PL2427517T3 - Układ utwardzalny - Google Patents

Układ utwardzalny

Info

Publication number: PL2427517T3
Authority: PL; Poland
Prior art keywords: curable system; curable
Prior art date: 2009-05-05

Application number

PL10713321T

Other languages

English (en)

Inventor

Josef Grindling

Christian Beisele

Astrid Beigel

Cliff Beard

Original Assignee

Huntsman Adv Mat Licensing Switzerland Gmbh

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-05-05

Filing date

2010-03-25

Publication date

2013-11-29

2010-03-25 Application filed by Huntsman Adv Mat Licensing Switzerland Gmbh filed Critical Huntsman Adv Mat Licensing Switzerland Gmbh

2013-11-29 Publication of PL2427517T3 publication Critical patent/PL2427517T3/pl

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/156—Heterocyclic compounds having oxygen in the ring having two oxygen atoms in the ring
- C08K5/1575—Six-membered rings
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/205—Compounds containing groups, e.g. carbamates
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

Chemical & Material Sciences (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Compositions Of Macromolecular Compounds (AREA)
Epoxy Resins (AREA)
Organic Insulating Materials (AREA)
Macromonomer-Based Addition Polymer (AREA)

PL10713321T 2009-05-05 2010-03-25 Układ utwardzalny PL2427517T3 (pl)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
EP09159360		2009-05-05
PCT/EP2010/053874 WO2010127907A1 (en)	2009-05-05	2010-03-25	Curable system
EP10713321.7A EP2427517B1 (en)	2009-05-05	2010-03-25	Curable system

Publications (1)

Publication Number	Publication Date
PL2427517T3 true PL2427517T3 (pl)	2013-11-29

Family

ID=41138617

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
PL10713321T PL2427517T3 (pl)	2009-05-05	2010-03-25	Układ utwardzalny

Country Status (13)

Country	Link
US (1)	US9546260B2 (pl)
EP (1)	EP2427517B1 (pl)
JP (1)	JP5476461B2 (pl)
KR (1)	KR101699255B1 (pl)
CN (1)	CN102421845B (pl)
AU (1)	AU2010244641B2 (pl)
BR (1)	BRPI1015324A2 (pl)
ES (1)	ES2423602T3 (pl)
PL (1)	PL2427517T3 (pl)
PT (1)	PT2427517E (pl)
RU (1)	RU2534653C2 (pl)
TW (1)	TWI503342B (pl)
WO (1)	WO2010127907A1 (pl)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN103045142B (zh) *	2011-10-24	2014-03-19	北京天山新材料技术股份有限公司	环氧耐磨陶瓷片粘接胶及其制备方法
CN104136532B (zh) *	2012-03-01	2016-05-18	住友电木株式会社	转子固定用树脂组合物、转子和汽车
JP2014101414A (ja) *	2012-11-16	2014-06-05	Kaneka Corp	感温ゲル化剤含有熱硬化性樹脂組成物
JP2014129466A (ja) *	2012-12-28	2014-07-10	Hitachi Industrial Equipment Systems Co Ltd	高電圧機器用絶縁樹脂材およびそれを用いた高電圧機器
JP6394115B2 (ja) *	2014-06-27	2018-09-26	三菱ケミカル株式会社	樹脂組成物、樹脂組成物からなる放熱シート、及び放熱シートを含むパワーデバイス装置
CN108290998A (zh)	2015-11-23	2018-07-17	亨斯迈先进材料许可(瑞士)有限公司	用于制备户外制品的可固化聚氨酯组合物和由其获得的制品
KR102716321B1 (ko)	2016-05-24	2024-10-14	주식회사 아모그린텍	절연성 방열 코팅조성물 및 이를 통해 형성된 절연성 방열유닛
CN111356715B (zh)	2017-11-14	2023-05-23	株式会社弘辉	补强用树脂组合物及电子零件装置
US20220135862A1 (en) *	2019-04-11	2022-05-05	Huntsman Advanced Materials Licensing (Switzerland) Gmbh	Curable Two-Component Resin-Based System
WO2022136330A1 (en) *	2020-12-22	2022-06-30	Huntsman Advanced Materials Licensing (Switzerland) Gmbh	Curable two-part resin system
CN117682796A (zh) *	2023-12-20	2024-03-12	华能中天节能科技集团有限责任公司	一种防水岩棉保温板及其制备方法
CN119371379A (zh) *	2024-10-24	2025-01-28	南京林业大学	一种β-甲基缩水甘油醚类环氧化合物及其制备方法、改性环氧树脂

