CA1337864C - Methode d'electrodeposition de resines photosensibles pour la fabrication des cartes de circuit imprime - Google Patents

Methode d'electrodeposition de resines photosensibles pour la fabrication des cartes de circuit imprime

Info

Publication number
CA1337864C
CA1337864C CA 594851 CA594851A CA1337864C CA 1337864 C CA1337864 C CA 1337864C CA 594851 CA594851 CA 594851 CA 594851 A CA594851 A CA 594851A CA 1337864 C CA1337864 C CA 1337864C
Authority
CA
Canada
Prior art keywords
resin
electrodeposition coating
coating
parts
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA 594851
Other languages
English (en)
Inventor
Isao Kobayashi
Kenji Seko
Naozumi Iwasawa
Masahiro Hoshino
Yuu Akaki
Toshio Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kansai Paint Co Ltd
Original Assignee
Kansai Paint Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63098400A external-priority patent/JPH0769612B2/ja
Priority claimed from JP63109482A external-priority patent/JPH0769613B2/ja
Priority claimed from JP18703188A external-priority patent/JPH0721637B2/ja
Application filed by Kansai Paint Co Ltd filed Critical Kansai Paint Co Ltd
Application granted granted Critical
Publication of CA1337864C publication Critical patent/CA1337864C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/092—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by backside coating or layers, by lubricating-slip layers or means, by oxygen barrier layers or by stripping-release layers or means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Paints Or Removers (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Materials For Photolithography (AREA)
CA 594851 1988-03-28 1989-03-28 Methode d'electrodeposition de resines photosensibles pour la fabrication des cartes de circuit imprime Expired - Fee Related CA1337864C (fr)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP7208388 1988-03-28
JP72,083/88 1988-03-28
JP63098400A JPH0769612B2 (ja) 1988-03-28 1988-04-22 プリント配線フオトレジスト用電着塗装方法
JP98,400/88 1988-04-22
JP63109482A JPH0769613B2 (ja) 1988-05-02 1988-05-02 プリント配線フオトレジスト用カチオン型電着塗装方法
JP109,482/88 1988-05-02
JP18703188A JPH0721637B2 (ja) 1988-07-28 1988-07-28 ポジ型フオトレジストの形成方法
JP187,031/88 1988-07-28

Publications (1)

Publication Number Publication Date
CA1337864C true CA1337864C (fr) 1996-01-02

Family

ID=27465427

Family Applications (1)

Application Number Title Priority Date Filing Date
CA 594851 Expired - Fee Related CA1337864C (fr) 1988-03-28 1989-03-28 Methode d'electrodeposition de resines photosensibles pour la fabrication des cartes de circuit imprime

Country Status (6)

Country Link
US (1) US4898656A (fr)
EP (1) EP0335330B1 (fr)
KR (1) KR940008381B1 (fr)
AU (1) AU613463B2 (fr)
CA (1) CA1337864C (fr)
DE (1) DE68907101T2 (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8822145D0 (en) * 1988-09-21 1988-10-26 Ciba Geigy Ag Method
JPH03177586A (ja) * 1989-12-04 1991-08-01 Nippon Paint Co Ltd フォトレジスト膜の形成方法
JP2865147B2 (ja) * 1990-06-20 1999-03-08 関西ペイント株式会社 ポジ型感光性電着塗料組成物
ATE175280T1 (de) * 1990-08-02 1999-01-15 Ppg Industries Inc Lichtempfindliche, elektroabscheidbare photoresistzusammensetzung
US5268256A (en) * 1990-08-02 1993-12-07 Ppg Industries, Inc. Photoimageable electrodepositable photoresist composition for producing non-tacky films
JP2847321B2 (ja) * 1990-08-14 1999-01-20 日本石油株式会社 ポジ型フォトレジスト組成物
US5246816A (en) * 1990-09-03 1993-09-21 Nippon Oil Co., Ltd. Cationic electrodeposition negative type resist composition
JPH0539444A (ja) * 1990-11-30 1993-02-19 Hitachi Chem Co Ltd ポジ型感光性アニオン電着塗料樹脂組成物、これを用いた電着塗装浴、電着塗装法及びプリント回路板の製造方法
US5314789A (en) * 1991-10-01 1994-05-24 Shipley Company Inc. Method of forming a relief image comprising amphoteric compositions
US5384229A (en) * 1992-05-07 1995-01-24 Shipley Company Inc. Photoimageable compositions for electrodeposition
JPH06164102A (ja) * 1992-11-25 1994-06-10 Nippon Paint Co Ltd 電着型感光性樹脂被膜の表面処理方法
DE4339019A1 (de) * 1993-11-10 1995-05-11 Atotech Deutschland Gmbh Verfahren zur Herstellung von Leiterplatten
JP3648704B2 (ja) * 2000-02-14 2005-05-18 タムラ化研株式会社 活性エネルギー線硬化性組成物及びプリント配線板
US6541537B1 (en) 2001-01-19 2003-04-01 Renaissance Technology Llc Acrylate polymeric compositions and methods
JP2004343351A (ja) * 2003-05-14 2004-12-02 Kansai Paint Co Ltd 自動車用アンテナ形成方法
US7863485B2 (en) * 2004-12-10 2011-01-04 Omnitech Environmental, Llc Additive and vehicle for inks, paints, coatings and adhesives
US7635552B2 (en) * 2006-07-25 2009-12-22 Endicott Interconnect Technologies, Inc. Photoresist composition with antibacterial agent

