10 2022-10-25 日东电工株式会社 透明导电性薄膜及触摸面板
KR102337574B1 (ko) 2016-07-12 2021-12-13 주식회사 두산 열경화성 수지 조성물, 이를 이용한 프리프레그, 적층 시트 및 인쇄회로기판
US10361481B2 (en) 2016-10-31 2019-07-23 The Invention Science Fund I, Llc Surface scattering antennas with frequency shifting for mutual coupling mitigation
CN111378088B (zh) * 2018-12-29 2023-02-07 太阳油墨（苏州）有限公司 热固化性树脂组合物、干膜、固化物及电子部件
US10839992B1 (en) 2019-05-17 2020-11-17 Raytheon Company Thick film resistors having customizable resistances and methods of manufacture
CN115989091A (zh) * 2020-08-28 2023-04-18 中国涂料株式会社 涂料组合物、涂膜、具有涂膜的基材及其制造方法

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JPH0834835A (ja) 1994-07-26 1996-02-06 Hitachi Chem Co Ltd エポキシ樹脂組成物及びその硬化物
JPH08184857A (ja) * 1994-12-29 1996-07-16 Sharp Corp 液晶表示装置
JP3190251B2 (ja) * 1995-06-06 2001-07-23 太陽インキ製造株式会社 アルカリ現像型のフレキシブルプリント配線板用光硬化性・熱硬化性樹脂組成物
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Also Published As

Publication number Publication date
CN1942502A (zh) 2007-04-04
CA2562936A1 (en) 2005-10-27
EP1762582B1 (de) 2012-05-09
WO2005100435A1 (ja) 2005-10-27
KR101115598B1 (ko) 2012-03-14
KR20070011493A (ko) 2007-01-24
US20080020231A1 (en) 2008-01-24
CN100564423C (zh) 2009-12-02
JPWO2005100435A1 (ja) 2007-08-16
EP1762582A1 (de) 2007-03-14
JP5015591B2 (ja) 2012-08-29
EP1762582A4 (de) 2009-03-25

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