DK1095545T3 - Varmehåndteringsindretning og fremgangsmåde til fremstilling af en sådan indretning - Google Patents

Varmehåndteringsindretning og fremgangsmåde til fremstilling af en sådan indretning

Info

Publication number
DK1095545T3
DK1095545T3 DK99931369T DK99931369T DK1095545T3 DK 1095545 T3 DK1095545 T3 DK 1095545T3 DK 99931369 T DK99931369 T DK 99931369T DK 99931369 T DK99931369 T DK 99931369T DK 1095545 T3 DK1095545 T3 DK 1095545T3
Authority
DK
Denmark
Prior art keywords
management device
carbon
encapsulating material
making
thermal management
Prior art date
Application number
DK99931369T
Other languages
English (en)
Inventor
Antony Arthur Carter
Angelo Gandi
Oliveira Rui De
Original Assignee
Queen Mary & Westfield College
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Queen Mary & Westfield College filed Critical Queen Mary & Westfield College
Application granted granted Critical
Publication of DK1095545T3 publication Critical patent/DK1095545T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12347—Plural layers discontinuously bonded [e.g., spot-weld, mechanical fastener, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)
  • Control Of Heat Treatment Processes (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Control Of Temperature (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
  • Making Paper Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
DK99931369T 1998-07-08 1999-07-08 Varmehåndteringsindretning og fremgangsmåde til fremstilling af en sådan indretning DK1095545T3 (da)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GBGB9814835.6A GB9814835D0 (en) 1998-07-08 1998-07-08 A thermal management board
GBGB9825376.8A GB9825376D0 (en) 1998-07-08 1998-11-19 A thermal management board
GB9900924 1999-01-15
PCT/GB1999/002180 WO2000003567A1 (en) 1998-07-08 1999-07-08 A thermal management device and method of making such a device

Publications (1)

Publication Number Publication Date
DK1095545T3 true DK1095545T3 (da) 2005-01-24

Family

ID=27269389

Family Applications (1)

Application Number Title Priority Date Filing Date
DK99931369T DK1095545T3 (da) 1998-07-08 1999-07-08 Varmehåndteringsindretning og fremgangsmåde til fremstilling af en sådan indretning

Country Status (17)

Country Link
US (2) US6514616B1 (da)
EP (2) EP1492396A3 (da)
JP (1) JP2002520863A (da)
KR (1) KR100707155B1 (da)
CN (1) CN1184866C (da)
AT (1) ATE277497T1 (da)
AU (1) AU4790799A (da)
CA (1) CA2336889C (da)
DE (1) DE69920459T2 (da)
DK (1) DK1095545T3 (da)
ES (1) ES2229727T3 (da)
GB (2) GB9814835D0 (da)
HK (1) HK1040473B (da)
PT (1) PT1095545E (da)
RU (1) RU2214698C2 (da)
SI (1) SI1095545T1 (da)
WO (1) WO2000003567A1 (da)

