BRPI0810290A2 - "processo para curar uma composição termofixa, composição termofixa e processo para formar um compósito." - Google Patents

"processo para curar uma composição termofixa, composição termofixa e processo para formar um compósito."

Info

Publication number
BRPI0810290A2
BRPI0810290A2 BRPI0810290-2A2A BRPI0810290A BRPI0810290A2 BR PI0810290 A2 BRPI0810290 A2 BR PI0810290A2 BR PI0810290 A BRPI0810290 A BR PI0810290A BR PI0810290 A2 BRPI0810290 A2 BR PI0810290A2
Authority
BR
Brazil
Prior art keywords
thermosetting composition
cure
composite
thermosetting
composition
Prior art date
Application number
BRPI0810290-2A2A
Other languages
English (en)
Inventor
Maurice Joel Marks
Courtney Lawrence Sherman
Original Assignee
Dow Global Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Inc filed Critical Dow Global Technologies Inc
Publication of BRPI0810290A2 publication Critical patent/BRPI0810290A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
BRPI0810290-2A2A 2007-05-09 2008-04-22 "processo para curar uma composição termofixa, composição termofixa e processo para formar um compósito." BRPI0810290A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US92848207P 2007-05-09 2007-05-09
PCT/US2008/061163 WO2008140906A1 (en) 2007-05-09 2008-04-22 Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof

Publications (1)

Publication Number Publication Date
BRPI0810290A2 true BRPI0810290A2 (pt) 2014-11-04

Family

ID=39673147

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0810290-2A2A BRPI0810290A2 (pt) 2007-05-09 2008-04-22 "processo para curar uma composição termofixa, composição termofixa e processo para formar um compósito."

Country Status (8)

