DE69920459D1 - Wärme-management-vorrichtung und verfahren zu seiner herstellung - Google Patents

Wärme-management-vorrichtung und verfahren zu seiner herstellung

Info

Publication number
DE69920459D1
DE69920459D1 DE69920459T DE69920459T DE69920459D1 DE 69920459 D1 DE69920459 D1 DE 69920459D1 DE 69920459 T DE69920459 T DE 69920459T DE 69920459 T DE69920459 T DE 69920459T DE 69920459 D1 DE69920459 D1 DE 69920459D1
Authority
DE
Germany
Prior art keywords
management device
carbon
encapsulating material
production
thermal management
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69920459T
Other languages
English (en)
Other versions
DE69920459T2 (de
Inventor
Angelo Gandi
Oliveira Rui De
Antony Arthur Carter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Queen Mary University of London
Original Assignee
Queen Mary and Westfiled College University of London
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Queen Mary and Westfiled College University of London filed Critical Queen Mary and Westfiled College University of London
Application granted granted Critical
Publication of DE69920459D1 publication Critical patent/DE69920459D1/de
Publication of DE69920459T2 publication Critical patent/DE69920459T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12347—Plural layers discontinuously bonded [e.g., spot-weld, mechanical fastener, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer

Landscapes

  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)
  • Control Of Heat Treatment Processes (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Control Of Temperature (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
  • Making Paper Articles (AREA)
DE69920459T 1998-07-08 1999-07-08 Wärme-management-vorrichtung und verfahren zu seiner herstellung Expired - Fee Related DE69920459T2 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
GB9814835 1998-07-08
GBGB9814835.6A GB9814835D0 (en) 1998-07-08 1998-07-08 A thermal management board
GB9825376 1998-11-19
GBGB9825376.8A GB9825376D0 (en) 1998-07-08 1998-11-19 A thermal management board
GB9900924 1999-01-15
GB9900924 1999-01-15
PCT/GB1999/002180 WO2000003567A1 (en) 1998-07-08 1999-07-08 A thermal management device and method of making such a device

Publications (2)

Publication Number Publication Date
DE69920459D1 true DE69920459D1 (de) 2004-10-28
DE69920459T2 DE69920459T2 (de) 2005-10-13

Family

ID=27269389

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69920459T Expired - Fee Related DE69920459T2 (de) 1998-07-08 1999-07-08 Wärme-management-vorrichtung und verfahren zu seiner herstellung

Country Status (17)