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US20020021997A1 (en) * 2000-06-23 2002-02-21 Akira Taomoto Graphite sheet coated with insulating material and coating method thereof
US8382004B2 (en) * 2001-04-04 2013-02-26 Graftech International Holdings Inc. Flexible graphite flooring heat spreader
KR100468122B1 (ko) * 2002-07-08 2005-01-26 삼성전자주식회사 전자렌지
WO2004097936A1 (en) * 2003-05-01 2004-11-11 Queen Mary & Westfield College A cellular thermal management device and method of making such a device
KR20060010763A (ko) * 2003-05-01 2006-02-02 퀸 메리 앤드 웨스트필드 컬리지 케이스화된 열 관리 장치 및 그 제조 방법
US7329024B2 (en) * 2003-09-22 2008-02-12 Permlight Products, Inc. Lighting apparatus
US7102172B2 (en) * 2003-10-09 2006-09-05 Permlight Products, Inc. LED luminaire
GB2409341A (en) * 2003-12-16 2005-06-22 Otter Controls Ltd Improvements relating to thermal control units
KR100792056B1 (ko) * 2004-01-08 2008-01-04 히다치 가세고교 가부시끼가이샤 폴리우레탄이미드수지, 접착제 조성물, 및 회로접속용접착제 조성물
US7918591B2 (en) 2005-05-13 2011-04-05 Permlight Products, Inc. LED-based luminaire
US7297399B2 (en) * 2005-10-11 2007-11-20 General Electric Company Thermal transport structure and associated method
US7797808B2 (en) * 2005-10-11 2010-09-21 General Electric Company Thermal management system and associated method
US20080019097A1 (en) * 2005-10-11 2008-01-24 General Electric Company Thermal transport structure
GB2432830A (en) * 2005-12-02 2007-06-06 Morganite Elect Carbon Formation of thermally anisotropic carbon material
US20070251456A1 (en) * 2006-04-27 2007-11-01 Applied Materials, Inc., A Delaware Corporation Composite heater and chill plate
US8148647B2 (en) * 2006-08-23 2012-04-03 Mitsubishi Electric Corporation Printed circuit board and method of manufacturing the same
GB0700917D0 (en) * 2007-01-17 2007-02-28 Queen Mary & Westfield College Structures with improved properties
US7808787B2 (en) * 2007-09-07 2010-10-05 Specialty Minerals (Michigan) Inc. Heat spreader and method of making the same
US20090169410A1 (en) * 2007-12-31 2009-07-02 Slaton David S Method of forming a thermo pyrolytic graphite-embedded heatsink
US7742307B2 (en) * 2008-01-17 2010-06-22 Raytheon Company High performance power device
US8570747B2 (en) * 2008-12-04 2013-10-29 Hewlett-Packard Development Company, L.P. Carbon laminated enclosure
US7903418B2 (en) 2009-04-21 2011-03-08 Hewlett-Packard Development Company, L.P. Thermal mitigation device and method
MD249Z (ro) * 2009-04-29 2011-02-28 Институт Электронной Инженерии И Промышленных Технологий Академии Наук Молдовы Procedeu de fabricare a răcitorului termoelectric pentru substratul circuitului integrat
US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
DE102009035850A1 (de) * 2009-07-31 2011-02-03 Vossloh-Schwabe Optoelectronic Gmbh & Co. Kg Leiterplattenordnung mit Keramikplatte und Grafitschicht
GB0917098D0 (en) 2009-09-29 2009-11-11 Morganite Elect Carbon Carbon materials
JP5035356B2 (ja) * 2010-01-26 2012-09-26 株式会社デンソー 樹脂封止型電子装置およびその製造方法
RU2474004C1 (ru) * 2011-08-16 2013-01-27 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" Способ изготовления многоуровневых тонкопленочных микросхем
JP5619830B2 (ja) * 2011-08-24 2014-11-05 パナソニック株式会社 樹脂−反磁性物質複合構造体、その製造方法、およびそれを用いた半導体装置
US10209016B2 (en) * 2013-03-22 2019-02-19 Toyota Motor Engineering & Manufacturing North America, Inc. Thermal energy guiding systems including anisotropic thermal guiding coatings and methods for fabricating the same
US9312580B2 (en) 2013-07-30 2016-04-12 Johnson Controls Technology Company Battery module with phase change material
CN107043108B (zh) * 2014-01-26 2019-04-23 斯迪克新型材料（江苏）有限公司 用于智能手机的散热片制造工艺
US20180229825A1 (en) 2014-05-01 2018-08-16 Blue Robotics Inc. Submersible electric thruster
CN108701880B (zh) * 2016-03-14 2022-04-08 松下知识产权经营株式会社 复合片以及使用该复合片的电池组
CN109417855A (zh) * 2016-06-29 2019-03-01 奥特斯奥地利科技与系统技术有限公司 通过介电壳体内的碳结构冷却部件承载件材料
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CN110147127A (zh) * 2019-05-24 2019-08-20 珠海格力智能装备有限公司 控制系统及方法
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Also Published As

Publication number Publication date
PT1095545E (pt) 2005-01-31
CN1184866C (zh) 2005-01-12
EP1095545B1 (en) 2004-09-22
HK1040473A1 (en) 2002-06-07
CA2336889C (en) 2008-09-30
KR20010079508A (ko) 2001-08-22
SI1095545T1 (en) 2005-02-28
EP1492396A2 (en) 2004-12-29
JP2002520863A (ja) 2002-07-09
ATE277497T1 (de) 2004-10-15
HK1040473B (zh) 2005-05-27
CN1313023A (zh) 2001-09-12
RU2214698C2 (ru) 2003-10-20
DE69920459T2 (de) 2005-10-13
DE69920459D1 (de) 2004-10-28
US20030099836A1 (en) 2003-05-29
US6689471B2 (en) 2004-02-10
EP1492396A3 (en) 2005-07-27
GB9814835D0 (en) 1998-09-09
CA2336889A1 (en) 2000-01-20
ES2229727T3 (es) 2005-04-16
AU4790799A (en) 2000-02-01
EP1095545A1 (en) 2001-05-02
US6514616B1 (en) 2003-02-04
WO2000003567A1 (en) 2000-01-20
GB9825376D0 (en) 1999-01-13
KR100707155B1 (ko) 2007-04-16

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