BRPI0516699A - composição de resina epóxi adesiva curável, processo para preparar uma composição de resina epóxi adesiva curável e dois ou mais substratos - Google Patents
composição de resina epóxi adesiva curável, processo para preparar uma composição de resina epóxi adesiva curável e dois ou mais substratosInfo
- Publication number
- BRPI0516699A BRPI0516699A BRPI0516699-3A BRPI0516699A BRPI0516699A BR PI0516699 A BRPI0516699 A BR PI0516699A BR PI0516699 A BRPI0516699 A BR PI0516699A BR PI0516699 A BRPI0516699 A BR PI0516699A
- Authority
- BR
- Brazil
- Prior art keywords
- epoxy resin
- resin composition
- curable adhesive
- adhesive epoxy
- copolymer
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 8
- 229920000647 polyepoxide Polymers 0.000 title abstract 8
- 239000000203 mixture Substances 0.000 title abstract 6
- 239000000853 adhesive Substances 0.000 title abstract 3
- 230000001070 adhesive effect Effects 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
- 239000004721 Polyphenylene oxide Substances 0.000 abstract 4
- 229920000570 polyether Polymers 0.000 abstract 4
- 229920000469 amphiphilic block copolymer Polymers 0.000 abstract 2
- 229920001400 block copolymer Polymers 0.000 abstract 2
- 239000004840 adhesive resin Substances 0.000 abstract 1
- 125000002947 alkylene group Chemical group 0.000 abstract 1
- 125000004432 carbon atom Chemical group C* 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 229920000359 diblock copolymer Polymers 0.000 abstract 1
- 229920006332 epoxy adhesive Polymers 0.000 abstract 1
- 239000000178 monomer Substances 0.000 abstract 1
- 229920000428 triblock copolymer Polymers 0.000 abstract 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/02—Polyalkylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/10—Definition of the polymer structure
- C08G2261/12—Copolymers
- C08G2261/126—Copolymers block
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Materials For Medical Uses (AREA)
Abstract
COMPOSIçãO DE RESINA EPóXI ADESIVA CURáVEL, PROCESSO PARA PREPARAR UMA COMPOSIçãO DE RESINA EPóXI ADESIVA CURáVEL E DOIS OU MAIS SUBSTRATOS. A presente invenção refere-se a uma composição de resina epóxi incluindo: (a) uma resina epóxi; (b) um copolímero em bloco anfifílico contendo pelo menos um segmento de bloco miscível com resina epóxi e pelo menos um segmento de bloco imiscível com resina epóxi; sendo que o segmento de bloco imiscível compreende pelo menos uma estrutura de poliéter; com a ressalva de que a estrutura de poliéter do dito segmento de bloco imiscível contenha pelo menos uma ou mais unidades de monómero de óxido de alquileno tendo pelo menos quatro átomos de carbono; de maneira tal que quando a composição de resina epóxi seja curada, a resistência de ligamento do adesivo de resina epóxi curada seja aumentada comparativamente com uma composição de resina epóxi sem o dito copolímero em bloco anfifílico; e (c) pelo menos um agente de cura. O copolímero em bloco anfifílico é preferivelmente um copolímero em bloco integralmente de poliéter tal como um copolímero em dibloco de PEO-PBO ou um copolímero em tribloco de PEO-PBO-PEO.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US62661904P | 2004-11-10 | 2004-11-10 | |
| PCT/US2005/039962 WO2006052726A1 (en) | 2004-11-10 | 2005-11-02 | Amphiphilic block copolymer-modified epoxy resins and adhesives made therefrom |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0516699A true BRPI0516699A (pt) | 2008-09-16 |
Family
ID=35768596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0516699-3A BRPI0516699A (pt) | 2004-11-10 | 2005-11-02 | composição de resina epóxi adesiva curável, processo para preparar uma composição de resina epóxi adesiva curável e dois ou mais substratos |
