CN1106420A - 液态环氧树脂组合物 - Google Patents

液态环氧树脂组合物 Download PDF

Info

Publication number
CN1106420A
CN1106420A CN94109560A CN94109560A CN1106420A CN 1106420 A CN1106420 A CN 1106420A CN 94109560 A CN94109560 A CN 94109560A CN 94109560 A CN94109560 A CN 94109560A CN 1106420 A CN1106420 A CN 1106420A
Authority
CN
China
Prior art keywords
epoxy resin
epoxy
resins
acid
bisphenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN94109560A
Other languages
English (en)
Chinese (zh)
Inventor
井村哲朗
村田保幸
中西义则
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shell Internationale Research Maatschappij BV
Original Assignee
Shell Internationale Research Maatschappij BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shell Internationale Research Maatschappij BV filed Critical Shell Internationale Research Maatschappij BV
Publication of CN1106420A publication Critical patent/CN1106420A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/12—Polycondensates containing more than one epoxy group per molecule of polycarboxylic acids with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1444—Monoalcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN94109560A 1993-08-20 1994-08-19 液态环氧树脂组合物 Pending CN1106420A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22671493A JP3428695B2 (ja) 1993-08-20 1993-08-20 変性液状エポキシ樹脂組成物
JP226714/93 1993-08-20

Publications (1)

Publication Number Publication Date
CN1106420A true CN1106420A (zh) 1995-08-09

Family

ID=16849489

Family Applications (1)

Application Number Title Priority Date Filing Date
CN94109560A Pending CN1106420A (zh) 1993-08-20 1994-08-19 液态环氧树脂组合物

Country Status (7)

Country Link
US (1) US5623031A (2)
EP (1) EP0640635A1 (2)
JP (1) JP3428695B2 (2)
KR (1) KR100327919B1 (2)
CN (1) CN1106420A (2)
MY (1) MY115318A (2)
TW (1) TW260693B (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111735738A (zh) * 2020-07-01 2020-10-02 道生天合材料科技(上海)股份有限公司 一种液体环氧树脂结晶倾向性的测定方法

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3637987B2 (ja) * 1995-11-20 2005-04-13 ジャパンエポキシレジン株式会社 注型用エポキシ樹脂及びエポキシ樹脂組成物
JPH10204257A (ja) * 1997-01-24 1998-08-04 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
JP3409279B2 (ja) * 1997-11-11 2003-05-26 株式会社日本触媒 硬化性樹脂および樹脂組成物
US20040161545A1 (en) * 2000-11-28 2004-08-19 Shipley Company, L.L.C. Adhesion method
EP1209253A3 (en) 2000-11-28 2004-02-25 Shipley Co. L.L.C. Process for treating adhesion promoted metal surfaces with epoxy resins
JP5095909B2 (ja) * 2003-06-24 2012-12-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. 触媒組成物および析出方法
US9598528B2 (en) 2004-09-29 2017-03-21 Nissan Chemical Industries, Ltd. Modified epoxy resin composition
TWI397540B (zh) * 2004-12-21 2013-06-01 Nippon Kayaku Kk 環氧樹脂,環氧樹脂組成物及其硬化物
CN101522747B (zh) * 2006-08-17 2012-07-04 日本化药株式会社 变性液性环氧树脂、以及使用该树脂的环氧树脂组成物及其硬化物
CN101688051B (zh) * 2007-07-11 2013-03-13 日产化学工业株式会社 含有无机粒子的液体环氧树脂形成用制剂
JP5377020B2 (ja) 2009-03-23 2013-12-25 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
ES2642061T3 (es) 2010-04-16 2017-11-15 Valspar Sourcing, Inc. Composiciones de recubrimiento para artículos de envasado y métodos de recubrimiento
WO2012109278A2 (en) 2011-02-07 2012-08-16 Valspar Sourcing, Inc. Coating compositions for containers and other articles and methods of coating
US10526502B2 (en) 2012-08-09 2020-01-07 Swimc Llc Container coating system
AU2013299578A1 (en) 2012-08-09 2015-02-19 Valspar Sourcing, Inc. Compositions for containers and other articles and methods of using same
JP6221634B2 (ja) * 2013-10-30 2017-11-01 Tdk株式会社 樹脂組成物、樹脂シート、樹脂硬化物および基板
US10174153B2 (en) 2013-12-17 2019-01-08 Nissan Chemical Industries, Ltd. Highly soluble modified epoxy resin composition
JP6746501B2 (ja) 2014-04-14 2020-08-26 ヴァルスパー・ソーシング・インコーポレーテッド 容器及び他の物品のための組成物の調製方法並びにその使用方法
JP6525305B2 (ja) * 2014-09-19 2019-06-05 互応化学工業株式会社 硬化性組成物及び被覆配線板の製造方法
TWI614275B (zh) 2015-11-03 2018-02-11 Valspar Sourcing Inc 用於製備聚合物的液體環氧樹脂組合物
US10787755B2 (en) 2017-06-05 2020-09-29 The Boeing Company Method and apparatus for manufacturing carbon fibers
WO2020234615A1 (en) 2019-05-19 2020-11-26 Robinson Alex P G Method of forming a pattern resist for euv
KR102727987B1 (ko) * 2023-07-31 2024-11-08 고려대학교 산학협력단 관 형태의 수술도구 자동 삽입기

