CN101611176A - 电铸方法和由该方法得到的制件或层 - Google Patents

电铸方法和由该方法得到的制件或层 Download PDF

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Publication number
CN101611176A
CN101611176A CNA2007800368276A CN200780036827A CN101611176A CN 101611176 A CN101611176 A CN 101611176A CN A2007800368276 A CNA2007800368276 A CN A2007800368276A CN 200780036827 A CN200780036827 A CN 200780036827A CN 101611176 A CN101611176 A CN 101611176A
Authority
CN
China
Prior art keywords
weight
electroforming
gold
zinc
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007800368276A
Other languages
English (en)
Chinese (zh)
Inventor
J·格鲁普
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Swatch Group Research and Development SA
Original Assignee
Swatch Group Research and Development SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Swatch Group Research and Development SA filed Critical Swatch Group Research and Development SA
Publication of CN101611176A publication Critical patent/CN101611176A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Adornments (AREA)
  • Laminated Bodies (AREA)
CNA2007800368276A 2006-10-03 2007-10-03 电铸方法和由该方法得到的制件或层 Pending CN101611176A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH1583/06 2006-10-03
CH01583/06A CH714243B1 (fr) 2006-10-03 2006-10-03 Procédé d'électroformage et pièce ou couche obtenue par ce procédé.

Publications (1)

Publication Number Publication Date
CN101611176A true CN101611176A (zh) 2009-12-23

Family

ID=38799403

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007800368276A Pending CN101611176A (zh) 2006-10-03 2007-10-03 电铸方法和由该方法得到的制件或层

Country Status (7)

