CN1488631A - 含有苯乙烯、肉桂基或马来酰亚胺官能团的环脂族环氧化合物 - Google Patents
含有苯乙烯、肉桂基或马来酰亚胺官能团的环脂族环氧化合物 Download PDFInfo
- Publication number
- CN1488631A CN1488631A CNA031580211A CN03158021A CN1488631A CN 1488631 A CN1488631 A CN 1488631A CN A031580211 A CNA031580211 A CN A031580211A CN 03158021 A CN03158021 A CN 03158021A CN 1488631 A CN1488631 A CN 1488631A
- Authority
- CN
- China
- Prior art keywords
- ring
- carbon atom
- oneself
- group
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D491/00—Heterocyclic compounds containing in the condensed ring system both one or more rings having oxygen atoms as the only ring hetero atoms and one or more rings having nitrogen atoms as the only ring hetero atoms, not provided for by groups C07D451/00 - C07D459/00, C07D463/00, C07D477/00 or C07D489/00
- C07D491/02—Heterocyclic compounds containing in the condensed ring system both one or more rings having oxygen atoms as the only ring hetero atoms and one or more rings having nitrogen atoms as the only ring hetero atoms, not provided for by groups C07D451/00 - C07D459/00, C07D463/00, C07D477/00 or C07D489/00 in which the condensed system contains two hetero rings
- C07D491/04—Ortho-condensed systems
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
- C07D303/02—Compounds containing oxirane rings
- C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
- C07D303/16—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by esterified hydroxyl radicals
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D405/00—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
- C07D405/02—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing two hetero rings
- C07D405/12—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing two hetero rings linked by a chain containing hetero atoms as chain links
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D405/00—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
- C07D405/14—Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing three or more hetero rings
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
- C07F7/0838—Compounds with one or more Si-O-Si sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/2805—Compounds having only one group containing active hydrogen
- C08G18/2815—Monohydroxy compounds
- C08G18/2845—Monohydroxy epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/81—Unsaturated isocyanates or isothiocyanates
- C08G18/8108—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/26—Di-epoxy compounds heterocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3236—Heterocylic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Plural Heterocyclic Compounds (AREA)
- Epoxy Resins (AREA)
- Pyrrole Compounds (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Epoxy Compounds (AREA)
- Nitrogen Condensed Heterocyclic Rings (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/201,373 US6716992B2 (en) | 2002-07-22 | 2002-07-22 | Cycloaliphatic epoxy compounds containing styrenic, cinnamyl, or maleimide functionality |
| US10/201373 | 2002-07-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1488631A true CN1488631A (zh) | 2004-04-14 |
| CN100430400C CN100430400C (zh) | 2008-11-05 |
Family
ID=30000085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031580211A Expired - Fee Related CN100430400C (zh) | 2002-07-22 | 2003-07-22 | 含有苯乙烯、肉桂基或马来酰亚胺官能团的环脂族环氧化合物 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6716992B2 (zh) |
| EP (2) | EP1384737B1 (zh) |
| JP (1) | JP2004149512A (zh) |
| KR (1) | KR100973317B1 (zh) |
| CN (1) | CN100430400C (zh) |
| DE (2) | DE60329604D1 (zh) |
| MY (1) | MY133626A (zh) |
| SG (1) | SG109521A1 (zh) |
| TW (1) | TWI276633B (zh) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060284141A1 (en) * | 2005-06-21 | 2006-12-21 | Musa Osama M | Metal salts of maleimide compounds as conductivity promoters |
| CN101754989B (zh) * | 2007-05-16 | 2012-11-28 | 陶氏环球技术有限责任公司 | 阻燃剂组合物 |
