BRPI0416519A - composição oligomérica lìquida, produto polimerizado curado, método para fabricar e para usar uma composição oligomérica lìquida, e, substrato - Google Patents
composição oligomérica lìquida, produto polimerizado curado, método para fabricar e para usar uma composição oligomérica lìquida, e, substratoInfo
- Publication number
- BRPI0416519A BRPI0416519A BRPI0416519-5A BRPI0416519A BRPI0416519A BR PI0416519 A BRPI0416519 A BR PI0416519A BR PI0416519 A BRPI0416519 A BR PI0416519A BR PI0416519 A BRPI0416519 A BR PI0416519A
- Authority
- BR
- Brazil
- Prior art keywords
- oligomeric composition
- liquid oligomeric
- liquid
- substrate
- composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G16/00—Condensation polymers of aldehydes or ketones with monomers not provided for in the groups C08G4/00 - C08G14/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/103—Esters of polyhydric alcohols or polyhydric phenols of trialcohols, e.g. trimethylolpropane tri(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/10—Definition of the polymer structure
- C08G2261/13—Morphological aspects
- C08G2261/135—Cross-linked structures
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
- C08G2261/33—Monomer units or repeat units incorporating structural elements in the main chain incorporating non-aromatic structural elements in the main chain
- C08G2261/334—Monomer units or repeat units incorporating structural elements in the main chain incorporating non-aromatic structural elements in the main chain containing heteroatoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/70—Post-treatment
- C08G2261/76—Post-treatment crosslinking
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Paints Or Removers (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/712,044 US7041749B2 (en) | 2002-12-17 | 2003-11-14 | Dual cure reaction products of self-photoinitiating multifunction acrylates with cycloaliphatic epoxy compounds |
| PCT/US2004/037807 WO2005048866A2 (fr) | 2003-11-14 | 2004-11-12 | Produits reactionnels a double durcissement a base d'acrylates multifonctionnels a photo-initiation spontanee comprenant des composes epoxydiques cycloaliphatiques |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0416519A true BRPI0416519A (pt) | 2007-03-06 |
Family
ID=34619849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0416519-5A BRPI0416519A (pt) | 2003-11-14 | 2004-11-12 | composição oligomérica lìquida, produto polimerizado curado, método para fabricar e para usar uma composição oligomérica lìquida, e, substrato |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1685193A4 (fr) |
| JP (1) | JP2007511641A (fr) |
| KR (1) | KR20070097294A (fr) |
| CN (1) | CN1910234A (fr) |
| BR (1) | BRPI0416519A (fr) |
| CA (1) | CA2545998A1 (fr) |
| WO (1) | WO2005048866A2 (fr) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4888766B2 (ja) * | 2006-07-11 | 2012-02-29 | 日東電工株式会社 | 多官能化合物の製造方法 |
| GB0700960D0 (en) * | 2007-01-18 | 2007-02-28 | 3M Innovative Properties Co | High strength epoxy adhesive and uses thereof |
| CN102159642B (zh) | 2008-07-23 | 2015-07-22 | 3M创新有限公司 | 双组分环氧基结构粘合剂 |
| EP2315741B1 (fr) | 2008-07-23 | 2015-04-08 | 3M Innovative Properties Company | Modificateurs liquides réactifs |
| EP2310436B1 (fr) | 2008-07-23 | 2012-12-26 | 3M Innovative Properties Company | Adhésifs structurels à base d'époxy en deux parties |
| CN102311520A (zh) * | 2011-08-05 | 2012-01-11 | 大连方盛塑料有限公司 | 一种热塑性塑料 |
| ES2639396T3 (es) | 2011-10-07 | 2017-10-26 | Allnex Netherlands B.V. | Una composición para su uso en un proceso para la preparación de una composición reticulable por RMA |
| ES2802811T3 (es) * | 2012-03-05 | 2021-01-21 | Archer Daniels Midland Co | Uso de microemulsiones como sistemas de administración |
| JP6183642B2 (ja) | 2012-08-10 | 2017-08-23 | 株式会社リコー | 活性光線硬化組成物、並びにこれを用いた活性光線硬化型インクジェット印刷用インク組成物及び活性光線硬化型接着剤組成物 |
| BR112015025624B1 (pt) | 2013-04-08 | 2021-09-08 | Allnex Netherlands B.V | Composição reticulável, kit, método para preparação de uma composição reticulável, e, composições de revestimento |
| WO2016050398A1 (fr) * | 2014-10-01 | 2016-04-07 | Basf Se | Procédé pour faire durcir des compositions durcissables |
