CN1088321C - 使用两种不同的金属化过程制造电路基片的方法 - Google Patents

使用两种不同的金属化过程制造电路基片的方法 Download PDF

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Publication number
CN1088321C
CN1088321C CN96119259A CN96119259A CN1088321C CN 1088321 C CN1088321 C CN 1088321C CN 96119259 A CN96119259 A CN 96119259A CN 96119259 A CN96119259 A CN 96119259A CN 1088321 C CN1088321 C CN 1088321C
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CN
China
Prior art keywords
layer
conductive material
conductive
dielectric
dielectric layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN96119259A
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English (en)
Chinese (zh)
Other versions
CN1156948A (zh
Inventor
A·C·巴特
R·J·戴
T·P·达菲
J·A·奈特
R·W·马利克
V·R·马科维克
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International Business Machines Corp
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International Business Machines Corp
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Publication date
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Publication of CN1156948A publication Critical patent/CN1156948A/zh
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Publication of CN1088321C publication Critical patent/CN1088321C/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1407—Applying catalyst before applying plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CN96119259A 1995-12-01 1996-11-20 使用两种不同的金属化过程制造电路基片的方法 Expired - Fee Related CN1088321C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US566,363 1983-12-28
US566363 1983-12-28
US08/566,363 US5707893A (en) 1995-12-01 1995-12-01 Method of making a circuitized substrate using two different metallization processes

Publications (2)

Publication Number Publication Date
CN1156948A CN1156948A (zh) 1997-08-13
CN1088321C true CN1088321C (zh) 2002-07-24

Family

ID=24262573

Family Applications (1)

Application Number Title Priority Date Filing Date
CN96119259A Expired - Fee Related CN1088321C (zh) 1995-12-01 1996-11-20 使用两种不同的金属化过程制造电路基片的方法

Country Status (5)

Country Link
US (2) US5707893A (2)
KR (1) KR100240915B1 (2)
CN (1) CN1088321C (2)
SG (1) SG44058A1 (2)
TW (1) TW312080B (2)

