BR0209331A - Metalização eletrolìtica direta de substratos não condutores - Google Patents

Metalização eletrolìtica direta de substratos não condutores

Info

Publication number
BR0209331A
BR0209331A BR0209331-6A BR0209331A BR0209331A BR 0209331 A BR0209331 A BR 0209331A BR 0209331 A BR0209331 A BR 0209331A BR 0209331 A BR0209331 A BR 0209331A
Authority
BR
Brazil
Prior art keywords
substrate surfaces
electrolytically
sulfonic acid
treating
direct metallization
Prior art date
Application number
BR0209331-6A
Other languages
English (en)
Other versions
BR0209331B1 (pt
Inventor
Regina Czeczka
Lutz Stamp
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of BR0209331A publication Critical patent/BR0209331A/pt
Publication of BR0209331B1 publication Critical patent/BR0209331B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

"METALIZAçãO ELETROLìTICA DIRETA DE SUBSTRATOS NãO CONDUTORES". A presente invenção refere-se a um processo para a metalização eletrolítica direta de superfícies de substrato eletricamente não condutor, que compreende colocar as superfícies do substrato em contato com um polímero solúvel em água; tratar as superfícies do substrato com uma solução de permanganato; tratar as superfícies do substrato com uma solução aquosa ácida ou uma microemulsão ácida de base aquosa contendo, pelo menos, um composto de tiofeno e, pelo menos, um ácido alcanossulfónico, selecionado do grupo que compreende ácido metanossulfónico, ácido etanossulfónico e ácido etanodissulfónico; e metalizar eletroliticamente as superfícies do substrato.
BRPI0209331-6A 2001-05-18 2002-05-13 processo para a metalização eletrolìtica direta de superfìcies de substratos eletricamente não condutores. BR0209331B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10124631A DE10124631C1 (de) 2001-05-18 2001-05-18 Verfahren zum direkten elektrolytischen Metallisieren von elektrisch nichtleiteitenden Substratoberflächen
PCT/EP2002/005250 WO2002095091A2 (en) 2001-05-18 2002-05-13 Direct electrolytic metallization of non-conducting substrates

Publications (2)

Publication Number Publication Date
BR0209331A true BR0209331A (pt) 2004-10-13
BR0209331B1 BR0209331B1 (pt) 2011-11-29

Family

ID=7685522

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0209331-6A BR0209331B1 (pt) 2001-05-18 2002-05-13 processo para a metalização eletrolìtica direta de superfìcies de substratos eletricamente não condutores.

Country Status (14)

Country Link
US (1) US7025867B2 (pt)
EP (1) EP1390568B1 (pt)
JP (1) JP4686113B2 (pt)
KR (1) KR100863161B1 (pt)
CN (1) CN1329557C (pt)
AT (1) ATE272730T1 (pt)
BR (1) BR0209331B1 (pt)
CA (1) CA2437105A1 (pt)
DE (2) DE10124631C1 (pt)
ES (1) ES2225785T3 (pt)
MX (1) MXPA03010344A (pt)
MY (1) MY126221A (pt)
TW (1) TW555893B (pt)
WO (1) WO2002095091A2 (pt)

