CA2177052A1 - Charge plate fabrication process - Google Patents

Charge plate fabrication process

Info

Publication number: CA2177052A1
Authority: CA; Canada
Prior art keywords: charge plate; charge; substrate; fabricating; ceramic
Prior art date: 1995-05-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

CA 2177052

Other languages

English (en)

French (fr)

Inventor

David J. Stephens

Brian G. Morris

Peter N. Tank

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Kodak Versamark Inc

Original Assignee

Kodak Versamark Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1995-05-26

Filing date

1996-05-21

Publication date

1996-11-27

1996-05-21 Application filed by Kodak Versamark Inc filed Critical Kodak Versamark Inc

1996-11-27 Publication of CA2177052A1 publication Critical patent/CA2177052A1/en

Status Abandoned legal-status Critical Current

Links

238000004519 manufacturing process Methods 0.000 title claims description 35
238000000034 method Methods 0.000 title description 40
230000008569 process Effects 0.000 title description 22
239000000758 substrate Substances 0.000 claims abstract description 41
239000000919 ceramic Substances 0.000 claims abstract description 18
239000003989 dielectric material Substances 0.000 claims abstract description 6
238000000059 patterning Methods 0.000 claims description 17
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
238000007639 printing Methods 0.000 claims description 9
239000011248 coating agent Substances 0.000 claims description 8
238000000576 coating method Methods 0.000 claims description 8
TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
239000000976 ink Substances 0.000 description 29
239000010408 film Substances 0.000 description 18
239000000463 material Substances 0.000 description 13
238000005516 engineering process Methods 0.000 description 11
239000010931 gold Substances 0.000 description 7
229910052737 gold Inorganic materials 0.000 description 7
229910052751 metal Inorganic materials 0.000 description 7
239000002184 metal Substances 0.000 description 7
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
238000001035 drying Methods 0.000 description 5
239000010409 thin film Substances 0.000 description 5
239000011805 ball Substances 0.000 description 4
239000000470 constituent Substances 0.000 description 4
238000010304 firing Methods 0.000 description 4
238000012546 transfer Methods 0.000 description 4
230000015572 biosynthetic process Effects 0.000 description 3
238000007796 conventional method Methods 0.000 description 3
238000007641 inkjet printing Methods 0.000 description 3
229910052759 nickel Inorganic materials 0.000 description 3
239000000843 powder Substances 0.000 description 3
238000012545 processing Methods 0.000 description 3
229910010293 ceramic material Inorganic materials 0.000 description 2
238000003486 chemical etching Methods 0.000 description 2
238000010586 diagram Methods 0.000 description 2
238000009792 diffusion process Methods 0.000 description 2
238000007650 screen-printing Methods 0.000 description 2
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
239000004593 Epoxy Substances 0.000 description 1
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
230000004888 barrier function Effects 0.000 description 1
239000011230 binding agent Substances 0.000 description 1
230000015556 catabolic process Effects 0.000 description 1
238000009833 condensation Methods 0.000 description 1
230000005494 condensation Effects 0.000 description 1
239000004020 conductor Substances 0.000 description 1
238000010276 construction Methods 0.000 description 1
239000011889 copper foil Substances 0.000 description 1
230000003247 decreasing effect Effects 0.000 description 1
238000000151 deposition Methods 0.000 description 1
238000005530 etching Methods 0.000 description 1
238000001704 evaporation Methods 0.000 description 1
239000011888 foil Substances 0.000 description 1
239000011521 glass Substances 0.000 description 1
238000009396 hybridization Methods 0.000 description 1
230000010354 integration Effects 0.000 description 1
150000002500 ions Chemical class 0.000 description 1
238000002955 isolation Methods 0.000 description 1
229910044991 metal oxide Inorganic materials 0.000 description 1
150000004706 metal oxides Chemical class 0.000 description 1
239000011806 microball Substances 0.000 description 1
238000004377 microelectronic Methods 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
239000005416 organic matter Substances 0.000 description 1
229920002120 photoresistant polymer Polymers 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
239000011253 protective coating Substances 0.000 description 1
238000012216 screening Methods 0.000 description 1
229910052710 silicon Inorganic materials 0.000 description 1
239000010703 silicon Substances 0.000 description 1
229910000029 sodium carbonate Inorganic materials 0.000 description 1
238000005476 soldering Methods 0.000 description 1
239000002904 solvent Substances 0.000 description 1
239000007921 spray Substances 0.000 description 1
239000003381 stabilizer Substances 0.000 description 1
239000000126 substance Substances 0.000 description 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/07—Ink jet characterised by jet control
- B41J2/075—Ink jet characterised by jet control for many-valued deflection
- B41J2/08—Ink jet characterised by jet control for many-valued deflection charge-control type
- B41J2/085—Charge means, e.g. electrodes

Landscapes

Particle Formation And Scattering Control In Inkjet Printers (AREA)

CA 2177052 1995-05-26 1996-05-21 Charge plate fabrication process Abandoned CA2177052A1 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US45123295A	1995-05-26	1995-05-26
US08/451,232		1995-05-26

Publications (1)

Publication Number	Publication Date
CA2177052A1 true CA2177052A1 (en)	1996-11-27

Family

ID=23791363

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA 2177052 Abandoned CA2177052A1 (en)	1995-05-26	1996-05-21	Charge plate fabrication process

