CA1281142C - Methode de fabrication de cartes de circuits a masques metalliques deposeset cartes de circuits fabriquees selon cette methode - Google Patents

Methode de fabrication de cartes de circuits a masques metalliques deposeset cartes de circuits fabriquees selon cette methode

Info

Publication number: CA1281142C
Authority: CA; Canada
Prior art keywords: coating; rubber; substrate; accordance; epoxy polymer
Prior art date: 1988-10-05
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

CA000585684A

Other languages

English (en)

Inventor

Peter R. Chant

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Firan Corp

Original Assignee

Firan Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1988-10-05

Filing date

1988-12-12

Publication date

1991-03-05

1988-10-05 Priority claimed from US07/253,986 external-priority patent/US4853277A/en

1988-12-12 Application filed by Firan Corp filed Critical Firan Corp

1991-03-05 Application granted granted Critical

1991-03-05 Publication of CA1281142C publication Critical patent/CA1281142C/fr

2008-12-12 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Links

229910052751 metal Inorganic materials 0.000 title claims abstract description 85
239000002184 metal Substances 0.000 title claims abstract description 85
238000004519 manufacturing process Methods 0.000 title description 9
238000000576 coating method Methods 0.000 claims abstract description 229
239000011248 coating agent Substances 0.000 claims abstract description 226
239000000758 substrate Substances 0.000 claims abstract description 117
229920001971 elastomer Polymers 0.000 claims abstract description 96
239000005060 rubber Substances 0.000 claims abstract description 96
238000000034 method Methods 0.000 claims abstract description 93
230000008569 process Effects 0.000 claims abstract description 75
239000004593 Epoxy Substances 0.000 claims abstract description 73
229920000642 polymer Polymers 0.000 claims abstract description 57
239000000203 mixture Substances 0.000 claims abstract description 25
KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims abstract description 18
125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 18
NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims abstract description 12
125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 12
239000012530 fluid Substances 0.000 claims abstract description 12
230000003993 interaction Effects 0.000 claims abstract description 10
239000011159 matrix material Substances 0.000 claims abstract description 10
229920002554 vinyl polymer Polymers 0.000 claims abstract description 10
125000000524 functional group Chemical group 0.000 claims abstract description 9
230000002452 interceptive effect Effects 0.000 claims abstract description 8
238000006116 polymerization reaction Methods 0.000 claims abstract description 7
238000005530 etching Methods 0.000 claims description 25
238000000151 deposition Methods 0.000 claims description 16
238000004132 cross linking Methods 0.000 claims description 9
238000001035 drying Methods 0.000 claims description 9
238000009472 formulation Methods 0.000 claims description 8
239000000126 substance Substances 0.000 claims description 7
239000010953 base metal Substances 0.000 claims description 6
238000005234 chemical deposition Methods 0.000 claims description 5
230000001747 exhibiting effect Effects 0.000 claims description 5
230000000694 effects Effects 0.000 abstract description 5
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 23
229910052802 copper Inorganic materials 0.000 description 21
239000010949 copper Substances 0.000 description 21
239000000463 material Substances 0.000 description 12
230000008021 deposition Effects 0.000 description 10
239000000243 solution Substances 0.000 description 9
ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
239000008199 coating composition Substances 0.000 description 6
239000000654 additive Substances 0.000 description 5
238000004070 electrodeposition Methods 0.000 description 5
238000010030 laminating Methods 0.000 description 5
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
230000000996 additive effect Effects 0.000 description 4
239000003822 epoxy resin Substances 0.000 description 4
239000011888 foil Substances 0.000 description 4
229920000647 polyepoxide Polymers 0.000 description 4
ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
229920013646 Hycar Polymers 0.000 description 3
239000000919 ceramic Substances 0.000 description 3
229920002120 photoresistant polymer Polymers 0.000 description 3
238000007747 plating Methods 0.000 description 3
CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
241000282337 Nasua nasua Species 0.000 description 2
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
230000004913 activation Effects 0.000 description 2
239000000853 adhesive Substances 0.000 description 2
230000001070 adhesive effect Effects 0.000 description 2
239000011889 copper foil Substances 0.000 description 2
QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
238000003618 dip coating Methods 0.000 description 2
238000009713 electroplating Methods 0.000 description 2
239000011521 glass Substances 0.000 description 2
150000002739 metals Chemical class 0.000 description 2
150000002924 oxiranes Chemical class 0.000 description 2
239000002245 particle Substances 0.000 description 2
229920001296 polysiloxane Polymers 0.000 description 2
KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 2
239000000047 product Substances 0.000 description 2
238000007788 roughening Methods 0.000 description 2
239000000377 silicon dioxide Substances 0.000 description 2
239000002904 solvent Substances 0.000 description 2
238000004544 sputter deposition Methods 0.000 description 2
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical class [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
244000048879 Funtumia elastica Species 0.000 description 1
229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
244000046052 Phaseolus vulgaris Species 0.000 description 1
235000010627 Phaseolus vulgaris Nutrition 0.000 description 1
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
229910000831 Steel Inorganic materials 0.000 description 1
241000193803 Therea Species 0.000 description 1
RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
238000005299 abrasion Methods 0.000 description 1
239000002253 acid Substances 0.000 description 1
230000009471 action Effects 0.000 description 1
229910045601 alloy Inorganic materials 0.000 description 1
239000000956 alloy Substances 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
229910021529 ammonia Inorganic materials 0.000 description 1
229910000410 antimony oxide Inorganic materials 0.000 description 1
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
230000009286 beneficial effect Effects 0.000 description 1
IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
238000003486 chemical etching Methods 0.000 description 1
238000006243 chemical reaction Methods 0.000 description 1
239000007795 chemical reaction product Substances 0.000 description 1
239000003795 chemical substances by application Substances 0.000 description 1
229910052804 chromium Inorganic materials 0.000 description 1
239000011651 chromium Substances 0.000 description 1
230000003247 decreasing effect Effects 0.000 description 1
230000007812 deficiency Effects 0.000 description 1
SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical compound [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 description 1
239000006185 dispersion Substances 0.000 description 1
238000004090 dissolution Methods 0.000 description 1
239000002659 electrodeposit Substances 0.000 description 1
239000004744 fabric Substances 0.000 description 1
239000000945 filler Substances 0.000 description 1
239000003063 flame retardant Substances 0.000 description 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
239000010931 gold Substances 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
239000005340 laminated glass Substances 0.000 description 1
238000003475 lamination Methods 0.000 description 1
239000012633 leachable Substances 0.000 description 1
229910021645 metal ion Inorganic materials 0.000 description 1
238000001465 metallisation Methods 0.000 description 1
229910052757 nitrogen Inorganic materials 0.000 description 1
VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
239000001301 oxygen Substances 0.000 description 1
229910052760 oxygen Inorganic materials 0.000 description 1
229910052763 palladium Inorganic materials 0.000 description 1
235000011007 phosphoric acid Nutrition 0.000 description 1
238000003825 pressing Methods 0.000 description 1
HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
230000005855 radiation Effects 0.000 description 1
230000009467 reduction Effects 0.000 description 1
239000011347 resin Substances 0.000 description 1
229920005989 resin Polymers 0.000 description 1
239000012260 resinous material Substances 0.000 description 1
238000007761 roller coating Methods 0.000 description 1
229910052709 silver Inorganic materials 0.000 description 1
239000004332 silver Substances 0.000 description 1
239000010959 steel Substances 0.000 description 1
239000000057 synthetic resin Substances 0.000 description 1
229920003002 synthetic resin Polymers 0.000 description 1
150000003512 tertiary amines Chemical class 0.000 description 1
239000010936 titanium Substances 0.000 description 1
229910052719 titanium Inorganic materials 0.000 description 1