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JP2013534367A (ja) 2010-08-02 2013-09-02 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 基板上にはんだ堆積物および非溶融バンプを形成する方法
EP2506690A1 (en) 2011-03-28 2012-10-03 Atotech Deutschland GmbH Method to form solder deposits and non-melting bump structures on substrates
PL2447296T3 (pl) * 2010-10-29 2018-06-29 Macdermid Enthone Inc. Kompozycja i sposób osadzania przewodzących polimerów na podłożach dielektrycznych
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CN104204294B (zh) * 2012-03-29 2018-12-07 德国艾托特克公司 促进介电衬底与金属层之间粘着度的方法
EP2644744A1 (en) 2012-03-29 2013-10-02 Atotech Deutschland GmbH Method for promoting adhesion between dielectric substrates and metal layers
EP2645830B1 (en) 2012-03-29 2014-10-08 Atotech Deutschland GmbH Method for manufacture of fine line circuitry
CN104145537A (zh) * 2012-03-29 2014-11-12 德国艾托特克公司 细线电路的制造方法
EP2657367B1 (en) 2012-04-24 2015-11-25 Enthone Inc. Pre-etching composition and etching process for plastic substrates
EP2709160B1 (en) 2012-09-14 2016-03-30 ATOTECH Deutschland GmbH Method for metallization of solar cell substrates
KR101294229B1 (ko) * 2012-12-10 2013-08-07 와이엠티 주식회사 인쇄회로기판의 쓰루 홀 또는 비아 홀 내벽에 전도성폴리머층을 형성하는 방법
CN104284527A (zh) * 2013-07-01 2015-01-14 深圳市环基实业有限公司 印刷电路板及其制作方法
CN104427744A (zh) * 2013-08-30 2015-03-18 富葵精密组件(深圳)有限公司 电路板及其制作方法
US10487404B2 (en) 2013-09-26 2019-11-26 Atotech Deutschland Gmbh Adhesion promoting process for metallisation of substrate surfaces
BR112015016031A2 (pt) * 2013-10-22 2017-07-11 Okuno Chem Ind Co composição para tratamento de decapagem de material de resina
JP6406841B2 (ja) * 2014-03-24 2018-10-17 アトテック・ドイチュラント・ゲーエムベーハーＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ Ｇｍｂｈ 金属層形成方法およびプリント回路基板製造方法
CN104080278B (zh) * 2014-06-24 2017-06-06 柏承科技(昆山)股份有限公司 线路板高分子导电膜孔工艺及其搭配图形电镀的生产工艺
JP6562651B2 (ja) * 2015-02-20 2019-08-21 キヤノン株式会社 半導体装置の製造方法
CN105132977B (zh) * 2015-08-31 2017-12-29 广东东硕科技有限公司 一种用于线路板制造的调整液及其制备方法
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US10151035B2 (en) 2016-05-26 2018-12-11 Rohm And Haas Electronic Materials Llc Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts
ES2708341T3 (es) 2016-11-22 2019-04-09 Macdermid Enthone Gmbh Grabado exento de cromo para un galvanizado sobre plástico
CN107723764A (zh) * 2017-10-31 2018-02-23 电子科技大学 一种在绝缘基材上直接电镀的方法
CN108601235A (zh) * 2017-12-28 2018-09-28 广东光华科技股份有限公司 绝缘基材表面电镀金属的方法
CN108645822A (zh) * 2018-06-19 2018-10-12 华电电力科学研究院有限公司 一种自动测定油品破乳化度的装置及测定方法
CN108977862B (zh) * 2018-08-30 2022-08-05 广东东硕科技有限公司 绝缘基材表面电镀金属的方法
CN111171356B (zh) 2018-10-24 2021-06-22 电子科技大学 一种制备复合型导电聚合物的方法
KR102876645B1 (ko) 2021-02-08 2025-10-28 맥더미드 엔쏜 인코포레이티드 확산 장벽 형성을 위한 방법 및 습식 화학 조성물
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Also Published As

Publication number Publication date
TW555893B (en) 2003-10-01
KR20030097882A (ko) 2003-12-31
DE10124631C1 (de) 2002-11-21
CN1612951A (zh) 2005-05-04
ES2225785T3 (es) 2005-03-16
JP2004526869A (ja) 2004-09-02
BR0209331B1 (pt) 2011-11-29
US20040112755A1 (en) 2004-06-17
WO2002095091A2 (en) 2002-11-28
KR100863161B1 (ko) 2008-10-13
EP1390568A2 (en) 2004-02-25
HK1060753A1 (en) 2004-08-20
US7025867B2 (en) 2006-04-11
EP1390568B1 (en) 2004-08-04
DE60200891D1 (de) 2004-09-09
MXPA03010344A (es) 2004-03-10
MY126221A (en) 2006-09-29
CN1329557C (zh) 2007-08-01
WO2002095091A3 (en) 2003-11-13
CA2437105A1 (en) 2002-11-28
JP4686113B2 (ja) 2011-05-18
DE60200891T2 (de) 2005-08-18
ATE272730T1 (de) 2004-08-15

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Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 13/05/2002, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 14A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2385 DE 20-09-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.