| AU2008286759B2 (en) | 2007-08-15 | 2014-05-08 | Isp Investments Inc. | Polyvinylamide polymers containing polymerizable functionalities |
| US8242224B2 (en) | 2007-08-15 | 2012-08-14 | Isp Investments Inc. | Polyvinylamide polymers containing polymerizable functionalities |
| KR101375445B1 (ko) * | 2007-11-07 | 2014-03-17 | 쇼와 덴코 가부시키가이샤 | 에폭시기 함유 오르가노실록산 화합물, 전사 재료용 경화성 조성물 및 상기 조성물을 사용한 미세 패턴 형성 방법 |
| US8324319B2 (en) * | 2007-11-20 | 2012-12-04 | Sridhar Laxmisha M | Redox-induced cationically polymerizable compositions with low cure temperature |
| WO2009070172A1 (en) * | 2007-11-30 | 2009-06-04 | Henkel Ag & Co. Kgaa | Curable resins containing acetal, ketal, acetal ester, or ketal ester linkages |
| JP7093150B2 (ja) * | 2018-12-06 | 2022-06-29 | 日本化薬株式会社 | 硬化性樹脂組成物及びその硬化物 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU513033A1 (ru) * | 1974-12-09 | 1976-05-05 | Предприятие П/Я В-2304 | -(2",3"-Эпоксипропилоксифенил)-4,5 эпоксигексагидрофталимиды, как мономеры дл получени термостойких полимерных материалов |
| SU702021A1 (ru) * | 1976-12-27 | 1979-12-05 | Предприятие П/Я В-2304 | 3,4-Эпоксигексагидробензил-/4,5эпоксигексагидро- -фталимидо/ бензоат как мономер дл синтеза теплостойких полимеров |
| JPH02132106A (ja) * | 1988-11-11 | 1990-05-21 | Hitachi Ltd | 不飽和イミド系化合物、組成物及びその用途 |
| JPH0641114A (ja) * | 1992-05-25 | 1994-02-15 | Nissan Chem Ind Ltd | 新規メバロノラクトン類とその製法 |
| EP0638547B1 (de) | 1993-08-09 | 2000-08-16 | Ciba SC Holding AG | Neue urethangruppenhaltige (Meth)Acrylate |
| ATE193532T1 (de) * | 1993-09-16 | 2000-06-15 | Ciba Sc Holding Ag | Vinyletherverbindungen mit zusätzlichen von vinylethergruppen verschiedenen funktionellen gruppen und deren verwendung zur formulierung härtbarer zusammensetzungen |
| US5539132A (en) * | 1994-01-24 | 1996-07-23 | Johns Hopkins University | Cerulenin compounds for fatty acid synthesis inhibition |
| JPH0853430A (ja) * | 1994-08-10 | 1996-02-27 | Amuko Enterp Kk | フッ素含有ジシクロペンタジエン誘導体のエポキシ化物 |
| JPH08269293A (ja) * | 1995-03-30 | 1996-10-15 | Toray Dow Corning Silicone Co Ltd | 硬化性剥離剤組成物 |
| US5863970A (en) * | 1995-12-06 | 1999-01-26 | Polyset Company, Inc. | Epoxy resin composition with cycloaliphatic epoxy-functional siloxane |
| DE19608313C2 (de) | 1996-02-22 | 2000-08-31 | Ivoclar Ag Schaan | Polymerisierbare Hybridmonomere, Verfahren zu deren Herstellung und deren Verwendung |
| US6080872A (en) * | 1997-12-16 | 2000-06-27 | Lonza S.P.A. | Cycloaliphatic epoxy compounds |
| US6075155A (en) * | 1998-06-22 | 2000-06-13 | Rensselaer Polytechnic Institute | Radiation-curable cycloaliphatic epoxy compounds, uses thereof, and compositions containing them |
| WO2000010974A2 (en) | 1998-08-20 | 2000-03-02 | Dsm N.V. | Process for the preparation of a maleimide compound, maleimide compound, radiation-curable compositions comprising said compound and coated products |
| US6150479A (en) | 1998-11-23 | 2000-11-21 | Loctite Corporation | Radical-curable adhesive compositions, reaction products of which demonstrate superior resistance to thermal degradation |
| JP4350832B2 (ja) * | 1999-04-19 | 2009-10-21 | Jsr株式会社 | 立体造形用光硬化性樹脂組成物およびこれを硬化してなる造形物 |
| GB9913627D0 (en) * | 1999-06-12 | 1999-08-11 | Ciba Geigy Ag | Process for the preparation of reaction products of cycloaliphatic epoxides with multifunctional hydroxy compounds |
| KR100314931B1 (ko) * | 1999-09-21 | 2001-11-30 | 박호군 | 인발다이용 다이아몬드 단결정의 양면 평행 연마방법 |
| WO2001072898A1 (en) | 2000-03-29 | 2001-10-04 | Georgia Tech Research Corporation | Thermally degradable epoxy underfills for flip-chip applications |
| TWI282811B (en) * | 2000-04-10 | 2007-06-21 | Sumitomo Bakelite Co | Die-attaching paste and semiconductor device |
-
2002
- 2002-07-22 US US10/201,373 patent/US6716992B2/en not_active Expired - Lifetime
-
2003
- 2003-07-18 JP JP2003199169A patent/JP2004149512A/ja active Pending
