BR0014819A - Método de produção de placas de chip sem contato e de produção de unidades elétricas que consistem em chips com elementos de contato - Google Patents

Método de produção de placas de chip sem contato e de produção de unidades elétricas que consistem em chips com elementos de contato

Info

Publication number
BR0014819A
BR0014819A BR0014819-9A BR0014819A BR0014819A BR 0014819 A BR0014819 A BR 0014819A BR 0014819 A BR0014819 A BR 0014819A BR 0014819 A BR0014819 A BR 0014819A
Authority
BR
Brazil
Prior art keywords
chips
contact
contact elements
producing
electrical units
Prior art date
Application number
BR0014819-9A
Other languages
English (en)
Inventor
Andreas Plettner
Original Assignee
Andreas Plettner
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19948555A external-priority patent/DE19948555A1/de
Application filed by Andreas Plettner filed Critical Andreas Plettner
Publication of BR0014819A publication Critical patent/BR0014819A/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacture Of Switches (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

"MéTODO DE PRODUçãO DE PLACAS DE CHIP SEM CONTATO E DE PRODUçãO DE UNIDADES ELéTRICAS QUE CONSISTEM EM CHIPS COM ELEMENTOS DE CONTATO". Trata-se de um método de produção de placas de chip sem contato e de produção de unidades elétricas que consistem em chips com elementos de contato, sendo que os elementos de contato são adequados para a conexão direta com os terminais de contato de componentes elétricos externos de uma maneira eletricamente condutora, onde a conexão dos elementos de contato com os chips é efetuada antes que os chips individuais sejam removidos do agrupamento predefinido pela pastilha e que consiste em fileiras e colunas, e os elementos de contato são feitos de uma folha de plástico metalizada ou uma folha metálica a ser aplicada nos chips.
BR0014819-9A 1999-10-08 2000-10-06 Método de produção de placas de chip sem contato e de produção de unidades elétricas que consistem em chips com elementos de contato BR0014819A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19948555A DE19948555A1 (de) 1999-12-03 1999-10-08 Verfahren zur Herstellung kontaktloser Chipkarten sowie zur Herstellung von elektrischen Einheiten, bestehend aus Chips mit Kontaktelementen
PCT/EP2000/009818 WO2001027871A2 (de) 1999-10-08 2000-10-06 Verfahren zur herstellung kontaktloser chipkarten sowie zur herstellung von elektrischen einheiten, bestehend aus chips mit kontaktelementen

Publications (1)

Publication Number Publication Date
BR0014819A true BR0014819A (pt) 2002-06-11

Family

ID=7924978

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0014819-9A BR0014819A (pt) 1999-10-08 2000-10-06 Método de produção de placas de chip sem contato e de produção de unidades elétricas que consistem em chips com elementos de contato

Country Status (7)

Country Link
EP (1) EP1224618B1 (pt)
JP (1) JP4733327B2 (pt)
CN (1) CN1238811C (pt)
AT (1) ATE237849T1 (pt)
AU (1) AU7662700A (pt)
BR (1) BR0014819A (pt)
WO (1) WO2001027871A2 (pt)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60317375T2 (de) * 2003-05-28 2008-08-28 Hitachi, Ltd. Funkerkennungshalbleitereinrichtung und herstellungsverfahren dafür
FR2940486B1 (fr) * 2008-12-22 2011-02-11 Commissariat Energie Atomique Procede de fabrication d'un assemblage de puces a moyens d'emission-reception radiofrequence reliees mecaniquement au moyen d'un ruban et assemblage

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS514628B1 (pt) * 1970-02-05 1976-02-13
JPS624351A (ja) * 1985-06-29 1987-01-10 Toshiba Corp 半導体キヤリアの製造方法
JPH04127442A (ja) * 1990-09-18 1992-04-28 Sharp Corp ダイボンディング装置
JPH08125154A (ja) * 1994-10-24 1996-05-17 Olympus Optical Co Ltd 半導体装置の製造方法
JPH10209226A (ja) * 1997-01-23 1998-08-07 Mitsubishi Electric Corp 半導体部材、及び半導体チップ
FR2761527B1 (fr) * 1997-03-25 1999-06-04 Gemplus Card Int Procede de fabrication de carte sans contact avec connexion d'antenne par fils soudes
JPH1140522A (ja) * 1997-07-17 1999-02-12 Rohm Co Ltd 半導体ウエハの製造方法、この方法により作製された半導体ウエハ、半導体チップの製造方法、およびこの方法により製造された半導体チップ、ならびにこの半導体チップを備えたｉｃカード
JP3173493B2 (ja) * 1999-02-18 2001-06-04 日本電気株式会社 半導体装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
CN1238811C (zh) 2006-01-25
CN1384951A (zh) 2002-12-11
EP1224618B1 (de) 2003-04-16
EP1224618A2 (de) 2002-07-24
WO2001027871A2 (de) 2001-04-19
ATE237849T1 (de) 2003-05-15
AU7662700A (en) 2001-04-23
WO2001027871A3 (de) 2001-11-01
JP4733327B2 (ja) 2011-07-27
JP2003511869A (ja) 2003-03-25

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]