Landscapes

Manufacturing Of Printed Wiring (AREA)
Laminated Bodies (AREA)

CA000585684A 1988-10-05 1988-12-12 Methode de fabrication de cartes de circuits a masques metalliques deposeset cartes de circuits fabriquees selon cette methode Expired - Fee Related CA1281142C (fr)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US253,986		1988-10-05
US07/253,986 US4853277A (en)	1986-09-19	1988-10-05	Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby

Publications (1)

Publication Number	Publication Date
CA1281142C true CA1281142C (fr)	1991-03-05

Family

ID=22962482

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA000585684A Expired - Fee Related CA1281142C (fr)	1988-10-05	1988-12-12	Methode de fabrication de cartes de circuits a masques metalliques deposeset cartes de circuits fabriquees selon cette methode

Country Status (1)

Country	Link
CA (1)	CA1281142C (fr)

1988
- 1988-12-12 CA CA000585684A patent/CA1281142C/fr not_active Expired - Fee Related

Legal Events

Date	Code	Title	Description
1994-09-06	MKLA	Lapsed

Publication	Publication Date	Title
US4853277A (en)	1989-08-01	Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
US4707394A (en)	1987-11-17	Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
US4857383A (en)	1989-08-15	Synthetic substrate with adhesive metal layer
US4221925A (en)	1980-09-09	Printed circuit board
US5509557A (en)	1996-04-23	Depositing a conductive metal onto a substrate
US3956041A (en)	1976-05-11	Transfer coating process for manufacture of printing circuits
US4091125A (en)	1978-05-23	Circuit board and method for producing same
US4313995A (en)	1982-02-02	Circuit board and method for producing same
JPH0628941B2 (ja)	1994-04-20	回路基板及びその製造方法
US4145460A (en)	1979-03-20	Method of fabricating a printed circuit board with etched through holes
EP0309684A1 (fr)	1989-04-05	Méthode relative à l'adésion des matériaux polymères à des surfaces de cuivre électrolytique
US3267007A (en)	1966-08-16	Bonding metal deposits to electrically non-conductive material
CA1129760A (fr)	1982-08-17	Methode de preparation de lamelles en epoxy pour le placage ulterieur
CA1189630A (fr)	1985-06-25	Fabrication de plaquettes de circuits permettant une capacite accrue
EP0148601A2 (fr)	1985-07-17	Laminage par transfert de motifs électriquement conducteurs
CA1281142C (fr)	1991-03-05	Methode de fabrication de cartes de circuits a masques metalliques deposeset cartes de circuits fabriquees selon cette methode
JPS60164392A (ja)	1985-08-27	回路板の形成方法
US3846168A (en)	1974-11-05	Method of forming bondable substrate surfaces
JPH0964514A (ja)	1997-03-07	プリント配線板の製造方法
JP2003273509A (ja)	2003-09-26	配線基板およびその製造方法
JP2947963B2 (ja)	1999-09-13	印刷配線板の製造方法
JPS61210691A (ja)	1986-09-18	水平回路を有する配線板の製造方法
JPH1126933A (ja)	1999-01-29	無電解めっき用フィルム状接着剤及びこれを用いたプリント配線板の製造方法
JPH0117277B2 (fr)	1989-03-29
JPS6021393A (ja)	1985-02-02	印刷配線板の製造方法