- 2003-07-18 TW TW092119896A patent/TWI276633B/zh not_active IP Right Cessation
- 2003-07-21 MY MYPI20032729A patent/MY133626A/en unknown
- 2003-07-22 SG SG200304356A patent/SG109521A1/en unknown
- 2003-07-22 DE DE60329604T patent/DE60329604D1/de not_active Expired - Lifetime
- 2003-07-22 CN CNB031580211A patent/CN100430400C/zh not_active Expired - Fee Related
- 2003-07-22 KR KR1020030050139A patent/KR100973317B1/ko not_active Expired - Fee Related
- 2003-07-22 EP EP03016521A patent/EP1384737B1/en not_active Expired - Lifetime
- 2003-07-22 EP EP04029057A patent/EP1531166B1/en not_active Expired - Lifetime
- 2003-07-22 DE DE60324633T patent/DE60324633D1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR100973317B1 (ko) | 2010-07-30 |
| EP1531166B1 (en) | 2009-10-07 |
| TW200420551A (en) | 2004-10-16 |
| DE60324633D1 (de) | 2008-12-24 |
| EP1531166A2 (en) | 2005-05-18 |
| EP1384737A2 (en) | 2004-01-28 |
| MY133626A (en) | 2007-11-30 |
| TWI276633B (en) | 2007-03-21 |
| JP2004149512A (ja) | 2004-05-27 |
| US20040014890A1 (en) | 2004-01-22 |
| KR20040010310A (ko) | 2004-01-31 |
| DE60329604D1 (de) | 2009-11-19 |
| CN100430400C (zh) | 2008-11-05 |
| EP1384737A3 (en) | 2004-04-14 |
| EP1384737B1 (en) | 2008-11-12 |
| US6716992B2 (en) | 2004-04-06 |
| SG109521A1 (en) | 2005-03-30 |
| EP1531166A3 (en) | 2005-08-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1190419C (zh) | 带有电子给体和电子受体官能团的化合物 | |
| CN1094141C (zh) | 官能化聚硅氧烷及其制备方法与用途 | |
| CN1040535C (zh) | 异构环氧烯烃为2.5-二氢呋喃和其有用的催化剂组合物 | |
| CN1236000C (zh) | 可固化的电子给体化合物 | |
| CN1027171C (zh) | 含有机硅烷化合物的催化剂 | |
| CN1488631A (zh) | 含有苯乙烯、肉桂基或马来酰亚胺官能团的环脂族环氧化合物 | |
| CN1504494A (zh) | 具有官能团的笼型倍半硅氧烷类树脂及其制造方法 | |
| CN1040440C (zh) | 去氢环黄皮酰胺衍生物的制备方法 | |
| JP2010120884A (ja) | 有機ケイ素化合物 | |
| JP2017155009A (ja) | シランカップリング剤、カップリング剤組成物、有機無機複合部材 | |
| CN1253969A (zh) | 由烯丙基化酰胺化合物制备的电路元件 | |
| KR100973777B1 (ko) | 에폭시 작용기를 함유하는 비닐 실란 화합물 | |
| CN1863772A (zh) | 制备氮杂双环[3.1.0]己烷化合物的方法 | |
| CN1304403C (zh) | 含有c2对称骨架单膦配体、合成方法及应用 | |
| TWI304414B (en) | Epoxy compounds containing styrenic or cinnamyl functionality | |
| CN1252052C (zh) | 用立体化学受控制造异构体纯的高度取代的氮杂环化合物的方法 | |
| JP3915883B2 (ja) | 有機ケイ素化合物 | |
| CN1160714A (zh) | 杂二环醇对映体的立体选择性制备方法 | |
| CN1185235C (zh) | 双(氟代芳基)硼衍生物的制备方法 | |
| JPH0649430A (ja) | 低温加硫カルボランシロキサン接着剤及びその製造方法 | |
| JP2007522672A (ja) | ハイブリッドオキサゾリン化合物で基板に取り付けられた半導体ダイ | |
| CN1902210A (zh) | 制备有机烷氧基二烷基硅烷的方法 | |
| CN1918100A (zh) | 一种制备旋光性环己烯酮的方法 | |
| JP2718601B2 (ja) | 鎖状ポリオルガノシランの製造方法 | |
| TW200424211A (en) | Compounds containing vinyl silane and electron donor or acceptor functionality |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1063323 Country of ref document: HK |
|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: WD Ref document number: 1063323 Country of ref document: HK |
|
| ASS | Succession or assignment of patent right |
Owner name: HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN Free format text: FORMER OWNER: NATIONAL STARCH + CHEMICAL INVESTMENT HOLDING CORP Effective date: 20110427 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| C56 | Change in the name or address of the patentee |
Owner name: HENKEL AG + CO. KGAA Free format text: FORMER NAME: HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: DELAWARE, THE USA TO: DUSSELDORF, GERMANY |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Dusseldorf Patentee after: HENKEL AG & Co.KGaA Address before: Dusseldorf Patentee before: HENKEL AG & Co.KGaA |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20110427 Address after: Dusseldorf Patentee after: HENKEL AG & Co.KGaA Address before: Delaware Patentee before: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING Corp. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081105 Termination date: 20200722 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |



















































