BE852341A - Composant a semiconducteurs comportant des contacts electriques et procede pour la fabrication de tels contacts - Google Patents

Composant a semiconducteurs comportant des contacts electriques et procede pour la fabrication de tels contacts

Info

Publication number
BE852341A
BE852341A BE175693A BE175693A BE852341A BE 852341 A BE852341 A BE 852341A BE 175693 A BE175693 A BE 175693A BE 175693 A BE175693 A BE 175693A BE 852341 A BE852341 A BE 852341A
Authority
BE
Belgium
Prior art keywords
contacts
manufacturing
semiconductor component
component containing
containing electrical
Prior art date
Application number
BE175693A
Other languages
English (en)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of BE852341A publication Critical patent/BE852341A/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49179—Assembling terminal to elongated conductor by metal fusion bonding
BE175693A 1976-03-12 1977-03-10 Composant a semiconducteurs comportant des contacts electriques et procede pour la fabrication de tels contacts BE852341A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762610539 DE2610539A1 (de) 1976-03-12 1976-03-12 Halbleiterbauelement mit elektrischen kontakten und verfahren zur herstellung solcher kontakte

Publications (1)

Publication Number Publication Date
BE852341A true BE852341A (fr) 1977-07-01

Family

ID=5972327

Family Applications (1)

Application Number Title Priority Date Filing Date
BE175693A BE852341A (fr) 1976-03-12 1977-03-10 Composant a semiconducteurs comportant des contacts electriques et procede pour la fabrication de tels contacts

Country Status (14)

Country Link
US (1) US4164811A (fr)
JP (1) JPS52111376A (fr)
AT (1) AT361983B (fr)
BE (1) BE852341A (fr)
CA (1) CA1065499A (fr)
CH (1) CH614071A5 (fr)
DE (1) DE2610539A1 (fr)
DK (1) DK103277A (fr)
FR (1) FR2344129A1 (fr)
GB (1) GB1531394A (fr)
IT (1) IT1077688B (fr)
MX (1) MX143414A (fr)
NL (1) NL7702439A (fr)
SE (1) SE7702371L (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53103659U (fr) * 1977-01-25 1978-08-21
JPS5915376B2 (ja) * 1977-10-18 1984-04-09 信越ポリマ−株式会社 電子回路部品
GB2138205B (en) * 1983-04-13 1986-11-05 Philips Electronic Associated Methods of manufacturing a microwave circuit
GB8324839D0 (en) * 1983-09-16 1983-10-19 Lucas Ind Plc Mounting carrier for microelectronic silicon chip
DE69622412T2 (de) * 1995-08-29 2003-03-20 Minnesota Mining And Mfg. Co., Saint Paul Verfahren zur herstellung einer elektronischen anordnung mit klebeverbindung mittels eines nachgiebigen substrats
JP2006082479A (ja) * 2004-09-17 2006-03-30 Koito Mfg Co Ltd 車輌用灯具の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2990498A (en) * 1956-07-02 1961-06-27 Gen Electric Capacitor
US2977672A (en) * 1958-12-12 1961-04-04 Gen Electric Method of making bonded wire circuit
US3213404A (en) * 1961-08-01 1965-10-19 Thomas & Betts Corp Means for connecting electrical conductors
US3418444A (en) * 1963-10-21 1968-12-24 Elco Corp Method and apparatus for bonding through insulating material
US3300851A (en) * 1964-01-02 1967-01-31 Gen Electric Method of making bonded wire circuits
US3368276A (en) * 1964-08-03 1968-02-13 Coilcraft Inc Method for mounting a circuit element
US3390252A (en) * 1965-10-22 1968-06-25 Philco Ford Corp Electric heating tool
US4012833A (en) * 1973-12-28 1977-03-22 Sony Corporation Method of making display structure having light emitting diodes
US4024627A (en) * 1974-04-29 1977-05-24 Amp Incorporated Package mounting of electronic chips, such as light emitting diodes
US4079284A (en) * 1976-05-03 1978-03-14 U.S. Philips Corporation Mounting piezoelectric elements

Also Published As

Publication number Publication date
FR2344129A1 (fr) 1977-10-07
DE2610539A1 (de) 1977-09-22
FR2344129B1 (fr) 1981-12-11
NL7702439A (nl) 1977-09-14
GB1531394A (en) 1978-11-08
US4164811A (en) 1979-08-21
MX143414A (es) 1981-05-06
AT361983B (de) 1981-04-10
JPS52111376A (en) 1977-09-19
CH614071A5 (fr) 1979-10-31
DK103277A (da) 1977-09-13
ATA149277A (de) 1980-09-15
IT1077688B (it) 1985-05-04
CA1065499A (fr) 1979-10-30
SE7702371L (sv) 1977-09-13

Similar Documents

Publication Publication Date Title
BE798883A (fr) Procede pour la fabrication d'un dispositif semiconducteur comportant une configuration de conducteurs et dispositif fabrique de la sorte
FR2325192A1 (fr) Procede pour la fabrication d'un dispositif semiconducteur, et dispositif semiconducteur fabrique de la sorte
FR2334182A1 (fr) Cable comportant un compose supraconducteur et procede de fabrication d'un tel cable
BE845471A (fr) Composant d'electrique sur semi-conducteur a liaison electrostatique et procede de fabrication d'un tel composant
IT7922105A0 (it) Processo per fabbricare contatti conduttivi in dispositivi semiconduttori.
BE857663A (fr) Procede de fabrication de circuits integres programmables
FR2301092A1 (fr) Procede de fabrication d'un semi-conducteur et semi-conducteur obtenu
FR2316712A1 (fr) Procede de fabrication de bobinages pour machines et appareils electriques
JPS54153585A (en) Method of fabricating semiconductor device having contact
FR2310619A1 (fr) Procede de fabrication d'un conducteur electrique isole thermiquement et revetu de polymere et conducteur ainsi obtenu
BE782242A (fr) Procede de fabrication de paquets de toles pour circuits magnetiques demachines et d'appareils electriques
FR2530066B1 (fr) Matieres pour contact electrique et procede pour leur fabrication
BE870878A (fr) Circuits electriques integres proteges, substrats d'interconnexion proteges comportant de tels circuits et procede d'obtention desdits circuits et substrats
FR2277434A1 (fr) Composant a semi-conducteurs comportant un support dielectrique et son procede de fabrication
FR2299725A1 (fr) Composant de circuit integre et procede de fabrication d'un tel composant
BE791881A (fr) Procede de fabrication de contacts electriques et dispositif pour la mise en oeuvre du procede
GB2151529B (en) Method for making electrical contact to semiconductor devices
JPS5715463A (en) Method of forming contact for double polysilicon semiconductor device
BE822787A (fr) Dispositif de branchement de fils electriques et procede de fabrication d'un tel dispositif
BE852341A (fr) Composant a semiconducteurs comportant des contacts electriques et procede pour la fabrication de tels contacts
FR2308199A1 (fr) Procede de fabrication de composants semi-conducteurs et composants obtenus
FR2286579A1 (fr) Procede pour fabriquer des microcablages pour la realisation de contacts sur des circuits a semi-conducteurs
FR2350693A1 (fr) Procede pour ameliorer les caracteristiques electriques des dispositifs semi-conducteurs
FR2312173A1 (fr) Dispositif pour la fabrication d'un ensemble de conducteurs electriques
FR2342545A1 (fr) Procede pour la fabrication de conducteurs electriques