CA1108310A - Process for producing a semiconductor device - Google Patents

Process for producing a semiconductor device

Info

Publication number
CA1108310A
CA1108310A CA318,377A CA318377A CA1108310A CA 1108310 A CA1108310 A CA 1108310A CA 318377 A CA318377 A CA 318377A CA 1108310 A CA1108310 A CA 1108310A
Authority
CA
Canada
Prior art keywords
film
process according
impurity
window
conductivity type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA318,377A
Other languages
English (en)
French (fr)
Inventor
Keiji Nishimoto
Shinpei Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of CA1108310A publication Critical patent/CA1108310A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/662—Laminate layers, e.g. stacks of alternating high-k metal oxides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
    • H10P76/408—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes
    • H10P76/4085—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes characterised by the processes involved to create the masks

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
CA318,377A 1977-12-29 1978-12-21 Process for producing a semiconductor device Expired CA1108310A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16029677A JPS5492175A (en) 1977-12-29 1977-12-29 Manufacture of semiconductor device
JP160296/77 1977-12-29

Publications (1)

Publication Number Publication Date
CA1108310A true CA1108310A (en) 1981-09-01

Family

ID=15711895

Family Applications (1)

Application Number Title Priority Date Filing Date
CA318,377A Expired CA1108310A (en) 1977-12-29 1978-12-21 Process for producing a semiconductor device

Country Status (6)

Country Link
US (1) US4224089A (2)
JP (1) JPS5492175A (2)
CA (1) CA1108310A (2)
DE (1) DE2856147C2 (2)
GB (1) GB2011711B (2)
NL (1) NL182265C (2)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE32351E (en) * 1978-06-19 1987-02-17 Rca Corporation Method of manufacturing a passivating composite comprising a silicon nitride (SI1 3N4) layer and a phosphosilicate glass (PSG) layer for a semiconductor device layer
US4273805A (en) * 1978-06-19 1981-06-16 Rca Corporation Passivating composite for a semiconductor device comprising a silicon nitride (Si1 3N4) layer and phosphosilicate glass (PSG) layer
US4668973A (en) * 1978-06-19 1987-05-26 Rca Corporation Semiconductor device passivated with phosphosilicate glass over silicon nitride
JPS5534444A (en) * 1978-08-31 1980-03-11 Fujitsu Ltd Preparation of semiconductor device
US4319260A (en) * 1979-09-05 1982-03-09 Texas Instruments Incorporated Multilevel interconnect system for high density silicon gate field effect transistors
US4355454A (en) * 1979-09-05 1982-10-26 Texas Instruments Incorporated Coating device with As2 -O3 -SiO2
JPS5766673A (en) * 1980-10-09 1982-04-22 Toshiba Corp Manufacture of mos type semiconductor device
DE3170644D1 (en) * 1980-11-29 1985-06-27 Toshiba Kk Method of filling a groove in a semiconductor substrate
JPS57126147A (en) * 1981-01-28 1982-08-05 Fujitsu Ltd Manufacture of semiconductor device
US4363830A (en) * 1981-06-22 1982-12-14 Rca Corporation Method of forming tapered contact holes for integrated circuit devices
US4492717A (en) * 1981-07-27 1985-01-08 International Business Machines Corporation Method for forming a planarized integrated circuit
JPS5850755A (ja) * 1981-09-21 1983-03-25 Nippon Denso Co Ltd 半導体装置
JPS58147046A (ja) * 1982-02-25 1983-09-01 Nippon Denso Co Ltd 半導体装置の製造方法
US4476621A (en) * 1983-02-01 1984-10-16 Gte Communications Products Corporation Process for making transistors with doped oxide densification
US4606114A (en) * 1984-08-29 1986-08-19 Texas Instruments Incorporated Multilevel oxide as diffusion source
JP2565317B2 (ja) * 1986-12-03 1996-12-18 富士通株式会社 半導体装置の製造方法
EP0281140B1 (en) * 1987-03-04 1993-05-12 Kabushiki Kaisha Toshiba Semiconductor memory device and method for manufacturing the same
US5006480A (en) * 1988-08-08 1991-04-09 Hughes Aircraft Company Metal gate capacitor fabricated with a silicon gate MOS process
US5139968A (en) * 1989-03-03 1992-08-18 Mitsubishi Denki Kabushiki Kaisha Method of producing a t-shaped gate electrode
US5116778A (en) * 1990-02-05 1992-05-26 Advanced Micro Devices, Inc. Dopant sources for cmos device
US5164340A (en) * 1991-06-24 1992-11-17 Sgs-Thomson Microelectronics, Inc Structure and method for contacts in cmos devices
JPH07273224A (ja) * 1994-03-29 1995-10-20 Sharp Corp 半導体装置の製造方法
JP4093395B2 (ja) * 2001-08-03 2008-06-04 富士通株式会社 半導体装置とその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2040180B2 (de) * 1970-01-22 1977-08-25 Intel Corp, Mountain View, Calif. (V.St.A.) Verfahren zur verhinderung von mechanischen bruechen einer duennen, die oberflaeche eines halbleiterkoerpers ueberdeckende isolierschichten ueberziehenden elektrisch leitenden schicht
FR2134290B1 (2) * 1971-04-30 1977-03-18 Texas Instruments France
US3806371A (en) * 1971-07-28 1974-04-23 Motorola Inc Method of making complementary monolithic insulated gate field effect transistors having low threshold voltage and low leakage current
JPS4953776A (2) * 1972-09-27 1974-05-24
US3986903A (en) * 1974-03-13 1976-10-19 Intel Corporation Mosfet transistor and method of fabrication
US3912558A (en) * 1974-05-03 1975-10-14 Fairchild Camera Instr Co Method of MOS circuit fabrication
US4023195A (en) * 1974-10-23 1977-05-10 Smc Microsystems Corporation MOS field-effect transistor structure with mesa-like contact and gate areas and selectively deeper junctions
JPS5946107B2 (ja) * 1975-06-04 1984-11-10 株式会社日立製作所 Ｍｉｓ型半導体装置の製造法
JPS5293278A (en) * 1976-01-30 1977-08-05 Matsushita Electronics Corp Manufacture for mos type semiconductor intergrated circuit
JPS5299085A (en) * 1976-02-16 1977-08-19 Mitsubishi Electric Corp Production of semiconductor device

Also Published As

Publication number Publication date
JPS6133252B2 (2) 1986-08-01
NL182265C (nl) 1988-02-01
GB2011711A (en) 1979-07-11
GB2011711B (en) 1982-05-12
NL182265B (nl) 1987-09-01
JPS5492175A (en) 1979-07-21
DE2856147A1 (de) 1979-07-05
NL7812385A (nl) 1979-07-03
US4224089A (en) 1980-09-23
DE2856147C2 (de) 1984-08-30

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Legal Events

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