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL270834A (fr) * 1960-10-31
CA1051707A (fr) * 1973-10-25 1979-04-03 Michael Gulla Couche photoresistante avec couche resistante non photosensible
JPS50152803A (fr) * 1974-05-29 1975-12-09
US4421620A (en) * 1982-02-11 1983-12-20 Ppg Industries, Inc. Novel process for pretreating and coating metallic substrates electrophoretically
JPS61206293A (ja) * 1985-03-08 1986-09-12 日本ペイント株式会社 回路板の製造方法

Also Published As

Publication number Publication date
KR940008381B1 (ko) 1994-09-12
AU3173589A (en) 1989-09-28
EP0335330A3 (en) 1990-04-11
KR890015383A (ko) 1989-10-30
US4898656A (en) 1990-02-06
DE68907101T2 (de) 1993-11-11
EP0335330B1 (fr) 1993-06-16
DE68907101D1 (de) 1993-07-22
EP0335330A2 (fr) 1989-10-04
AU613463B2 (en) 1991-08-01

Similar Documents

Publication Publication Date Title
CA1337864C (fr) Methode d'electrodeposition de resines photosensibles pour la fabrication des cartes de circuit imprime
DE3715412A1 (de) Photohaertbare elektrisch abscheidbare ueberzugsmasse fuer photoresistfilme fuer gedruckte schaltungen
US5268256A (en) Photoimageable electrodepositable photoresist composition for producing non-tacky films
US4975351A (en) Positive-type photosensitive electrodeposition coating composition with o-quinone diazide sulfonyl amide polymer
EP0539714B1 (fr) Compositions amphotères
JP2749646B2 (ja) ポジ型感光性電着塗料組成物及びそれを用いた回路板の製造方法
EP0416829B1 (fr) Composition photosensible positive
EP0480365B1 (fr) Fabrication de plaquettes de circuit imprimé masquées contre la soudure
GB2193727A (en) Producing a printed circuit board
US4965073A (en) Process for preparing the printed-circuit boards using a photosensitive composition containing a reduction type leico pigment
CA1333578C (fr) Production de masques metalliques
US5102519A (en) Process for preparing a printed-circuit board
JPH0769612B2 (ja) プリント配線フオトレジスト用電着塗装方法
JPH05251847A (ja) パターン作製法
US5576148A (en) Process for production of printed circuit board
JPH0769613B2 (ja) プリント配線フオトレジスト用カチオン型電着塗装方法
JPS6343393A (ja) プリント回路板の形成方法
JP2916939B2 (ja) プリント配線板の製造方法
JPH03174475A (ja) プリント配線フォトレジスト用電着塗料組成物
JPS63221178A (ja) ポジ型感光性カチオン電着塗料組成物
JPH0239050A (ja) ポジ型フオトレジストの形成方法
JPS6323389A (ja) プリント回路の形成方法
JPH03230593A (ja) プリント配線板の製造方法
JPH0661614A (ja) レジストパターンの製造法
JPS63221177A (ja) ポジ型感光性アニオン電着塗料組成物

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