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3247136A (en) * 1957-04-26 1966-04-19 Union Carbide Corp Method for manufacturing polymeric polyhydric alcohols
US3256226A (en) * 1965-03-01 1966-06-14 Robertson Co H H Hydroxy polyether polyesters having terminal ethylenically unsaturated groups
DE1595795C3 (de) * 1966-03-26 1974-10-17 Henkel & Cie. Gmbh, 4000 Duesseldorf Verfahren zur Herstellung von modifiziertem Triglycidylisocyanurat
CH483447A (de) * 1966-06-16 1969-12-31 Ciba Geigy Verfahren zur Modifizierung von Triglycidylisocyanurat
DE1620394B2 (de) * 1966-07-15 1973-01-18 Siemens AG, 1000 Berlin u. 8000 München Verfahren zur herstellung von haertbaren hoehermolekularen epoxydharzen
JPS5725562B2 (2) * 1972-09-07 1982-05-31
US4026862A (en) * 1974-02-11 1977-05-31 Westinghouse Electric Corporation Carboxylic acid storage stabilizers for latent catalyst cured epoxy resins
EP0018950B1 (de) * 1979-05-08 1983-07-13 Ciba-Geigy Ag Einkomponentensysteme auf der Basis kristalliner Epoxidharze und ihre Verwendung
JPS57131221A (en) * 1981-02-05 1982-08-14 Ube Ind Ltd Photo-curable composition
US4394497A (en) * 1982-03-29 1983-07-19 The Dow Chemical Company Solid materials prepared from epoxy resins and phenolic hydroxyl-containing materials
EP0160622A3 (de) * 1984-05-02 1988-01-20 Ciba-Geigy Ag Zusammensetzungen enthaltend vorverlängerte Epoxidharzester
US4783509A (en) * 1985-03-25 1988-11-08 The Dow Chemical Company Non-thermoset thermally stable capped epoxy resin compositions
JPS62525A (ja) * 1985-06-26 1987-01-06 Showa Highpolymer Co Ltd ラジカル硬化可能な不飽和アルキツドの製造方法
US4895755A (en) * 1986-09-15 1990-01-23 The Dow Chemical Company Halogenated advanced epoxy resins
JPS6424825A (en) * 1987-07-20 1989-01-26 Mitsubishi Gas Chemical Co Epoxy resin composition
US4808692A (en) * 1988-02-18 1989-02-28 The Dow Chemical Company Preparation of advanced epoxy resins from epoxy resins and dihydric phenols in the presence of phosphonium compounds
JPH01296240A (ja) * 1988-05-24 1989-11-29 Unitika Ltd 感光性樹脂組成物
US4855385A (en) * 1988-06-22 1989-08-08 The Dow Chemical Company Monocarboxylic acid derivatives of aliphatic based epoxy resins
JP2732122B2 (ja) * 1989-06-13 1998-03-25 油化シエルエポキシ株式会社 エポキシ樹脂及び封止用エポキシ樹脂組成物
JPH0314818A (ja) * 1989-06-13 1991-01-23 Yuka Shell Epoxy Kk 半導体封止用エポキシ樹脂組成物
JPH04211420A (ja) * 1990-01-16 1992-08-03 Dow Chem Nippon Kk 低粘度エポキシ樹脂およびその組成物
DE4040471A1 (de) * 1990-08-01 1992-02-06 Bayer Ag Haertbare mischungen zur herstellung von epoxidnetzwerken, verfahren zu deren herstellung und verwendung
JPH0776268B2 (ja) * 1991-06-25 1995-08-16 ソマール株式会社 エポキシ樹脂粉体組成物の製造方法
US5385990A (en) * 1992-11-02 1995-01-31 Lord Corporation Structural adhesive composition having high temperature resistance