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US363720A (en) *		1887-05-24		String-instrument
US3914467A (en) *	1971-06-22	1975-10-21	Matsushita Electric Industrial Co Ltd	Method of making resin encapsulated electric coil
JPS6220555A (ja) *	1985-07-18	1987-01-29	Mitsubishi Electric Corp	エポキシ樹脂組成物
JPH02133421A (ja) *	1988-11-14	1990-05-22	Sunstar Eng Inc	エポキシ樹脂組成物
US5616633A (en) *	1991-09-20	1997-04-01	Ciba-Geigy Corporation	Liquid epoxy resin composition
GB9120078D0 (en) *	1991-09-20	1991-11-06	Ciba Geigy Ag	Resin formulation
DE19601085A1 (de) *	1996-01-13	1997-07-17	Basf Ag	Gele mit thermotropen Eigenschaften
ES2189937T3 (es) *	1996-10-30	2003-07-16	Vantico Ag	Composiciones reticulables de resina expoxi.
GB2332202A (en) *	1997-12-09	1999-06-16	Courtaulds Coatings	Curable epoxy resin compositions
ES2276676T3 (es) *	1999-03-16	2007-07-01	Huntsman Advanced Materials (Switzerland) Gmbh	Composicion endurecible con combinacion especial de propiedades.
JP2001158869A (ja) *	1999-09-20	2001-06-12	Sakura Color Prod Corp	筆記具用油性インキ
US6565835B1 (en) *	2000-07-07	2003-05-20	Kirker Enterprises, Inc.	Nail enamel compositions containing aluminum platelets
US6503960B1 (en) *	2000-11-21	2003-01-07	Loctite Corporation	Dispersion stable curable compositions and method for making hollow shells using same
DE10241853B3 (de) *	2002-09-09	2004-01-22	Byk-Chemie Gmbh	Polymeres Harnstoffurethan als Rheologiesteuerungsmittel und Verfahren zur Herstellung
DE60312143T2 (de) *	2003-06-16	2007-11-29	Abb Technology Ltd.	Epoxyharzzusammensetzungen und Verfahren zur Herstellung von geformten Gegenständen daraus
BRPI0416166A (pt) *	2003-11-04	2007-01-09	Huntsman Adv Mat Switzerland	composição, uso de uma composição, e, processo para fabricar um modelo ou protótipo
KR100826210B1 (ko) *	2006-12-20	2008-04-30	(주)디피아이 홀딩스	투명 고분자 수지 조성물 및 투명 고분자막 형성 방법
DE102008029858A1 (de) *	2008-04-23	2009-10-29	Byk-Chemie Gmbh	Stabile Dispersionen von anorganischen Nanopartikeln

2010
- 2010-03-25 PL PL10713321T patent/PL2427517T3/pl unknown
- 2010-03-25 WO PCT/EP2010/053874 patent/WO2010127907A1/en not_active Ceased
- 2010-03-25 JP JP2012508965A patent/JP5476461B2/ja not_active Expired - Fee Related
- 2010-03-25 KR KR1020117024193A patent/KR101699255B1/ko not_active Expired - Fee Related
- 2010-03-25 AU AU2010244641A patent/AU2010244641B2/en not_active Ceased
- 2010-03-25 PT PT107133217T patent/PT2427517E/pt unknown
- 2010-03-25 US US13/266,467 patent/US9546260B2/en not_active Expired - Fee Related
- 2010-03-25 CN CN201080020132.0A patent/CN102421845B/zh not_active Expired - Fee Related
- 2010-03-25 BR BRPI1015324-1A patent/BRPI1015324A2/pt not_active Application Discontinuation
- 2010-03-25 ES ES10713321T patent/ES2423602T3/es active Active
- 2010-03-25 EP EP10713321.7A patent/EP2427517B1/en not_active Not-in-force
- 2010-03-25 RU RU2011149329/02A patent/RU2534653C2/ru not_active IP Right Cessation
- 2010-05-03 TW TW099114031A patent/TWI503342B/zh not_active IP Right Cessation

Also Published As

Publication number	Publication date
ES2423602T3 (es)	2013-09-23
KR101699255B1 (ko)	2017-01-25
JP5476461B2 (ja)	2014-04-23
WO2010127907A1 (en)	2010-11-11
US20120065295A1 (en)	2012-03-15
BRPI1015324A2 (pt)	2019-04-09
AU2010244641A1 (en)	2011-10-13
JP2012526163A (ja)	2012-10-25
RU2011149329A (ru)	2013-06-10
EP2427517B1 (en)	2013-06-19
CN102421845A (zh)	2012-04-18
RU2534653C2 (ru)	2014-12-10
TWI503342B (zh)	2015-10-11
AU2010244641B2 (en)	2015-06-25
KR20140014353A (ko)	2014-02-06
EP2427517A1 (en)	2012-03-14
PT2427517E (pt)	2013-07-23
US9546260B2 (en)	2017-01-17
CN102421845B (zh)	2015-02-25
TW201105697A (en)	2011-02-16

Publication	Publication Date	Title
GB2476784B (en)	2012-02-08	Anti-scour system
HU0900538D0 (en)	2009-10-28	Laparo-endoscope system
GB0904414D0 (en)	2009-04-29	Keystep system
IL218930A0 (en)	2012-07-31	Expression system
GB201013131D0 (en)	2010-09-22	Positioning system
PL2283904T3 (pl)	2014-11-28	System części konstrukcyjnych
PL2478323T3 (pl)	2014-04-30	System multi-weapon
GB0909148D0 (en)	2009-07-01	Localisation system
ZA201200921B (en)	2012-10-31	Fire-control system
GB0902468D0 (en)	2009-04-01	Optical systems
EP2391894A4 (en)	2015-03-25	SYSTEM IN RELATIVE TIME
GB0921092D0 (en)	2010-01-13	Splicing system
GB2468594B (en)	2012-01-18	Image-to-speech system
GB0914700D0 (en)	2009-09-30	Location system
GB0906972D0 (en)	2009-06-03	Cladding system
EP2326908A4 (en)	2014-03-12	RELEASABLE BONDING SYSTEM
GB2473957B (en)	2011-12-07	Positioning system
DK2464943T3 (en)	2020-07-13	Systemintegration
GB0905967D0 (en)	2009-05-20	System
GB0904707D0 (en)	2009-05-06	System
GB2474011B (en)	2013-06-19	Attachment system
GB0814464D0 (en)	2008-09-10	Drinkign system
EG26908A (en)	2014-12-10	Waterproofing-drainage system
GB201008258D0 (en)	2010-06-30	Gamex system
GB0920713D0 (en)	2010-01-13	Savyor system