Country Link
US (1) US20100144965A1 (pt)
EP (1) EP2147034B1 (pt)
JP (1) JP2010526907A (pt)
KR (1) KR20100017712A (pt)
CN (2) CN103059267A (pt)
BR (1) BRPI0810290A2 (pt)
TW (1) TWI372766B (pt)
WO (1) WO2008140906A1 (pt)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2012013529A (es) 2010-05-21 2013-01-24 Dow Global Technologies Llc Composiciones curables.
US20110319564A1 (en) 2010-06-24 2011-12-29 Larry Steven Corley Epoxy systems for composites
KR20140045954A (ko) 2011-06-24 2014-04-17 다우 글로벌 테크놀로지스 엘엘씨 열경화성 조성물 및 섬유-보강된 복합체를 제조하는 방법
WO2013003202A1 (en) 2011-06-30 2013-01-03 Dow Global Technologies Llc Curable epoxy resin systems containing mixtures of amine hardeners and an excess of epoxide groups
WO2013095908A2 (en) * 2011-12-20 2013-06-27 Dow Global Technologies Llc Epoxy resin composites
WO2014062407A2 (en) 2012-10-19 2014-04-24 Dow Global Technologies Llc Anhydride-cured epoxy resin systems containing divinylarene dioxides
KR102131211B1 (ko) 2012-11-13 2020-07-08 다우 글로벌 테크놀로지스 엘엘씨 수지 이송 성형 공정을 위한 폴리에틸렌 테트라아민을 함유하는 에폭시 수지 시스템
WO2014078218A1 (en) 2012-11-13 2014-05-22 Dow Global Technologies Llc Epoxy resin system containing polyethylene tetramines and triethylene diamine catalyst for resin transfer molding processes
JP2016501970A (ja) * 2012-12-21 2016-01-21 ダウ グローバル テクノロジーズ エルエルシー チオール硬化弾性エポキシ樹脂
BR112015014761A2 (pt) 2012-12-21 2017-07-11 Dow Global Technologies Llc método para produzir uma junção de cabo
CN104968703B (zh) 2012-12-21 2018-04-10 陶氏环球技术有限责任公司 相分段的非异氰酸酯弹性体
BR112016005017B1 (pt) 2013-09-16 2021-02-17 Dow Global Technologies Llc processo para montar segmentos de tubo
EP3083749B1 (en) 2013-12-18 2020-01-22 Dow Global Technologies LLC Process for forming an organic polymer in a reaction of a polyene, an epoxy resin and a mixture of thiol and amine curing agents
WO2015103427A1 (en) 2013-12-31 2015-07-09 Saint-Gobain Performance Plastics Corporation Composites for protecting signal transmitters/receivers
WO2015119881A1 (en) 2014-02-07 2015-08-13 Dow Global Technologies Llc Fast curing high glass transition temperature epoxy resin system
WO2015142771A1 (en) 2014-03-18 2015-09-24 Dow Global Technologies Llc Epoxy resin system
US10066136B2 (en) 2014-04-22 2018-09-04 Dow Global Technologies Llc Polyurethane-acrylate epoxy adhesive
KR102375219B1 (ko) 2014-07-17 2022-03-17 다우 글로벌 테크놀로지스 엘엘씨 트리에틸아민테트라아민 및 주석 촉매를 이용한 에폭시 시스템
EP3194466B1 (en) * 2014-09-12 2019-11-06 Drexel University Toughening of anhydride cured thermosetting epoxy polymers using grafted triglycerides
US9822227B2 (en) 2014-09-16 2017-11-21 Isola Usa Corp. High Tg epoxy formulation with good thermal properties
WO2016077095A1 (en) 2014-11-11 2016-05-19 Dow Global Technologies Llc Fast curing high glass transition temperature epoxy resin system
EP3237485A1 (en) 2014-12-24 2017-11-01 Dow Global Technologies LLC Rapid-set epoxy resin systems and process of coating pipelines using the epoxy resin system
US10479858B2 (en) 2015-06-25 2019-11-19 Dow Global Technologies Llc Epoxy resin system for making carbon fiber composites
WO2017007650A1 (en) 2015-07-07 2017-01-12 Dow Global Technologies Llc Stable high glass transition temperature epoxy resin system for making composites
KR102716321B1 (ko) 2016-05-24 2024-10-14 주식회사 아모그린텍 절연성 방열 코팅조성물 및 이를 통해 형성된 절연성 방열유닛
WO2018017280A1 (en) 2016-07-17 2018-01-25 Dow Global Technologies Llc In-situ process for forming mixtures of an epoxidized poly (phenylene ether) and an epoxy resin
CN109790279B (zh) 2016-08-19 2022-06-28 陶氏环球技术有限责任公司 含有内部脱模剂的环氧树脂组合物
US11261289B2 (en) 2016-10-17 2022-03-01 Warren Environmental & Coating, Llc Method of lining a pipeline with a delayed curing resin composition
EP3592796B1 (en) 2017-03-09 2021-04-21 Dow Global Technologies LLC Stable epoxy/internal mold release agent blends for the manufacture of composite articles
EP3596182B1 (en) 2017-03-17 2021-06-30 Dow Global Technologies LLC Epoxy-acrylic hybrid adhesive
JP2020524187A (ja) 2017-06-20 2020-08-13 ダウ グローバル テクノロジーズ エルエルシー 繊維強化複合材を製造するためのエポキシ樹脂系
WO2020005393A1 (en) 2018-06-26 2020-01-02 Dow Global Technologies Llc Fibre-reinforced composite and process of making this composite
WO2020033037A1 (en) 2018-08-08 2020-02-13 Dow Global Technologies Llc Epoxy resin composition
WO2020033036A1 (en) 2018-08-08 2020-02-13 Dow Global Technologies Llc Epoxy resin composition
WO2021095534A1 (ja) * 2019-11-14 2021-05-20 Dic株式会社 硬化性組成物、硬化物、繊維強化複合材料、成形品及びその製造方法

