CA2006708A1 - Pellicule detachable stratifiee - Google Patents

Pellicule detachable stratifiee

Info

Publication number
CA2006708A1
CA2006708A1 CA002006708A CA2006708A CA2006708A1 CA 2006708 A1 CA2006708 A1 CA 2006708A1 CA 002006708 A CA002006708 A CA 002006708A CA 2006708 A CA2006708 A CA 2006708A CA 2006708 A1 CA2006708 A1 CA 2006708A1
Authority
CA
Canada
Prior art keywords
release film
laminate
film composed
interlayer
prising
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002006708A
Other languages
English (en)
Other versions
CA2006708C (fr
Inventor
Hiromi Shigemoto
Mikio Katagiri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2006708A1 publication Critical patent/CA2006708A1/fr
Application granted granted Critical
Publication of CA2006708C publication Critical patent/CA2006708C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31909—Next to second addition polymer from unsaturated monomers
    • Y10T428/31913—Monoolefin polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31909—Next to second addition polymer from unsaturated monomers
    • Y10T428/31928—Ester, halide or nitrile of addition polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CA002006708A 1988-12-28 1989-12-27 Pellicule detachable stratifiee Expired - Fee Related CA2006708C (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP32900888A JP2619034B2 (ja) 1988-12-28 1988-12-28 積層体からなる離型フィルム
JP329,008/88 1988-12-28

Publications (2)

Publication Number Publication Date
CA2006708A1 true CA2006708A1 (fr) 1990-06-28
CA2006708C CA2006708C (fr) 2001-10-16

Family

ID=18216574

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002006708A Expired - Fee Related CA2006708C (fr) 1988-12-28 1989-12-27 Pellicule detachable stratifiee

Country Status (7)