Country Status (15)
| Country | Link |
|---|---|
| US (1) | US7820760B2 (pt) |
| EP (1) | EP1812512B1 (pt) |
| JP (1) | JP2008519885A (pt) |
| KR (1) | KR101226379B1 (pt) |
| CN (2) | CN101864261B (pt) |
| AT (1) | ATE454428T1 (pt) |
| BR (1) | BRPI0516699A (pt) |
| CA (1) | CA2582418A1 (pt) |
| DE (1) | DE602005018806D1 (pt) |
| ES (1) | ES2335600T3 (pt) |
| MX (1) | MX2007005599A (pt) |
| NO (1) | NO20071728L (pt) |
| RU (1) | RU2389742C2 (pt) |
| TW (1) | TWI431088B (pt) |
| WO (1) | WO2006052726A1 (pt) |
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| US20040181013A1 (en) | 1998-10-06 | 2004-09-16 | Henkel Teroson Gmbh | Impact resistant epoxide resin compositions |
| CN1250665C (zh) | 2000-04-10 | 2006-04-12 | 汉高两合股份公司 | 抗冲击环氧树脂组合物 |
| FR2809741B1 (fr) * | 2000-05-31 | 2002-08-16 | Atofina | Materiaux thermodurs a tenue au choc amelioree |
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| JP2003183605A (ja) * | 2001-12-19 | 2003-07-03 | Sekisui Chem Co Ltd | 光反応性ホットメルト接着シート |
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| US7169344B2 (en) | 2002-04-26 | 2007-01-30 | L&L Products, Inc. | Method of reinforcing at least a portion of a structure |
| JP2004182935A (ja) * | 2002-12-05 | 2004-07-02 | Ricoh Co Ltd | 導電性接着剤 |
| EP1431325A1 (de) | 2002-12-17 | 2004-06-23 | Sika Technology AG | Hitze-härtbare Epoxidharzzusammensetzung mit verbesserter Tieftemperatur-Schlagzähigkeit |
| GB0300159D0 (en) | 2003-01-06 | 2003-02-05 | L & L Products Inc | Improved reinforcing members |
-
2005
- 2005-11-02 KR KR1020077010528A patent/KR101226379B1/ko not_active Expired - Fee Related
- 2005-11-02 ES ES05818168T patent/ES2335600T3/es not_active Expired - Lifetime
- 2005-11-02 AT AT05818168T patent/ATE454428T1/de not_active IP Right Cessation
- 2005-11-02 EP EP20050818168 patent/EP1812512B1/en not_active Expired - Lifetime
- 2005-11-02 DE DE200560018806 patent/DE602005018806D1/de not_active Expired - Lifetime
- 2005-11-02 MX MX2007005599A patent/MX2007005599A/es unknown
- 2005-11-02 US US11/663,805 patent/US7820760B2/en active Active
- 2005-11-02 WO PCT/US2005/039962 patent/WO2006052726A1/en not_active Ceased
- 2005-11-02 CA CA 2582418 patent/CA2582418A1/en not_active Abandoned
- 2005-11-02 BR BRPI0516699-3A patent/BRPI0516699A/pt not_active Application Discontinuation
- 2005-11-02 CN CN2010101986039A patent/CN101864261B/zh not_active Expired - Lifetime
- 2005-11-02 RU RU2007121649A patent/RU2389742C2/ru not_active IP Right Cessation
- 2005-11-02 CN CN2005800385357A patent/CN101056934B/zh not_active Expired - Lifetime
- 2005-11-02 JP JP2007541251A patent/JP2008519885A/ja active Pending
- 2005-11-09 TW TW94139241A patent/TWI431088B/zh not_active IP Right Cessation
-
2007
- 2007-04-02 NO NO20071728A patent/NO20071728L/no not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1812512A1 (en) | 2007-08-01 |
| CN101056934B (zh) | 2010-09-29 |
| RU2007121649A (ru) | 2008-12-20 |
| CN101864261A (zh) | 2010-10-20 |
| JP2008519885A (ja) | 2008-06-12 |
| TWI431088B (zh) | 2014-03-21 |
| KR101226379B1 (ko) | 2013-01-24 |
| DE602005018806D1 (de) | 2010-02-25 |
| RU2389742C2 (ru) | 2010-05-20 |
| CN101864261B (zh) | 2012-09-05 |
| TW200624530A (en) | 2006-07-16 |
| MX2007005599A (es) | 2007-05-23 |
| US7820760B2 (en) | 2010-10-26 |
| CN101056934A (zh) | 2007-10-17 |
| ES2335600T3 (es) | 2010-03-30 |
| US20090123759A1 (en) | 2009-05-14 |
| WO2006052726A1 (en) | 2006-05-18 |
| EP1812512B1 (en) | 2010-01-06 |
| NO20071728L (no) | 2007-08-08 |
| ATE454428T1 (de) | 2010-01-15 |
| KR20070084112A (ko) | 2007-08-24 |
| CA2582418A1 (en) | 2006-05-18 |
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