BRPI0516698A - composição de resina epóxi curável, processo para preparar uma resina epóxi curável, compósito e laminado - Google Patents

composição de resina epóxi curável, processo para preparar uma resina epóxi curável, compósito e laminado

Info

Publication number
BRPI0516698A
BRPI0516698A BRPI0516698-5A BRPI0516698A BRPI0516698A BR PI0516698 A BRPI0516698 A BR PI0516698A BR PI0516698 A BRPI0516698 A BR PI0516698A BR PI0516698 A BRPI0516698 A BR PI0516698A
Authority
BR
Brazil
Prior art keywords
epoxy resin
curable
resin composition
peo
preparing
Prior art date
Application number
BRPI0516698-5A
Other languages
English (en)
Inventor
Franks S Bates
Stephen F Hahn
Original Assignee
Dow Global Technologies Inc
Univ Minnesota
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Inc, Univ Minnesota filed Critical Dow Global Technologies Inc
Publication of BRPI0516698A publication Critical patent/BRPI0516698A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)

Abstract

COMPOSIçãO DE RESINA EPóXI CURáVEL, PROCESSO PARA PREPARAR UMA RESINA EPóXI CURáVEL, COMPóSITO E LANINADO. A presente invenção compreende uma composição incluindo: (a) uma resina epóxi; e (b) um copolímero em bloco anfifílico contendo pelo menos um segmento de bloco miscível com resina epóxi e pelo menos um segmento de bloco imiscível com resina epóxi; sendo que o segmento de bloco imiscível compreende pelo menos uma estrutura de poliéter com a ressalva de que a estrutura de poliéter do dito segmento de bloco imiscível contenha pelo menos uma ou mais unidades de óxido de alquileno tendo pelo menos quatro átomos de carbono; de maneira tal que quando a composição de resina epóxi seja curada, a tenacidade da composição de resina epóxi curada seja aumentada. O copolímero em bloco anfifílico é preferivelmente um copolímero integralmente de blocos de poliéter tais como um copolímero em dibloco de PEO-PBO ou um copolímero em tribloco de PEO-PBO-PEO.
BRPI0516698-5A 2004-11-10 2005-11-02 composição de resina epóxi curável, processo para preparar uma resina epóxi curável, compósito e laminado BRPI0516698A (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US62660704P 2004-11-10 2004-11-10
US70476005P 2005-08-02 2005-08-02
PCT/US2005/039965 WO2006052729A1 (en) 2004-11-10 2005-11-02 Amphiphilic block copolymer-toughened epoxy resins

Publications (1)

Publication Number Publication Date
BRPI0516698A true BRPI0516698A (pt) 2008-09-16

Family

ID=35771927

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0516698-5A BRPI0516698A (pt) 2004-11-10 2005-11-02 composição de resina epóxi curável, processo para preparar uma resina epóxi curável, compósito e laminado

Country Status (15)

Country Link
US (1) US20090082486A1 (pt)
EP (1) EP1814947B1 (pt)
JP (1) JP2008519888A (pt)
KR (1) KR101226342B1 (pt)
CN (1) CN101111560B (pt)
AT (1) ATE453687T1 (pt)
BR (1) BRPI0516698A (pt)
CA (1) CA2582349A1 (pt)
DE (1) DE602005018679D1 (pt)
ES (1) ES2335028T3 (pt)
MX (1) MX2007005646A (pt)
NO (1) NO20071724L (pt)
RU (1) RU2387683C2 (pt)
TW (1) TWI378967B (pt)
WO (1) WO2006052729A1 (pt)

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CN102101935B (zh) * 2010-12-23 2012-06-27 广东生益科技股份有限公司 无卤环氧树脂组合物以及使用其制备的挠性覆铜板
DE102011006674A1 (de) 2011-04-01 2012-10-04 Bayer Materialscience Aktiengesellschaft Polymere Nanopartikel und Beschichtungsmittel mit polymeren Nanopartikel
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CN104159968B (zh) 2011-12-20 2016-11-02 陶氏环球技术有限责任公司 用于制备固化环氧复合材料的方法
WO2013159339A1 (en) * 2012-04-27 2013-10-31 Dow Global Technologies Llc Curable epoxy resin compositions and composites made therefrom
BR112015010248A2 (pt) 2012-11-07 2017-07-11 Dow Global Technologies Llc composição de resina epóxi curável, processo para preparar a composição de resina epóxi curável e compósito
MX361304B (es) * 2012-12-20 2018-12-03 Dow Global Technologies Llc Componentes de compuestos polimericos para torres de comunicaciones inalambricas.
CN105008456B (zh) 2013-03-11 2017-12-01 东丽株式会社 环氧树脂组合物、预浸料坯及纤维增强复合材料
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CN107001897A (zh) 2014-12-31 2017-08-01 陶氏环球技术有限责任公司 具有改善的低温抗冲击性和耐冲洗性的耐撞击环氧粘合剂组合物
JP7011656B2 (ja) 2016-10-28 2022-01-26 ダウ グローバル テクノロジーズ エルエルシー 改善された低温耐衝撃性を有する衝突耐久性エポキシ接着剤
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KR102122762B1 (ko) * 2017-12-21 2020-06-15 주식회사 동성화학 1액형 에폭시계 접착제 조성물 및 이를 이용한 물품
WO2019124712A1 (ko) * 2017-12-21 2019-06-27 주식회사 동성화학 1액형 에폭시계 접착제 조성물 및 이를 이용한 물품
CN109251480B (zh) * 2018-08-27 2022-03-04 四川大学 嵌段共聚物用于环氧树脂中特定纳米结构构筑及制备高韧性复合材料的应用
CN109679282B (zh) * 2018-11-27 2024-05-17 四川大学 一种具有特定纳米结构的高强高韧环氧复合材料
CN109694551B (zh) * 2018-11-27 2022-07-19 四川大学 一种具有特定纳米结构的高性能环氧复合材料的制备方法
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Also Published As

Publication number Publication date
MX2007005646A (es) 2008-03-11
TWI378967B (en) 2012-12-11
NO20071724L (no) 2007-08-08
DE602005018679D1 (de) 2010-02-11
RU2007121730A (ru) 2008-12-20
CA2582349A1 (en) 2006-05-18
CN101111560A (zh) 2008-01-23
WO2006052729A8 (en) 2007-12-13
JP2008519888A (ja) 2008-06-12
RU2387683C2 (ru) 2010-04-27
KR101226342B1 (ko) 2013-01-24
TW200624501A (en) 2006-07-16
EP1814947B1 (en) 2009-12-30
ATE453687T1 (de) 2010-01-15
US20090082486A1 (en) 2009-03-26
KR20070084114A (ko) 2007-08-24
WO2006052729A1 (en) 2006-05-18
ES2335028T3 (es) 2010-03-18
CN101111560B (zh) 2013-02-13
EP1814947A1 (en) 2007-08-08

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B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2343 DE 01-12-2015 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.