Country Link
US (2) US6514616B1 (de)
EP (2) EP1095545B1 (de)
JP (1) JP2002520863A (de)
KR (1) KR100707155B1 (de)
CN (1) CN1184866C (de)
AT (1) ATE277497T1 (de)
AU (1) AU4790799A (de)
CA (1) CA2336889C (de)
DE (1) DE69920459T2 (de)
DK (1) DK1095545T3 (de)
ES (1) ES2229727T3 (de)
GB (2) GB9814835D0 (de)
HK (1) HK1040473B (de)
PT (1) PT1095545E (de)
RU (1) RU2214698C2 (de)
SI (1) SI1095545T1 (de)
WO (1) WO2000003567A1 (de)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9814835D0 (en) * 1998-07-08 1998-09-09 Europ Org For Nuclear Research A thermal management board
EP1288770B1 (de) * 2000-06-06 2009-03-04 Panasonic Corporation Tragbares informationsgerät
US20020021997A1 (en) * 2000-06-23 2002-02-21 Akira Taomoto Graphite sheet coated with insulating material and coating method thereof
US8382004B2 (en) * 2001-04-04 2013-02-26 Graftech International Holdings Inc. Flexible graphite flooring heat spreader
KR100468122B1 (ko) * 2002-07-08 2005-01-26 삼성전자주식회사 전자렌지
WO2004097936A1 (en) * 2003-05-01 2004-11-11 Queen Mary & Westfield College A cellular thermal management device and method of making such a device
US20070090519A1 (en) * 2003-05-01 2007-04-26 Carter Antony A Encased thermal management device and method of making such a device
US7329024B2 (en) * 2003-09-22 2008-02-12 Permlight Products, Inc. Lighting apparatus
US7102172B2 (en) * 2003-10-09 2006-09-05 Permlight Products, Inc. LED luminaire
GB2409341A (en) * 2003-12-16 2005-06-22 Otter Controls Ltd Improvements relating to thermal control units
KR100792056B1 (ko) * 2004-01-08 2008-01-04 히다치 가세고교 가부시끼가이샤 폴리우레탄이미드수지, 접착제 조성물, 및 회로접속용접착제 조성물
US7918591B2 (en) 2005-05-13 2011-04-05 Permlight Products, Inc. LED-based luminaire
US7797808B2 (en) * 2005-10-11 2010-09-21 General Electric Company Thermal management system and associated method
US20080019097A1 (en) * 2005-10-11 2008-01-24 General Electric Company Thermal transport structure
US7297399B2 (en) * 2005-10-11 2007-11-20 General Electric Company Thermal transport structure and associated method
GB2432830A (en) * 2005-12-02 2007-06-06 Morganite Elect Carbon Formation of thermally anisotropic carbon material
US20070251456A1 (en) * 2006-04-27 2007-11-01 Applied Materials, Inc., A Delaware Corporation Composite heater and chill plate
US8148647B2 (en) * 2006-08-23 2012-04-03 Mitsubishi Electric Corporation Printed circuit board and method of manufacturing the same
GB0700917D0 (en) * 2007-01-17 2007-02-28 Queen Mary & Westfield College Structures with improved properties
US7808787B2 (en) * 2007-09-07 2010-10-05 Specialty Minerals (Michigan) Inc. Heat spreader and method of making the same
US20090169410A1 (en) * 2007-12-31 2009-07-02 Slaton David S Method of forming a thermo pyrolytic graphite-embedded heatsink
US7742307B2 (en) * 2008-01-17 2010-06-22 Raytheon Company High performance power device
US8570747B2 (en) * 2008-12-04 2013-10-29 Hewlett-Packard Development Company, L.P. Carbon laminated enclosure
US7903418B2 (en) 2009-04-21 2011-03-08 Hewlett-Packard Development Company, L.P. Thermal mitigation device and method
MD249Z (ro) * 2009-04-29 2011-02-28 Институт Электронной Инженерии И Промышленных Технологий Академии Наук Молдовы Procedeu de fabricare a răcitorului termoelectric pentru substratul circuitului integrat
US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
DE102009035850A1 (de) * 2009-07-31 2011-02-03 Vossloh-Schwabe Optoelectronic Gmbh & Co. Kg Leiterplattenordnung mit Keramikplatte und Grafitschicht
GB0917098D0 (en) 2009-09-29 2009-11-11 Morganite Elect Carbon Carbon materials
JP5035356B2 (ja) * 2010-01-26 2012-09-26 株式会社デンソー 樹脂封止型電子装置およびその製造方法
RU2474004C1 (ru) * 2011-08-16 2013-01-27 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" Способ изготовления многоуровневых тонкопленочных микросхем
JP5619830B2 (ja) * 2011-08-24 2014-11-05 パナソニック株式会社 樹脂−反磁性物質複合構造体、その製造方法、およびそれを用いた半導体装置
US10209016B2 (en) * 2013-03-22 2019-02-19 Toyota Motor Engineering & Manufacturing North America, Inc. Thermal energy guiding systems including anisotropic thermal guiding coatings and methods for fabricating the same
US9312580B2 (en) 2013-07-30 2016-04-12 Johnson Controls Technology Company Battery module with phase change material
CN104812204B (zh) * 2014-01-26 2017-08-25 斯迪克新型材料（江苏）有限公司 用于石墨散热片的制造工艺
US20180229825A1 (en) 2014-05-01 2018-08-16 Blue Robotics Inc. Submersible electric thruster
CN108701880B (zh) * 2016-03-14 2022-04-08 松下知识产权经营株式会社 复合片以及使用该复合片的电池组
WO2018002230A1 (en) 2016-06-29 2018-01-04 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Cooling component carrier material by carbon structure within dielectric shell
CN207939941U (zh) * 2018-03-27 2018-10-02 京东方科技集团股份有限公司 用于显示面板的散热装置和显示装置
CN110147127A (zh) * 2019-05-24 2019-08-20 珠海格力智能装备有限公司 控制系统及方法
CA3169302C (fr) * 2020-03-02 2023-02-28 Didier Charvet Instrument optique spatial comprenant une garde thermique amelioree
US11497137B2 (en) * 2020-12-18 2022-11-08 Hewlett Packard Enterprise Development Lp Method and apparatus for extended serial temperature control in a compute device
CN122056133A (zh) * 2023-10-12 2026-05-15 日本碍子株式会社 半导体制造装置用部件