| EP3283588B1 (fr) | 2015-04-17 | 2025-06-18 | Allnex Netherlands B.V. | Résine réticulable rma et son utilisation dans des compositions réticulables rma |
| EP3283583A1 (fr) | 2015-04-17 | 2018-02-21 | Allnex Netherlands B.V. | Procédé de production d'une composition réticulable |
| WO2016166361A1 (fr) | 2015-04-17 | 2016-10-20 | Nuplex Resins B.V. | Compositions de revêtement de sol |
| US20180163081A1 (en) | 2015-04-17 | 2018-06-14 | Allnex Netherlands B.V. | A rma crosslinkable composition with improved adhesion |
| EP3115381A1 (fr) * | 2015-07-10 | 2017-01-11 | Université de Haute Alsace | Système de polymérisation par addition de michael à double clic et photopolymérisation |
| CN105082669B (zh) * | 2015-09-23 | 2016-09-28 | 李会录 | 一种环氧玻纤布覆铜板的生产方法 |
| US10486452B2 (en) * | 2016-02-26 | 2019-11-26 | Amcor Flexibles Selestat Sas | Flexible packaging substrates compromising thermally-stable prints |
| KR102065717B1 (ko) * | 2016-12-26 | 2020-01-13 | 주식회사 엘지화학 | 편광자 보호 필름, 이를 포함하는 편광판, 상기 편광판을 포함하는 액정 디스플레이 장치, 및 편광자 보호 필름용 코팅 조성물 |
| CN108641550A (zh) * | 2018-05-25 | 2018-10-12 | 广州惠利电子材料有限公司 | 一种阳离子uv固化绝缘保护胶及其制备方法和应用 |
| CN113438992A (zh) * | 2018-12-18 | 2021-09-24 | 隆萨解决方案股份公司 | 无异氰酸酯的粘合剂 |
| CN112552483B (zh) * | 2020-11-16 | 2023-06-30 | 新丰见微化工实业有限公司 | 一种自感光环氧甲基丙烯酸酯树脂及其合成方法 |
| EP4590734A1 (fr) * | 2022-09-20 | 2025-07-30 | PPG Industries Ohio Inc. | Système de revêtement multicouches |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5218018A (en) * | 1989-12-29 | 1993-06-08 | Kansai Paint Co., Ltd. | Hydroxyl and carboxyl groups-containing resin with alicyclic polyepoxide |
| JPH0748472A (ja) * | 1993-08-06 | 1995-02-21 | Mitsubishi Rayon Co Ltd | 架橋剤 |
| ATE162176T1 (de) * | 1993-10-22 | 1998-01-15 | Eastman Chem Co | Auf polyolester der 2-acetylglutarsäure basierte vernetzungsmittel |
| AU672337B2 (en) * | 1993-10-27 | 1996-09-26 | Nippon Paint Co., Ltd. | Curable resin composition for coating uses |
| US6025410A (en) * | 1997-09-19 | 2000-02-15 | Ashland Inc. | Liquid oligomers containing acrylate unsaturation |
| US5945489A (en) * | 1997-09-19 | 1999-08-31 | Ashland, Inc. | Liquid oligomers containing unsaturation |
| JPH1192546A (ja) * | 1997-09-22 | 1999-04-06 | Toyo Ink Mfg Co Ltd | 硬化性樹脂組成物 |
| GB2332202A (en) * | 1997-12-09 | 1999-06-16 | Courtaulds Coatings | Curable epoxy resin compositions |
| CA2378938A1 (fr) * | 2001-03-27 | 2002-09-27 | Takashi Irie | Revetement thermodurcissable, et methode de formation de pellicule protectrice avec ce revetement |
| TWI329105B (en) * | 2002-02-01 | 2010-08-21 | Rigel Pharmaceuticals Inc | 2,4-pyrimidinediamine compounds and their uses |
| US6706414B1 (en) * | 2002-09-26 | 2004-03-16 | Ashland Inc. | Liquid uncrosslinked Michael addition oligomers prepared in the presence of a catalyst having both an epoxy moiety and a quaternary salt |
| JP2005041923A (ja) * | 2003-07-23 | 2005-02-17 | Dainippon Ink & Chem Inc | 紫外線硬化型組成物 |
| US7169825B2 (en) * | 2003-07-29 | 2007-01-30 | Ashland Licensing And Intellectual Property Llc | Dual cure reaction products of self-photoinitiating multifunctional acrylates with thiols and synthetic methods |
-
2004
- 2004-11-12 KR KR1020067009414A patent/KR20070097294A/ko not_active Withdrawn
- 2004-11-12 BR BRPI0416519-5A patent/BRPI0416519A/pt not_active IP Right Cessation
- 2004-11-12 JP JP2006539903A patent/JP2007511641A/ja active Pending
- 2004-11-12 WO PCT/US2004/037807 patent/WO2005048866A2/fr not_active Ceased
- 2004-11-12 CN CNA2004800400102A patent/CN1910234A/zh active Pending
- 2004-11-12 EP EP04810830A patent/EP1685193A4/fr not_active Withdrawn
- 2004-11-12 CA CA002545998A patent/CA2545998A1/fr not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CA2545998A1 (fr) | 2005-06-02 |
| KR20070097294A (ko) | 2007-10-04 |
| WO2005048866A2 (fr) | 2005-06-02 |
| CN1910234A (zh) | 2007-02-07 |
| JP2007511641A (ja) | 2007-05-10 |
| EP1685193A2 (fr) | 2006-08-02 |
| EP1685193A4 (fr) | 2006-12-13 |
| WO2005048866A3 (fr) | 2005-09-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE AS 6A E 7A ANUIDADES. |
|
| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2158 DE 15/05/2012. |