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111735738A (zh) * 2020-07-01 2020-10-02 道生天合材料科技(上海)股份有限公司 一种液体环氧树脂结晶倾向性的测定方法

Also Published As

Publication number Publication date
US5623031A (en) 1997-04-22
JPH0762060A (ja) 1995-03-07
MY115318A (en) 2003-05-31
TW260693B (2) 1995-10-21
KR100327919B1 (ko) 2002-06-22
JP3428695B2 (ja) 2003-07-22
EP0640635A1 (en) 1995-03-01
KR950005871A (ko) 1995-03-20

Similar Documents

Publication Publication Date Title
US5623031A (en) Modified liquid epoxy resin composition
JP5754731B2 (ja) エポキシ樹脂、エポキシ樹脂の製造方法、及びその使用
JP5611192B2 (ja) エポキシ樹脂、エポキシ樹脂組成物及び硬化物
JP3497560B2 (ja) 変性エポキシ樹脂の製造方法と製造された変性エポキシ樹脂及びこのエポキシ樹脂の組成物
JPS643217B2 (2)
JP5000053B2 (ja) 液状エポキシ樹脂組成物及びエポキシ樹脂硬化物
JP3734602B2 (ja) エポキシ樹脂組成物および半導体封止用エポキシ樹脂組成物
JP3481338B2 (ja) 液状エポキシ樹脂組成物
CN1203104C (zh) 用于半导体密封的环氧树脂组合物
JP2004137425A (ja) エポキシ樹脂組成物およびその成形硬化物
JP4655490B2 (ja) エポキシ樹脂組成物及びその硬化体
JP3369323B2 (ja) 半導体封止用エポキシ樹脂組成物
JP3374255B2 (ja) 新規エポキシ樹脂及びその製造方法並びにそれを用いたエポキシ樹脂組成物
JP2001002756A (ja) エポキシ樹脂混合物および硬化性エポキシ樹脂組成物
CN1239567C (zh) 结晶环氧树脂、其生产方法和包含其的可固化组合物
JP3451104B2 (ja) エポキシ樹脂組成物
JP3650637B2 (ja) エポキシ樹脂組成物
JPH03124758A (ja) 半導体封止用エポキシ樹脂組成物
JP3481347B2 (ja) 液状エポキシ樹脂組成物
JP2001114866A (ja) エポキシ化合物
JP3731585B2 (ja) エポキシ樹脂の製造方法
KR20140071357A (ko) 에폭시 수지, 에폭시 수지 조성물, 및 그 경화물
JP2000264952A (ja) エポキシ樹脂混合物および粉体塗料用エポキシ樹脂組成物
JPH0426642A (ja) エポキシ樹脂硬化剤及び硬化性エポキシ樹脂組成物
JPH0625246B2 (ja) 未硬化エポキシ樹脂の結晶化抑制方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
AD01 Patent right deemed abandoned
C20 Patent right or utility model deemed to be abandoned or is abandoned