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US6013417A (en) * 1998-04-02 2000-01-11 International Business Machines Corporation Process for fabricating circuitry on substrates having plated through-holes
US6296897B1 (en) * 1998-08-12 2001-10-02 International Business Machines Corporation Process for reducing extraneous metal plating
IT1312433B1 (it) * 1999-05-14 2002-04-17 Cadif Srl Pannello con tessuto elettro-termico,ad alto isolamento elettrico
US6869750B2 (en) * 1999-10-28 2005-03-22 Fujitsu Limited Structure and method for forming a multilayered structure
JP3736607B2 (ja) * 2000-01-21 2006-01-18 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
CN100336426C (zh) * 2000-02-25 2007-09-05 揖斐电株式会社 多层印刷电路板以及多层印刷电路板的制造方法
US6753483B2 (en) * 2000-06-14 2004-06-22 Matsushita Electric Industrial Co., Ltd. Printed circuit board and method of manufacturing the same
US6617239B1 (en) 2000-08-31 2003-09-09 Micron Technology, Inc. Subtractive metallization structure and method of making
CN1278413C (zh) 2000-09-25 2006-10-04 揖斐电株式会社 半导体元件及其制造方法、多层印刷布线板及其制造方法
DE10126734B4 (de) * 2001-05-31 2009-02-26 Qimonda Ag Umverdrahtungsverfahren und damit hergestelltes Bauelement
US20040188257A1 (en) * 2001-08-31 2004-09-30 John Klocke Methods for processing micro-feature workpieces, patterned structures on micro-feature workpieces, and integrated tools for processing micro-feature workpieces
JP3807312B2 (ja) * 2002-01-18 2006-08-09 富士通株式会社 プリント基板とその製造方法
JP4285629B2 (ja) * 2002-04-25 2009-06-24 富士通株式会社 集積回路を搭載するインターポーザ基板の作製方法
KR100499004B1 (ko) * 2002-12-18 2005-07-01 삼성전기주식회사 광비아홀을 구비하는 인쇄회로기판 및 가공 공정
US7179738B2 (en) * 2004-06-17 2007-02-20 Texas Instruments Incorporated Semiconductor assembly having substrate with electroplated contact pads
US7411303B2 (en) * 2004-11-09 2008-08-12 Texas Instruments Incorporated Semiconductor assembly having substrate with electroplated contact pads
US6964884B1 (en) * 2004-11-19 2005-11-15 Endicott Interconnect Technologies, Inc. Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same
KR100643496B1 (ko) * 2004-12-23 2006-11-10 삼성전자주식회사 노말 오픈/클로즈 타입 겸용 광센서 보드
US7808013B2 (en) * 2006-10-31 2010-10-05 Cree, Inc. Integrated heat spreaders for light emitting devices (LEDs) and related assemblies
KR100990618B1 (ko) * 2008-04-15 2010-10-29 삼성전기주식회사 랜드리스 비아홀을 갖는 인쇄회로기판 및 그 제조방법
US8186053B2 (en) * 2008-11-14 2012-05-29 Fujitsu Limited Circuit board and method of manufacturing the same
JP5565950B2 (ja) * 2010-08-23 2014-08-06 京セラＳｌｃテクノロジー株式会社 配線基板の製造方法
CN104053305B (zh) * 2013-03-13 2017-06-16 北大方正集团有限公司 一种印制线路板及其制作方法
US10537027B2 (en) 2013-08-02 2020-01-14 Orbotech Ltd. Method producing a conductive path on a substrate
CN104703409B (zh) * 2013-12-09 2018-03-16 深南电路有限公司 电路板加工方法和相关装置
US10356906B2 (en) * 2016-06-21 2019-07-16 Abb Schweiz Ag Method of manufacturing a PCB including a thick-wall via

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3568312A (en) * 1968-10-04 1971-03-09 Hewlett Packard Co Method of making printed circuit boards
EP0189975A1 (en) * 1985-01-15 1986-08-06 Prestwick Circuits Limited Manufacture of printed circuit boards
EP0472158A2 (en) * 1990-08-20 1992-02-26 Mitsubishi Rayon Company Ltd. Process for producing a printed wiring board

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US4866008A (en) * 1987-12-11 1989-09-12 Texas Instruments Incorporated Methods for forming self-aligned conductive pillars on interconnects
JPH01260886A (ja) * 1988-04-11 1989-10-18 Minolta Camera Co Ltd プリント基板の製造方法
US4810332A (en) * 1988-07-21 1989-03-07 Microelectronics And Computer Technology Corporation Method of making an electrical multilayer copper interconnect
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US5252195A (en) * 1990-08-20 1993-10-12 Mitsubishi Rayon Company Ltd. Process for producing a printed wiring board
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JP2773578B2 (ja) * 1992-10-02 1998-07-09 日本電気株式会社 半導体装置の製造方法
US5354712A (en) * 1992-11-12 1994-10-11 Northern Telecom Limited Method for forming interconnect structures for integrated circuits
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Patent Citations (3)

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US3568312A (en) * 1968-10-04 1971-03-09 Hewlett Packard Co Method of making printed circuit boards
EP0189975A1 (en) * 1985-01-15 1986-08-06 Prestwick Circuits Limited Manufacture of printed circuit boards
EP0472158A2 (en) * 1990-08-20 1992-02-26 Mitsubishi Rayon Company Ltd. Process for producing a printed wiring board

Also Published As

Publication number Publication date
SG44058A1 (en) 1997-11-14
KR100240915B1 (ko) 2000-01-15
CN1156948A (zh) 1997-08-13
US5817405A (en) 1998-10-06
KR970058406A (ko) 1997-07-31
TW312080B (2) 1997-08-01
US5707893A (en) 1998-01-13

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