Country Link
US (1) US5080979A (fr)
EP (1) EP0376681B1 (fr)
JP (1) JP2619034B2 (fr)
KR (1) KR930000144B1 (fr)
AT (1) ATE134173T1 (fr)
CA (1) CA2006708C (fr)
DE (1) DE68925688T2 (fr)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5492767A (en) * 1992-07-07 1996-02-20 Mitsubishi Chemical Corporation Laminated resin film
US5877940A (en) * 1993-12-02 1999-03-02 Teledyne Industries Inc. Fabrication multilayer combined rigid/flex printed circuit board
JP2978086B2 (ja) * 1995-06-30 1999-11-15 住友ベークライト株式会社 積層体
DE19609590A1 (de) * 1996-03-12 1997-09-18 Kontron Elektronik Verfahren und Vorrichtung zur Beschichtung von Substraten, vorzugsweise Leiterplatten
US5817386A (en) * 1996-03-28 1998-10-06 Norton Performance Plastics Corporation Silicone-free release films
US5858550A (en) * 1997-02-06 1999-01-12 Alliedsignal Inc. High temperature release films
US6062271A (en) * 1998-05-22 2000-05-16 Markel Corporation Polymethylpentene cable liner
US6440566B1 (en) * 1998-10-01 2002-08-27 Airtech International, Inc. Method of molding or curing a resin material at high temperatures using a multilayer release film
US6270909B1 (en) 1999-04-07 2001-08-07 Honeywell International Inc. High temperature release films
JP2002079630A (ja) * 2000-06-28 2002-03-19 Sumitomo Bakelite Co Ltd 離型多層フィルム及びカバーレイ成形方法
US20030008163A1 (en) * 2000-09-20 2003-01-09 Takashi Nakahara Multilayered 4-methyl-1-pentene copolymer mutli layer film and process for producing the same
JP4130300B2 (ja) * 2000-11-29 2008-08-06 三井化学株式会社 合成皮革製造用離型紙
US7776446B2 (en) 2001-06-04 2010-08-17 Saint-Gobain Performance Plastics Corporation Multi-layer release films
WO2004087401A1 (fr) * 2003-03-28 2004-10-14 Mitsui Chemicals, Inc. Film etire et son procede de production
TWI476103B (zh) * 2003-07-01 2015-03-11 Sumitomo Bakelite Co A release film and a method of manufacturing a flexible printed wiring board using the release film
EP1674230B1 (fr) * 2003-09-30 2013-11-06 Sekisui Chemical Co., Ltd. Feuille multicouche
US20050100695A1 (en) * 2003-11-12 2005-05-12 Holbert Victor P. Low surface energy blends useful in the manufacture of ovenable containers
JP2005178323A (ja) * 2003-12-24 2005-07-07 Sumitomo Bakelite Co Ltd 離型フィルムとその製造方法及びそれを用いたフレキの製造方法
KR101065975B1 (ko) 2003-12-26 2011-09-19 세키스이가가쿠 고교가부시키가이샤 이형 필름
JP2006130796A (ja) * 2004-11-05 2006-05-25 Daicel Chem Ind Ltd ポリメチルペンテン系樹脂層を含む積層体及びその製造方法
JP2006212954A (ja) * 2005-02-04 2006-08-17 Mitsui Chemicals Inc 離型フィルム
CN101175637B (zh) * 2005-05-13 2012-07-25 三井化学株式会社 含有4-甲基-1-戊烯类聚合物的层合体及由其构成的脱模膜
US7776428B2 (en) 2006-02-13 2010-08-17 Saint-Gobain Performance Plastics Corporation Multi-layer release films
US20070206364A1 (en) * 2006-03-02 2007-09-06 Saint-Gobain Performance Plastics Corporation Methods of forming a flexible circuit board
KR101084879B1 (ko) * 2006-04-19 2011-11-21 소마 가부시기가이샤 열프레스용 이형시트 및 이를 이용하여 플렉시블 프린트 배선판을 제조하는 방법
CN101479327B (zh) * 2006-06-27 2012-05-30 三井化学株式会社 膜及脱模膜
WO2008012940A1 (fr) * 2006-07-24 2008-01-31 Kuraray Co., Ltd. Film antiadhésif pour la fabrication d'une plaque de circuit imprimé
JP5368054B2 (ja) * 2008-10-15 2013-12-18 日本メクトロン株式会社 フレキシブル回路基板の製造方法及びフレキシブル回路基板
WO2012090733A1 (fr) 2010-12-27 2012-07-05 株式会社クラレ Carte de circuit, et procédé de fabrication associé
JP5765018B2 (ja) * 2011-03-31 2015-08-19 住友ベークライト株式会社 離型フィルム
CN102294864A (zh) * 2011-07-01 2011-12-28 刘烈新 复合耐高温离型膜
CN102523690B (zh) * 2011-12-26 2014-08-06 深圳市星河电路有限公司 一种盲槽内含有ic脚的pcb板制作方法
CN102573339A (zh) * 2012-01-18 2012-07-11 四会富士电子科技有限公司 一种埋盲孔结构的pcb板的压合工艺
JP6271320B2 (ja) * 2014-03-28 2018-01-31 アキレス株式会社 離型フィルム
CN104853546B (zh) * 2015-05-18 2017-09-05 惠州市金百泽电路科技有限公司 一种挠性板在外层的刚挠结合板覆盖膜压合方法
WO2017125810A1 (fr) * 2016-01-21 2017-07-27 王子ホールディングス株式会社 Film anti-adhésif
JP6620694B2 (ja) * 2016-07-22 2019-12-18 王子ホールディングス株式会社 剥離性フィルム
JP6677155B2 (ja) * 2016-01-21 2020-04-08 王子ホールディングス株式会社 剥離性フィルム
CN106042553B (zh) * 2016-06-13 2018-06-26 昆山致信天城电子材料有限公司 一种耐高温离型膜及制造工艺
CN110087881A (zh) 2016-12-16 2019-08-02 东丽薄膜先端加工股份有限公司 脱模膜及保护膜
JP2018167458A (ja) * 2017-03-29 2018-11-01 日本メクトロン株式会社 離型フィルムおよびフレキシブルプリント基板の製造方法
TWI787246B (zh) * 2017-03-30 2022-12-21 日商日本瑞翁股份有限公司 光學薄膜、其製造方法、偏光板及液晶顯示裝置
CN111993734A (zh) * 2019-05-27 2020-11-27 宁波长阳科技股份有限公司 一种耐高温离型膜及其制备方法
EP4489968A1 (fr) 2022-03-10 2025-01-15 Loparex Germany GmbH & Co. KG Film de séparation emboutissable par emboutissage profond pour composants en matière plastique composite à base de fibres

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6028442A (ja) * 1983-07-26 1985-02-13 Mitsui Petrochem Ind Ltd ポリ４−メチル−１−ペンテンフイルム
CA1298451C (fr) * 1985-08-02 1992-04-07 Hiromi Shigemoto Films et feuilles a surface rugueuse et methode de fabrication et d'utilisation de ces produits
US4876156A (en) * 1987-05-15 1989-10-24 Shell Oil Company Film and sheet capable of forming retortable and easy-open packagings
JP2659404B2 (ja) * 1988-07-13 1997-09-30 住友ベークライト株式会社 離型多層フィルム
JP2571271B2 (ja) * 1988-10-17 1997-01-16 三井石油化学工業株式会社 積層体

Also Published As

Publication number Publication date
KR930000144B1 (ko) 1993-01-09
EP0376681B1 (fr) 1996-02-14
KR900011359A (ko) 1990-07-11
ATE134173T1 (de) 1996-02-15
JPH02175247A (ja) 1990-07-06
DE68925688D1 (de) 1996-03-28
EP0376681A2 (fr) 1990-07-04
JP2619034B2 (ja) 1997-06-11
US5080979A (en) 1992-01-14
CA2006708C (fr) 2001-10-16
EP0376681A3 (fr) 1991-03-27
DE68925688T2 (de) 1996-07-11

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Legal Events

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