ES2189937T3 - Composiciones reticulables de resina expoxi. - Google Patents
Composiciones reticulables de resina expoxi.Info
- Publication number
- ES2189937T3 ES2189937T3 ES97810780T ES97810780T ES2189937T3 ES 2189937 T3 ES2189937 T3 ES 2189937T3 ES 97810780 T ES97810780 T ES 97810780T ES 97810780 T ES97810780 T ES 97810780T ES 2189937 T3 ES2189937 T3 ES 2189937T3
- Authority
- ES
- Spain
- Prior art keywords
- compositions
- expoxi
- reposable
- resin
- grades
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
LAS COMPOSICIONES DE RESINAS EPOXI QUE CONTIENEN (A) UNA RESINA EPOXI LIQUIDA POR DEBAJO DE 160 (GRADOS) C CON MAS DE UN GRUPO EPOXIDO POR TERMINO MEDIO POR MOLECULA (B) UN ACIDO DI O POLICARBOXILICO O SU ANHIDRIDO, (C) ENTRE 0,1 Y 15 % EN PESO REFERIDO A LA CANTIDAD DE LOS COMPONENTES (A) Y (B) DE UNA CERA CON UN PUNTO DE GOTEO DE ENTRE 80 Y 90 (GRADOS) C Y OPCIONALMENTE (D) LOS AGENTES DE RELLENO HABITUALES O ADITIVOS PARA RESINAS EPOXI PARA PIEZAS COLADAS, SE UTILIZAN PREFERENTEMENTE COMO MASAS DE RESINA EPOXI PARA LA FABRICACION DE MATERIAL PARA MOLDEADO SEGUN EL PROCEDIMIENTO DE GELATINIZACION POR PRESION.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH267996 | 1996-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2189937T3 true ES2189937T3 (es) | 2003-07-16 |
Family
ID=4239147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES97810780T Expired - Lifetime ES2189937T3 (es) | 1996-10-30 | 1997-10-21 | Composiciones reticulables de resina expoxi. |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5906784A (es) |
| EP (1) | EP0839865B1 (es) |
| JP (1) | JPH10130464A (es) |
| CA (1) | CA2219686A1 (es) |
| DE (1) | DE59709220D1 (es) |
| ES (1) | ES2189937T3 (es) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6761109B2 (en) * | 2001-03-28 | 2004-07-13 | The Boc Group, Inc. | Apparatus and method for mixing a gas and a liquid |
| PL2427517T3 (pl) | 2009-05-05 | 2013-11-29 | Huntsman Adv Mat Licensing Switzerland Gmbh | Układ utwardzalny |
| EP2760323A1 (en) | 2012-10-25 | 2014-08-06 | Kohler Co. | Engineered composite material and products produced therefrom |
| HRP20191244T4 (hr) * | 2015-03-26 | 2022-03-04 | Huntsman Advanced Materials Licensing (Switzerland) Gmbh | Postupak za pripremu izolacijskih sustava za elektrotehniku, iz njega dobiveni proizvodi i njihova uporaba |
| JP7394833B2 (ja) | 2018-08-31 | 2023-12-08 | ダウ グローバル テクノロジーズ エルエルシー | エポキシ複合配合物 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH509139A (de) * | 1969-06-19 | 1971-06-30 | Ciba Geigy Ag | Verfahren zur Herstellung von gehärteten Kunststoff-Formkörpern |
| US4042550A (en) * | 1975-11-28 | 1977-08-16 | Allied Chemical Corporation | Encapsulant compositions based on anhydride-hardened epoxy resins |
| JPS58152047A (ja) * | 1982-03-05 | 1983-09-09 | Toshiba Chem Corp | エポキシ樹脂成形材料 |
| GB8806299D0 (en) * | 1988-03-17 | 1988-04-13 | Glynwed Consumer & Building | Process of manufacturing thin-walled plastics moulding |
| JPH04348121A (ja) * | 1990-08-27 | 1992-12-03 | Fujitsu Ltd | エポキシ樹脂組成物 |
| US5258151A (en) * | 1991-06-01 | 1993-11-02 | Hoechst Aktiengesellschaft | Molding composition for the production of inorganic sintered products |
| JPH09208805A (ja) * | 1994-11-09 | 1997-08-12 | Nitto Denko Corp | 光半導体素子封止用エポキシ樹脂組成物 |
-
1997
- 1997-10-21 ES ES97810780T patent/ES2189937T3/es not_active Expired - Lifetime
- 1997-10-21 EP EP97810780A patent/EP0839865B1/de not_active Expired - Lifetime
- 1997-10-21 DE DE59709220T patent/DE59709220D1/de not_active Expired - Fee Related
- 1997-10-28 CA CA002219686A patent/CA2219686A1/en not_active Abandoned
- 1997-10-28 US US08/959,502 patent/US5906784A/en not_active Expired - Fee Related
- 1997-10-30 JP JP9314476A patent/JPH10130464A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP0839865A1 (de) | 1998-05-06 |
| CA2219686A1 (en) | 1998-04-30 |
| JPH10130464A (ja) | 1998-05-19 |
| EP0839865B1 (de) | 2003-01-29 |
| US5906784A (en) | 1999-05-25 |
| DE59709220D1 (de) | 2003-03-06 |
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