BRPI0408747A - revestimentos em pó e processo para a preparação de camadas finas na fabricação de placas de circuitos impressos - Google Patents

revestimentos em pó e processo para a preparação de camadas finas na fabricação de placas de circuitos impressos

Info

Publication number
BRPI0408747A
BRPI0408747A BRPI0408747-0A BRPI0408747A BRPI0408747A BR PI0408747 A BRPI0408747 A BR PI0408747A BR PI0408747 A BRPI0408747 A BR PI0408747A BR PI0408747 A BRPI0408747 A BR PI0408747A
Authority
BR
Brazil
Prior art keywords
manufacture
printed circuit
circuit boards
thin layer
preparation process
Prior art date
Application number
BRPI0408747-0A
Other languages
English (en)
Inventor
Christoph Rickert
Juergen Kress
Sandro Cicchetti
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2003113555 external-priority patent/DE10313555A1/de
Priority claimed from DE2003113556 external-priority patent/DE10313556A1/de
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of BRPI0408747A publication Critical patent/BRPI0408747A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/03—Powdery paints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1355—Powder coating of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

"REVESTIMENTOS EM Pó E PROCESSO PARA A PREPARAçãO DE CAMADAS FINAS NA FABRICAçãO DE PLACAS DE CIRCUITOS IMPRESSOS". A presente invenção refere-se a um revestimento em pó, uma dispersão aquosa com base no revestimento em pó, um processo para sua preparação e um processo para a preparação de camadas de revestimento sobre substratos, inter alia, para a preparação de estruturas com múltiplas camadas. O processo não requer o uso de quaisquer solventes orgânicos.
BRPI0408747-0A 2003-03-26 2004-03-22 revestimentos em pó e processo para a preparação de camadas finas na fabricação de placas de circuitos impressos BRPI0408747A (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE2003113555 DE10313555A1 (de) 2003-03-26 2003-03-26 Pulverlack und Verfahren für die Erzeugung dünner Schichten im Leiterplattenbau
DE2003113556 DE10313556A1 (de) 2003-03-26 2003-03-26 Pulverlack und Verfahren für die Erzeugung dünner Schichten im Leiterplattenbau
PCT/EP2004/003001 WO2004085550A2 (en) 2003-03-26 2004-03-22 Powder coating and process for the preparation of thin layers in the manufacture of printed circuit boards

Publications (1)

Publication Number Publication Date
BRPI0408747A true BRPI0408747A (pt) 2006-03-28

Family

ID=33099289

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0408747-0A BRPI0408747A (pt) 2003-03-26 2004-03-22 revestimentos em pó e processo para a preparação de camadas finas na fabricação de placas de circuitos impressos

Country Status (8)

Country Link
US (1) US20070093620A1 (pt)
EP (1) EP1606358A2 (pt)
JP (1) JP5602334B2 (pt)
KR (1) KR101159287B1 (pt)
BR (1) BRPI0408747A (pt)
CA (1) CA2520132A1 (pt)
TW (1) TWI392713B (pt)
WO (1) WO2004085550A2 (pt)

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* Cited by examiner, † Cited by third party
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EP1854827B1 (de) * 2006-05-11 2015-04-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Flammfeste, niedrigtemperaturhärtende, cyanatbasierte Harze mit verbesserten Eigenschaften
EP2070962B1 (en) 2007-12-12 2010-08-18 ATOTECH Deutschland GmbH Solid powder formulations for the preparation of resin-coated foils and their use in the manufacture of printed circuit boards
WO2010079181A1 (de) * 2009-01-06 2010-07-15 Ewald Dörken Ag Verfahren zur herstellung eines pulverlacks
DE102009009650B4 (de) 2009-02-19 2013-10-10 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum Herstellen einer Kunststoffschicht sowie deren Verwendung
EP2448380A1 (en) * 2010-10-26 2012-05-02 ATOTECH Deutschland GmbH Composite build-up material for embedding of circuitry
JP6680523B2 (ja) * 2015-12-07 2020-04-15 ソマール株式会社 粉体塗料
JP6761573B2 (ja) * 2015-12-21 2020-09-30 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
WO2020130097A1 (ja) * 2018-12-21 2020-06-25 日立化成株式会社 封止組成物及び半導体装置
US11134575B2 (en) * 2019-09-30 2021-09-28 Gentherm Gmbh Dual conductor laminated substrate
WO2021108775A1 (en) * 2019-11-27 2021-06-03 Hsio Technologies, Llc Pcb fabrication with dielectric powder or suspension
US12559620B2 (en) 2020-07-07 2026-02-24 Ppg Industries Ohio, Inc. Curable coating compositions
TWI833095B (zh) * 2020-07-28 2024-02-21 美商聖高拜塑膠製品公司 敷銅層板、含其之印刷電路基板及其形成方法
CN111909594A (zh) * 2020-08-11 2020-11-10 江苏万源新材料股份有限公司 一种有防腐功能的分子筛涂层铝箔及其制备工艺
CA3209305A1 (en) * 2022-08-17 2024-02-17 Ppg Industries Ohio, Inc. Dielectric coatings

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JPS5853673B2 (ja) * 1979-03-22 1983-11-30 日立化成工業株式会社 化学メッキ用粉末塗料の製造法
JPS57162764A (en) * 1981-03-31 1982-10-06 Hitachi Chem Co Ltd Preparation of chemically platable powder coating
JPS617331A (ja) * 1984-06-21 1986-01-14 Mitsubishi Gas Chem Co Inc 難燃性の硬化性樹脂組成物
JPH0660294B2 (ja) * 1986-06-05 1994-08-10 ソマ−ル株式会社 エポキシ樹脂系粉体塗料組成物
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Also Published As

Publication number Publication date
CA2520132A1 (en) 2004-10-07
JP5602334B2 (ja) 2014-10-08
WO2004085550A3 (en) 2005-08-18
WO2004085550A2 (en) 2004-10-07
KR101159287B1 (ko) 2012-07-03
TW200420692A (en) 2004-10-16
US20070093620A1 (en) 2007-04-26
KR20050109598A (ko) 2005-11-21
TWI392713B (zh) 2013-04-11
JP2006521434A (ja) 2006-09-21
EP1606358A2 (en) 2005-12-21

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 10A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2259 DE 22/04/2014.