Country Link
US (1) US20100024930A1 (fr)
EP (1) EP2079859A2 (fr)
JP (1) JP2010506040A (fr)
KR (1) KR101326883B1 (fr)
CN (1) CN101611176A (fr)
CH (1) CH714243B1 (fr)
WO (1) WO2008040761A2 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102539217A (zh) * 2011-12-26 2012-07-04 昆山全亚冠环保科技有限公司 一种银金合金金相腐蚀剂以及金相显示方法
CN102732920A (zh) * 2011-03-31 2012-10-17 斯沃奇集团研究及开发有限公司 18开3n金合金的制备方法
CN112725653A (zh) * 2020-12-21 2021-04-30 有研亿金新材料有限公司 一种新型高塑性金基电刷材料及其制备方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2596454A (en) * 1949-09-10 1952-05-13 Metals & Controls Corp Gold alloys
US2660554A (en) * 1950-11-10 1953-11-24 Barnet D Ostrow Bright gold and gold alloy plating baths
CH286123A (fr) * 1952-05-08 1952-10-15 Spreter Victor Bain pour le dépôt par voie galvanique d'alliages d'or.
US2976180A (en) * 1957-12-17 1961-03-21 Hughes Aircraft Co Method of silver plating by chemical reduction
US3475292A (en) * 1966-02-10 1969-10-28 Technic Gold plating bath and process
US3642589A (en) * 1969-09-29 1972-02-15 Fred I Nobel Gold alloy electroplating baths
US3666640A (en) * 1971-04-23 1972-05-30 Sel Rex Corp Gold plating bath and process
DE2244434C3 (de) * 1972-09-06 1982-02-25 Schering Ag, 1000 Berlin Und 4619 Bergkamen Wäßriges Bad zur galvanischen Abscheidung von Gold und Goldlegierungen
CH622829A5 (fr) * 1977-08-29 1981-04-30 Systemes Traitements Surfaces
JPS5662984A (en) * 1979-10-25 1981-05-29 Seiko Epson Corp Gold plating constitution of external parts for watch
DE3020765A1 (de) * 1980-05-31 1981-12-10 Degussa Ag, 6000 Frankfurt Alkalisches bad zum galvanischen abscheiden niederkaraetiger rosa- bis gelbfarbener goldlegierungsschichten
GB8334226D0 (en) * 1983-12-22 1984-02-01 Learonal Uk Ltd Electrodeposition of gold alloys
CH662583A5 (fr) * 1985-03-01 1987-10-15 Heinz Emmenegger Bain galvanique pour le depot electrolytique d'alliages d'or-cuivre-cadmium-zinc.
DE3633529A1 (de) * 1986-10-02 1988-05-19 Lpw Chemie Gmbh Verfahren zum galvanischen abscheiden niedrigkaraetiger gold/kupfer/zink-legierungen
DE3878783T2 (de) * 1987-08-21 1993-07-22 Engelhard Ltd Bad fuer das elektroplattieren einer gold-kupfer-zink-legierung.
JPH01247540A (ja) * 1988-03-29 1989-10-03 Seiko Instr Inc 硬質金合金外装部品の製造方法
DE3929569C1 (fr) * 1989-09-06 1991-04-18 Degussa Ag, 6000 Frankfurt, De
GB2242200B (en) * 1990-02-20 1993-11-17 Omi International Plating compositions and processes
CH680927A5 (fr) 1990-10-08 1992-12-15 Metaux Precieux Sa
US5085744A (en) * 1990-11-06 1992-02-04 Learonal, Inc. Electroplated gold-copper-zinc alloys
US5244593A (en) * 1992-01-10 1993-09-14 The Procter & Gamble Company Colorless detergent compositions with enhanced stability
US5256275A (en) * 1992-04-15 1993-10-26 Learonal, Inc. Electroplated gold-copper-silver alloys
US5340529A (en) * 1993-07-01 1994-08-23 Dewitt Troy C Gold jewelry alloy
ES2179952T3 (es) * 1995-11-03 2003-02-01 Enthone Omi Inc Composiciones y depositos de procedimientos de electrodeposicion.
HK1047773B (zh) * 1999-06-17 2006-01-27 德古萨电解技术有限公司 用於电沉积有光泽的金和金合金镀层的酸性浴液及其所用的光泽剂
JP4023138B2 (ja) * 2001-02-07 2007-12-19 日立金属株式会社 鉄基希土類合金粉末および鉄基希土類合金粉末を含むコンパウンドならびにそれを用いた永久磁石
FR2828889B1 (fr) * 2001-08-24 2004-05-07 Engelhard Clal Sas Bain electrolytique pour le depot electrochimique de l'or et de ses alliages
EP1548525B2 (fr) * 2003-12-23 2017-08-16 Rolex Sa Elément en céramique pour boîte de montre et procédé de fabrication de cet élément
JP4566667B2 (ja) * 2004-01-16 2010-10-20 キヤノン株式会社 めっき液、めっき液を用いた構造体の製造方法、めっき液を用いた装置
SG127854A1 (en) * 2005-06-02 2006-12-29 Rohm & Haas Elect Mat Improved gold electrolytes
CH710184B1 (fr) * 2007-09-21 2016-03-31 Aliprandini Laboratoires G Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques.

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102732920A (zh) * 2011-03-31 2012-10-17 斯沃奇集团研究及开发有限公司 18开3n金合金的制备方法
CN102732920B (zh) * 2011-03-31 2015-07-22 斯沃奇集团研究及开发有限公司 18开3n金合金的制备方法
CN102539217A (zh) * 2011-12-26 2012-07-04 昆山全亚冠环保科技有限公司 一种银金合金金相腐蚀剂以及金相显示方法
CN112725653A (zh) * 2020-12-21 2021-04-30 有研亿金新材料有限公司 一种新型高塑性金基电刷材料及其制备方法

Also Published As

Publication number Publication date
CH714243B1 (fr) 2019-04-15
US20100024930A1 (en) 2010-02-04
EP2079859A2 (fr) 2009-07-22
KR20090069324A (ko) 2009-06-30
JP2010506040A (ja) 2010-02-25
KR101326883B1 (ko) 2013-11-11
WO2008040761A2 (fr) 2008-04-10
WO2008040761A3 (fr) 2008-11-06

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