BRPI0721193A2 - dispositivo semicondutor eletrônico baseado em de óxidos de cobre e níquel e gálio-estanho-zinco-cobre-titânio tipo p e n, as suas aplicações e respectivo processo - Google Patents

dispositivo semicondutor eletrônico baseado em de óxidos de cobre e níquel e gálio-estanho-zinco-cobre-titânio tipo p e n, as suas aplicações e respectivo processo

Info

Publication number
BRPI0721193A2
BRPI0721193A2 BRPI0721193A BRPI0721193A BRPI0721193A2 BR PI0721193 A2 BRPI0721193 A2 BR PI0721193A2 BR PI0721193 A BRPI0721193 A BR PI0721193A BR PI0721193 A BRPI0721193 A BR PI0721193A BR PI0721193 A2 BRPI0721193 A2 BR PI0721193A2
Authority
BR
Brazil
Prior art keywords
copper
gallium
tin
zinc
applications
Prior art date
Application number
BRPI0721193A
Other languages
English (en)
Inventor
Elvira Maria Correia Fortunato
Rodrigo Ferrão De Paiva Martins
Original Assignee
Univ Nova De Lisboa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nova De Lisboa filed Critical Univ Nova De Lisboa
Publication of BRPI0721193A2 publication Critical patent/BRPI0721193A2/pt
Publication of BRPI0721193B1 publication Critical patent/BRPI0721193B1/pt
Publication of BRPI0721193B8 publication Critical patent/BRPI0721193B8/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2902—Materials being Group IVA materials
    • H10P14/2905—Silicon, silicon germanium or germanium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/05—Manufacture or treatment characterised by using material-based technologies using Group III-V technology
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/07—Manufacture or treatment characterised by using material-based technologies using Group II-VI technology
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/22—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using physical deposition, e.g. vacuum deposition or sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2922—Materials being non-crystalline insulating materials, e.g. glass or polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2923—Materials being conductive materials, e.g. metallic silicides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3424—Deposited materials, e.g. layers characterised by the chemical composition being Group IIB-VIA materials
    • H10P14/3426—Oxides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3434—Deposited materials, e.g. layers characterised by the chemical composition being oxide semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3438—Doping during depositing
    • H10P14/3441—Conductivity type
    • H10P14/3446—Transition metal elements; Rare earth elements
BRPI0721193A 2007-02-05 2007-02-05 dispositivo semicondutor eletrônico baseado em óxidos de cobre e níquel e gálio-estanho-zinco-cobre-titânio tipos p e n, e respectivo processo de fabricação BRPI0721193B8 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/PT2007/000008 WO2008097117A1 (en) 2007-02-05 2007-02-05 ELECTRONIC SEMICONDUCTOR DEVICE BASED ON COPPER NICKEL AND GALLIUM-TIN-ZINC-COPPER-TITANIUM p AND n-TYPE OXIDES, THEIR APPLICATIONS AND CORRESPONDING MANUFACTURE PROCESS

Publications (3)

Publication Number Publication Date
BRPI0721193A2 true BRPI0721193A2 (pt) 2016-06-21
BRPI0721193B1 BRPI0721193B1 (pt) 2019-08-27
BRPI0721193B8 BRPI0721193B8 (pt) 2019-10-29

Family

ID=38647954

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0721193A BRPI0721193B8 (pt) 2007-02-05 2007-02-05 dispositivo semicondutor eletrônico baseado em óxidos de cobre e níquel e gálio-estanho-zinco-cobre-titânio tipos p e n, e respectivo processo de fabricação

Country Status (7)