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2750395A (en) * 1954-01-05 1956-06-12 Union Carbide & Carbon Corp Diepoxides
US2890194A (en) * 1956-05-24 1959-06-09 Union Carbide Corp Compositions of epoxides and polycarboxylic acid compounds
US3018262A (en) * 1957-05-01 1962-01-23 Shell Oil Co Curing polyepoxides with certain metal salts of inorganic acids
US3960979A (en) * 1974-12-24 1976-06-01 E. I. Du Pont De Nemours And Company High solids can coating compositions based on epoxy resin crosslinking agent, flexibilizing polyol, co-reactive acid catalyst, and surface modifier
US4018848A (en) * 1974-12-24 1977-04-19 E. I. Du Pont De Nemours And Company High solids can coating compositions based on epoxy resin, crosslinking agent, flexibilizing polyol, co-reactive acid catalyst, and surface modifier
US3969979A (en) * 1975-07-29 1976-07-20 Sun Ventures, Inc. Liquid propellant for a gun
US4076764A (en) * 1976-07-22 1978-02-28 Shell Oil Company Epoxy resin composition having improved physical properties
US4181784A (en) * 1977-12-27 1980-01-01 Ford Motor Company High solids coating composition adapted for use as automotive topcoat--#1
US4393181A (en) * 1982-06-30 1983-07-12 Shell Oil Company Polyfunctional phenolic-melamine epoxy resin curing agents
US4595623A (en) * 1984-05-07 1986-06-17 Hughes Aircraft Company Fiber-reinforced syntactic foam composites and method of forming same
US4656207A (en) * 1985-02-19 1987-04-07 Hercules Incorporated Epoxy thermosets having improved toughness
EP0249262A3 (en) * 1986-06-09 1990-07-04 Shell Internationale Researchmaatschappij B.V. Thermoplastic polymer composition having thermosetting processing characteristics
CN1046741A (zh) * 1988-04-30 1990-11-07 三井东圧化学株式会社 以多硫化物为基础的树脂，含有该树脂的塑料透镜以及制造该种透镜的方法
GB8912952D0 (en) * 1989-06-06 1989-07-26 Dow Rheinmuenster Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones
US5385990A (en) * 1992-11-02 1995-01-31 Lord Corporation Structural adhesive composition having high temperature resistance
JPH07228580A (ja) * 1993-12-21 1995-08-29 Yuka Shell Epoxy Kk 変性多価エポキシ化合物、同化合物の製造方法及びエポキシ樹脂組成物
GB9411367D0 (en) * 1994-06-07 1994-07-27 Ici Composites Inc Curable Composites
US5962586A (en) * 1994-09-27 1999-10-05 Harper; John D. Epoxy resin(s) with anhydride and polybutadiene-maleic anhydride adduct
GB9421405D0 (en) * 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations
US5686185A (en) * 1996-06-28 1997-11-11 Morton International, Inc. Disbondment resistant epoxy powder coating composition
US6153719A (en) * 1998-02-04 2000-11-28 Lord Corporation Thiol-cured epoxy composition
JP2000273280A (ja) * 1999-03-26 2000-10-03 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
US6469074B1 (en) * 1999-05-26 2002-10-22 Matsushita Electric Works, Ltd. Composition of cyanate ester, epoxy resin and acid anhydride
US6632893B2 (en) * 1999-05-28 2003-10-14 Henkel Loctite Corporation Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners
DE19956893A1 (de) * 1999-11-26 2001-05-31 Daimler Chrysler Ag Kühlkreis für einen Verbrennungsmotor
US20040082720A1 (en) * 2000-07-18 2004-04-29 Fmc Corporation Adducts of amine-terminated polyolefins and epoxides
JP2002212390A (ja) * 2001-01-19 2002-07-31 Hitachi Chem Co Ltd 絶縁樹脂組成物、銅箔付き絶縁材および銅張積層板
US6572971B2 (en) * 2001-02-26 2003-06-03 Ashland Chemical Structural modified epoxy adhesive compositions
US6632860B1 (en) * 2001-08-24 2003-10-14 Texas Research International, Inc. Coating with primer and topcoat both containing polysulfide, epoxy resin and rubber toughener
US6808819B2 (en) * 2002-02-14 2004-10-26 Shin Etsu Chemical Co., Ltd. Heat resistant resin composition and adhesive film
JP4047613B2 (ja) * 2002-03-29 2008-02-13 住友ベークライト株式会社 液状封止樹脂及びそれを用いた半導体装置
JP3862004B2 (ja) * 2002-05-10 2006-12-27 信越化学工業株式会社 耐熱性樹脂組成物及びそれを用いた接着フィルム
GB0212062D0 (en) * 2002-05-24 2002-07-03 Vantico Ag Jetable compositions
JP4120780B2 (ja) * 2002-07-19 2008-07-16 信越化学工業株式会社 フェノール性水酸基を有するポリイミド樹脂の製造方法
US7163973B2 (en) * 2002-08-08 2007-01-16 Henkel Corporation Composition of bulk filler and epoxy-clay nanocomposite
US20050215656A1 (en) * 2002-11-28 2005-09-29 Taiyo Ink Manufacturing Co., Ltd. Photocurable and thermosetting resin composition and printed circuit boards made by using the same
US7108806B2 (en) * 2003-02-28 2006-09-19 National Starch And Chemical Investment Holding Corporation Conductive materials with electrical stability and good impact resistance for use in electronics devices
US8048819B2 (en) * 2005-06-23 2011-11-01 Momentive Performance Materials Inc. Cure catalyst, composition, electronic device and associated method
US20110319564A1 (en) * 2010-06-24 2011-12-29 Larry Steven Corley Epoxy systems for composites
US20120328811A1 (en) * 2011-06-24 2012-12-27 Air Products And Chemicals, Inc. Epoxy Resin Compositions