Country Status (4)

Country	Link
EP (1)	EP0744291B1 (de)
JP (1)	JP3945838B2 (de)
CA (1)	CA2177052A1 (de)
DE (1)	DE69609248T2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0771655B1 (de) *	1995-10-31	2002-09-25	SCITEX DIGITAL PRINTING, Inc.	Kurzschlussnachweisschaltung für Tintenstrahldrucker
FR2763870B1 (fr)	1997-06-03	1999-08-20	Imaje Sa	Systeme de commande de projection de liquide electriquement conducteur
JP4552241B2 (ja) *	1999-09-24	2010-09-29	ブラザー工業株式会社	インクジェットヘッドの製造方法
EP1396342A1 (de) *	2002-09-06	2004-03-10	Domino Printing Sciences Plc	Aufladungselektrode für einen kontinuierlichen Tintenstrahldrucker
US6951778B2 (en) *	2002-10-31	2005-10-04	Hewlett-Packard Development Company, L.P.	Edge-sealed substrates and methods for effecting the same
US7204020B2 (en)	2004-10-15	2007-04-17	Eastman Kodak Company	Method for fabricating a charge plate for an inkjet printhead
US20060082620A1 (en)	2004-10-15	2006-04-20	Eastman Kodak Company	Charge plate fabrication technique

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4223321A (en) *	1979-04-30	1980-09-16	The Mead Corporation	Planar-faced electrode for ink jet printer and method of manufacture
CA1227699A (en) *	1983-07-27	1987-10-06	Walter L. Schutrum	Electroformed charge plate for ink jet printers
US4622562A (en) *	1985-04-12	1986-11-11	Eastman Kodak Company	Ink jet printhead multi-component heating
US5459500A (en) *	1992-03-25	1995-10-17	Scitex Digital Printing, Inc.	Charge plate connectors and method of making
DE69410852T2 (de) *	1993-03-01	1998-10-08	Scitex Digital Printing Inc	Passivierungsschicht für Ladungselektroden auf Basis von Keramik

1996
- 1996-05-14 EP EP19960303398 patent/EP0744291B1/de not_active Expired - Lifetime
- 1996-05-14 DE DE1996609248 patent/DE69609248T2/de not_active Expired - Lifetime
- 1996-05-21 CA CA 2177052 patent/CA2177052A1/en not_active Abandoned
- 1996-05-27 JP JP13212096A patent/JP3945838B2/ja not_active Expired - Fee Related

Also Published As

Publication number	Publication date
JPH0999561A (ja)	1997-04-15
JP3945838B2 (ja)	2007-07-18
EP0744291A2 (de)	1996-11-27
DE69609248T2 (de)	2001-03-08
DE69609248D1 (de)	2000-08-17
EP0744291B1 (de)	2000-07-12
EP0744291A3 (de)	1998-03-04

Legal Events

Date	Code	Title	Description
2003-05-21	FZDE	Dead

Publication	Publication Date	Title
US5322594A (en)	1994-06-21	Manufacture of a one piece full width ink jet printing bar
GB1587739A (en)	1981-04-08	Charge plate for ink jet printers
JP2001160672A (ja)	2001-06-12	受動部品を埋め込む方法
KR100754712B1 (ko)	2007-09-03	전력 코어 장치 및 그 제조 방법
EP0744291B1 (de)	2000-07-12	Verfahren zur Herstellung von Ladungselektroden
EP0157563B1 (de)	1992-05-20	Thermischer Druckkopf und Verfahren zum Herstellen einer Schaltungsplatte dafür
US7159969B2 (en)	2007-01-09	Composite ink jet printhead and relative manufacturing process
EP0744290B1 (de)	2001-07-11	Verfahren zur Herstellung von Ladungselektroden
EP0380366B1 (de)	1994-09-21	Trägerschicht für Aufzeichnungskopf und Aufzeichnungskopf
WO1997030461A1 (en)	1997-08-21	Resistor network in ball grid array package
US5019675A (en)	1991-05-28	Thick film substrate with highly thermally conductive metal base
EP0951393A1 (de)	1999-10-27	Drucker mit kontinuierlichem tintenstrahl
JP3289820B2 (ja)	2002-06-10	サーマルヘッド
JP3957342B2 (ja)	2007-08-15	チャージ板の製造方法
US4990935A (en)	1991-02-05	Thermal head
US4251820A (en)	1981-02-17	Solder glass bonded charge electrode assembly for ink jet printers
JP3824246B2 (ja)	2006-09-20	サーマルヘッドの製造方法
EP0622845A2 (de)	1994-11-02	Apparat und Verfahren zur automatischen Bandmontage mit beam lead Isolation
JP2528436B2 (ja)	1996-08-28	回路基板装置の製造方法
JP2812806B2 (ja)	1998-10-22	テストパット付集積回路用パッケージ
Bender et al.	1993	Higher density using diffusion patterned vias and fine line printing
JP2001191572A (ja)	2001-07-17	サーマルヘッド
JPH0787224B2 (ja)	1995-09-20	セラミック基板及び半導体装置の製造方法
JPH07205464A (ja)	1995-08-08	サーマルヘッド
JPH1154918A (ja)	1999-02-26	厚膜多層回路基板およびその製造方法