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5550646A (en) * 1978-10-06 1980-04-12 Hitachi Ltd Integrated circuit device
US4318954A (en) 1981-02-09 1982-03-09 Boeing Aerospace Company Printed wiring board substrates for ceramic chip carriers
FR2546878B1 (fr) * 1983-05-31 1988-04-08 Slonina Jean Pierre Plaque support d'un substrat ceramique, leger, a forte conductivite thermique et coefficient de dilatation adapte pour toutes applications dans le domaine electronique
US4591659A (en) * 1983-12-22 1986-05-27 Trw Inc. Multilayer printed circuit board structure
US4916016A (en) 1986-01-23 1990-04-10 Ici Americas Inc. Metal or plastic-clad polyvinyl resin laminates
US4849858A (en) 1986-10-20 1989-07-18 Westinghouse Electric Corp. Composite heat transfer means
US4791248A (en) 1987-01-22 1988-12-13 The Boeing Company Printed wire circuit board and its method of manufacture
US5296310A (en) 1992-02-14 1994-03-22 Materials Science Corporation High conductivity hydrid material for thermal management
CH687490A5 (de) * 1992-03-25 1996-12-13 Dyconex Ag Leiterplattenverstaerkung.
US5309321A (en) 1992-09-22 1994-05-03 Microelectronics And Computer Technology Corporation Thermally conductive screen mesh for encapsulated integrated circuit packages
CA2124158C (en) 1993-06-14 2005-09-13 Daniel H. Hecht High modulus carbon and graphite articles and method for their preparation
JP3305720B2 (ja) * 1993-07-06 2002-07-24 株式会社東芝 放熱シート
WO1996037915A1 (en) 1995-05-26 1996-11-28 Sheldahl, Inc. Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sink
WO1998040431A1 (en) * 1997-03-11 1998-09-17 Amoco Corporation Thermally conductive film and method for the preparation thereof
GB9814835D0 (en) * 1998-07-08 1998-09-09 Europ Org For Nuclear Research A thermal management board
US6075701A (en) 1999-05-14 2000-06-13 Hughes Electronics Corporation Electronic structure having an embedded pyrolytic graphite heat sink material

Also Published As

Publication number Publication date
WO2000003567A1 (en) 2000-01-20
CN1184866C (zh) 2005-01-12
HK1040473B (zh) 2005-05-27
US6514616B1 (en) 2003-02-04
EP1095545B1 (de) 2004-09-22
SI1095545T1 (en) 2005-02-28
HK1040473A1 (en) 2002-06-07
ES2229727T3 (es) 2005-04-16
CA2336889A1 (en) 2000-01-20
US20030099836A1 (en) 2003-05-29
PT1095545E (pt) 2005-01-31
GB9825376D0 (en) 1999-01-13
RU2214698C2 (ru) 2003-10-20
DE69920459T2 (de) 2005-10-13
CN1313023A (zh) 2001-09-12
DK1095545T3 (da) 2005-01-24
JP2002520863A (ja) 2002-07-09
EP1492396A3 (de) 2005-07-27
GB9814835D0 (en) 1998-09-09
EP1492396A2 (de) 2004-12-29
ATE277497T1 (de) 2004-10-15
EP1095545A1 (de) 2001-05-02
AU4790799A (en) 2000-02-01
US6689471B2 (en) 2004-02-10
KR100707155B1 (ko) 2007-04-16
CA2336889C (en) 2008-09-30
KR20010079508A (ko) 2001-08-22