Also Published As

Publication number Publication date
WO2008140906A1 (en) 2008-11-20
EP2147034A1 (en) 2010-01-27
JP2010526907A (ja) 2010-08-05
EP2147034B1 (en) 2014-12-17
KR20100017712A (ko) 2010-02-16
CN103059267A (zh) 2013-04-24
CN101679603A (zh) 2010-03-24
US20100144965A1 (en) 2010-06-10
TWI372766B (en) 2012-09-21
TW200914482A (en) 2009-04-01

Similar Documents

Publication Publication Date Title
BRPI0810290A2 (pt) "processo para curar uma composição termofixa, composição termofixa e processo para formar um compósito."
BRPI0813201A2 (pt) "composição curável, compósito e método para formar um compósito"
BRPI0905387A2 (pt) Composição curável, resina termofixa enrijecida, compósito, processo para formar uma composição curável e processo para formar uma resina termofixa
BRPI0816449A2 (pt) Material compósito, e, processo para produzir o mesmo
BRPI0813307A2 (pt) Composição imunogênica, vacina, e, processo para fabricar a vacina
BRPI0814980A2 (pt) Processo para produzir um composto, e, composto.
BRPI0813064A2 (pt) "processo para produzir um laminado ou estrutura composta, laminado ou estrutura composta e artigo" processo para produzir um laminado ou estrutura composta, laminado ou estrutura composta e artigo
BRPI1013403A2 (pt) prepregs, processo para a produção destes, uso dos mesmos, uso da composição de poliuretano, componentes de compósitos e processo para a produção de componentes de compósitos.
BRPI0719641A2 (pt) "película correspondendo pelo menos uma camada, película encolhida, artigo, pacote e processo para preparar uma película compreendendo pelo menos uma camada"
BRPI0814611A2 (pt) Composição, processo para preparar uma composição, e, uso de uma composição
BRPI0906333A2 (pt) "cepa bacteriana recombinante, processo pra modificar uma cepa bacteriana e processo para a produção de etanol"
FI20095893A7 (fi) Kovetettava koostumus, kovetettu tuote ja laminaatti
BRPI1005918A2 (pt) composição de resina epóxi curável, processo para preparar uma composição de resina epóxi curável, compósito, processo para formar um compósito e adesivo
BR112012006241A2 (pt) composição de compósito de resina epóxi curável, processo para produzir um produto curado, produto de compósito curado e processo para produzir uma composição de resina epóxi curável
BRPI0905847A2 (pt) "composição farmacêutica injetável e processo para preparar a composição"
BRPI0923216A2 (pt) composição de resina, artigo moldado, e, processo para produzir uma composição de resina.
BRPI0907273A2 (pt) Composição curável baseada em epóxi, processo para formar uma composição curável baseada em epóxi, resina termofixa e peça baseada em epóxi
BRPI0817493A2 (pt) Fibras de uhmwpe e um processo para produzir as mesmas
BRPI0914083A2 (pt) "painél compósito e processo para fabricar um painél compósito"
BRPI0908177A2 (pt) compósito elástico e método para produzir o mesmo
BRPI0814821A2 (pt) Composto, composição farmacêutica, e, processo para preparar um composto
DE602009000317D1 (de) Harzzusammensetzung, Prepreg und deren Verwendungen
BRPI0907275A2 (pt) Processo para formar um catalisador de epóxi-imidazol sólido, catalisador de epóxi-imidazol sólido, composição curável, processo para formar uma composição curável e processo para formar uma composição termofixa
BRPI1006129A2 (pt) composição de revestimento, processo para produzir uma composição de revestimento, e, laminado.
BRPI0818533A2 (pt) composto, composição farmacêutica, e, processo para a preparação de um composto

Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 7A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2329 DE 25-08-2015 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.

B350 Update of information on the portal [chapter 15.35 patent gazette]