Country Link
US (1) US8274082B2 (pt)
EP (1) EP2115770B1 (pt)
JP (1) JP2010518619A (pt)
BR (1) BRPI0721193B8 (pt)
CA (1) CA2677312C (pt)
PT (1) PT2115770T (pt)
WO (1) WO2008097117A1 (pt)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE505087C2 (sv) * 1995-10-09 1997-06-23 Tetra Laval Holdings & Finance Förpackningslaminat och sätt att framställa förpackningslaminatet samt av förpackningslaminatet framställda förpackningsbehållare med goda syrgastäthetsegenskaper
US8384439B2 (en) * 2008-11-28 2013-02-26 Samsung Electronics Co., Ltd. Semiconductor devices and methods of fabricating the same
JP5506213B2 (ja) * 2009-03-06 2014-05-28 キヤノン株式会社 半導体素子の形成方法
KR101434948B1 (ko) 2009-12-25 2014-08-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP5776192B2 (ja) * 2010-02-16 2015-09-09 株式会社リコー 電界効果型トランジスタ、表示素子、画像表示装置及びシステム
KR20130008037A (ko) * 2010-03-05 2013-01-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치를 제작하는 방법
KR101420289B1 (ko) * 2010-04-15 2014-07-17 패컬티 오브 사이언스 앤드 테크놀로지 유니버시티 오브 뉴 리스본 반도체 소자 및 그 제조 방법
US9053937B2 (en) 2010-04-15 2015-06-09 Electronics And Telecommunications Research Institute Semiconductor device and method of manufacturing the same
US8692243B2 (en) * 2010-04-20 2014-04-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8728860B2 (en) * 2010-09-03 2014-05-20 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2013125826A (ja) * 2011-12-14 2013-06-24 Renesas Electronics Corp 半導体装置及び半導体装置の製造方法
US8969867B2 (en) * 2012-01-18 2015-03-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101284587B1 (ko) * 2012-05-17 2013-07-11 한국과학기술연구원 Ｐ-형 투명 산화물 반도체, 이를 포함하는 트랜지스터 및 그 제조방법
TWI495615B (zh) 2012-09-28 2015-08-11 Ind Tech Res Inst ｐ型金屬氧化物半導體材料
KR102045730B1 (ko) * 2012-12-28 2019-12-03 엘지디스플레이 주식회사 인버터와 이를 이용한 구동회로 및 표시장치
US9589852B2 (en) * 2013-07-22 2017-03-07 Cree, Inc. Electrostatic phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating
TWI683425B (zh) * 2015-01-14 2020-01-21 美商康寧公司 玻璃基板以及包含彼之顯示裝置
US11286553B2 (en) * 2015-03-11 2022-03-29 Essilor International Method for vapor deposition of optical substrate
CO2017007378A1 (es) * 2017-07-25 2019-01-31 Univ Nat Colombia Peliculas delgadas de oxinitruro binario de niquel-cobre (nicuoxny) y las condiciones para su fabricación
CN114235903A (zh) * 2020-09-09 2022-03-25 中国科学院苏州纳米技术与纳米仿生研究所 一种气体传感器及其制作方法
CN113097231B (zh) * 2021-03-30 2023-06-02 电子科技大学 一种基于锡氧化物的pn结及其制备方法
CN113549453B (zh) * 2021-07-20 2023-05-12 陕西师范大学 一种具有高光电性能的CuO基复合材料

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5138163B2 (ja) * 2004-11-10 2013-02-06 キヤノン株式会社 電界効果型トランジスタ
CN102945857B (zh) * 2004-11-10 2015-06-03 佳能株式会社 无定形氧化物和场效应晶体管
US7695998B2 (en) * 2005-07-02 2010-04-13 Hewlett-Packard Development Company, L.P. Methods for making and using high-mobility inorganic semiconductive films

Also Published As

Publication number Publication date
PT2115770T (pt) 2019-02-15
US8274082B2 (en) 2012-09-25
EP2115770A1 (en) 2009-11-11
BRPI0721193B8 (pt) 2019-10-29
AU2007346358A1 (en) 2008-08-14
CA2677312C (en) 2015-08-04
JP2010518619A (ja) 2010-05-27
BRPI0721193B1 (pt) 2019-08-27
EP2115770B1 (en) 2018-10-10
WO2008097117A1 (en) 2008-08-14
CA2677312A1 (en) 2008-08-14
US20100090216A1 (en) 2010-04-15

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Legal Events

Date Code Title Description
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 27/08/2019, OBSERVADAS AS CONDICOES LEGAIS. (CO) 10 (DEZ) ANOS CONTADOS A PARTIR DE 27/08/2019, OBSERVADAS AS CONDICOES LEGAIS

B16C Correction of notification of the grant [chapter 16.3 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 27/08/2019, OBSERVADAS AS CONDICOES LEGAIS. (CO) REFERENTE A PUBLICACAO NA RPI 2538 DE 27/08/2019, QUANTO AO TITULO.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 15A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2656 DE 30-11-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.