Similar Documents

Publication Publication Date Title
ATE277497T1 (de) Wärme-management-vorrichtung und verfahren zu seiner herstellung
EP1193280A4 (de) Polyimidharz, harzzusammensetzung mit verbesserter feuchtigkeitsbeständigkeit, leimlösung, mehrlagiger klebefilm und verfahren zu deren herstellung
DE69725159D1 (de) Modifiziertes, thermoplastisches norbornen polymer und verfahren zu seiner herstellung
DE69940561D1 (de) Harzzusammensetzung, polymer und verfahren zu seiner herstellung
DE60228982D1 (de) Verfahren zur herstellung einer kunststoffscheibe mit elektrischer leitungsstruktur und kunststoffscheibe mit eingebetteten drähten
CA2350048A1 (en) Moulding materials
ATE303606T1 (de) Microreliefelement und seine herstellung
DE69818848D1 (de) Thermoplastische polyurethanzusätze für verbesserte polymermatrix-komposite und verfahren zur herstellung und verwendung derselben
ATE237021T1 (de) Verfahren und verseilvorrichtung zur herstellung eines seiles oder seilelements
DE69528725D1 (de) Magnetische Schaltung für Lautsprecher und Verfahren zu ihrer Herstellung
DE69525420D1 (de) In Harz eingegossenes Halbleiterbauelement mit Kühlteil und Verfahren zu seiner Herstellung
SE0001065D0 (sv) Fiberförstärkt polymermaterial
DE19781671T1 (de) Mit thermoplastischem Harz beschichtetes Aluminiumlegierungsblech und Verfahren und Apparatur zur Herstellung desselben
DE69108055D1 (de) Halbzeug und thermoplastisches verbundmaterial aus flüssigkristallinen polymeren und verfahren zu seiner herstellung.
DE69615159D1 (de) Verfahren zur herstellung von epoxidiertem organischem polymer, thermoplastische harzzusammensetzung, primerzusammensetzung, nicht-vulkanisierte kautschukzusammensetzung, kautschukformmassen und verfahren zu deren herstellung
DE69827842D1 (de) Flüssigkeitsbehälter aus dünnem schichtstoff aus kunstharz und verfahren zur herstellung desselben
DE59705720D1 (de) Verfahren und Kunststoff-Spritzgiesswerkzeug zur Herstellung eines Verbundkörpers
DE69705744D1 (de) Artikel mit superlegierungsubstrat und einer anreicherungsschicht darauf, sowie verfahren zu dessen herstellung
DE69025225D1 (de) Faserverstärktes Verbundmaterial aus Polymerharz und Verfahren zu seiner Herstellung
DE60316429D1 (de) Druckgefäss aus kunststoff für ein fluid und verfahren zur herstellung solch eines gefässes
ATE245848T1 (de) Verfahren zur herstellung von glimmer-hältigen isolierbändern sowie deren verwendung
DK1057851T3 (da) Kompositmateriale af polyurethan og mindst ét termoplastisk formstof, fremgangsmåde til fremstilling af dette og dets anvendelse i automobiler
DE59408134D1 (de) Schichtkörper, Verfahren zu seiner Herstellung und dessen Verwendung
DE69920393D1 (de) Polyamidfilmlaminat, verfahren zu seiner herstellung, sowie magnetisches aufzeichnungsmaterial
DE3668018D1 (de) Schichtstoff aus thermoplastischem harz und verfahren zu seiner herstellung.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee