DK0464144T3 - Flerlagsfilm og laminat til anvendelse ved fremstilling af trykte kredsløbskort - Google Patents

Flerlagsfilm og laminat til anvendelse ved fremstilling af trykte kredsløbskort

Info

Publication number
DK0464144T3
DK0464144T3 DK90905889.3T DK90905889T DK0464144T3 DK 0464144 T3 DK0464144 T3 DK 0464144T3 DK 90905889 T DK90905889 T DK 90905889T DK 0464144 T3 DK0464144 T3 DK 0464144T3
Authority
DK
Denmark
Prior art keywords
pounds
width
printed circuit
multilayer film
metal foil
Prior art date
Application number
DK90905889.3T
Other languages
Danish (da)
English (en)
Inventor
Stephen M Imfeld
Randall S Shipley
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Application granted granted Critical
Publication of DK0464144T3 publication Critical patent/DK0464144T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31507—Of polycarbonate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31725—Of polyamide
    • Y10T428/3175—Next to addition polymer from unsaturated monomer[s]
    • Y10T428/31757—Polymer of monoethylenically unsaturated hydrocarbon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]
    • Y10T428/31797—Next to addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31909—Next to second addition polymer from unsaturated monomers
    • Y10T428/31913—Monoolefin polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Adhesive Tapes (AREA)
DK90905889.3T 1989-03-22 1990-03-22 Flerlagsfilm og laminat til anvendelse ved fremstilling af trykte kredsløbskort DK0464144T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/326,931 US5057372A (en) 1989-03-22 1989-03-22 Multilayer film and laminate for use in producing printed circuit boards

Publications (1)

Publication Number Publication Date
DK0464144T3 true DK0464144T3 (da) 1998-03-16

Family

ID=23274380

Family Applications (1)

Application Number Title Priority Date Filing Date
DK90905889.3T DK0464144T3 (da) 1989-03-22 1990-03-22 Flerlagsfilm og laminat til anvendelse ved fremstilling af trykte kredsløbskort

Country Status (10)

Country Link
US (1) US5057372A (de)
EP (1) EP0464144B1 (de)
JP (1) JP3142554B2 (de)
KR (1) KR0168034B1 (de)
AT (1) ATE156420T1 (de)
CA (1) CA2012670C (de)
DE (1) DE69031216T2 (de)
DK (1) DK0464144T3 (de)
ES (1) ES2104603T3 (de)
WO (1) WO1990011182A1 (de)

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US5153050A (en) * 1991-08-27 1992-10-06 Johnston James A Component of printed circuit boards
US5822856A (en) * 1996-06-28 1998-10-20 International Business Machines Corporation Manufacturing circuit board assemblies having filled vias
US5858550A (en) * 1997-02-06 1999-01-12 Alliedsignal Inc. High temperature release films
US6127051A (en) * 1998-04-10 2000-10-03 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6355360B1 (en) 1998-04-10 2002-03-12 R.E. Service Company, Inc. Separator sheet laminate for use in the manufacture of printed circuit boards
US6129990A (en) * 1998-04-10 2000-10-10 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6129998A (en) * 1998-04-10 2000-10-10 R.E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6183880B1 (en) * 1998-08-07 2001-02-06 Mitsui Mining & Smelting Co., Ltd. Composite foil of aluminum and copper
US6770380B2 (en) 1998-08-11 2004-08-03 Nikko Materials Usa, Inc. Resin/copper/metal laminate and method of producing same
WO2000018555A1 (en) 1998-10-01 2000-04-06 Airtech International, Inc. Method of molding or curing a resin material at high temperatures using a multilayer release film
US6372364B1 (en) 1999-08-18 2002-04-16 Microcoating Technologies, Inc. Nanostructure coatings
JP4300687B2 (ja) * 1999-10-28 2009-07-22 味の素株式会社 接着フィルムを用いた多層プリント配線板の製造法
US6783860B1 (en) 2001-05-11 2004-08-31 R. E. Service Company, Inc. Laminated entry and exit material for drilling printed circuit boards
US6921451B2 (en) * 2002-06-28 2005-07-26 Metallized Products, Inc. Method of and apparatus for protecting thin copper foil and other shiny substrates during handling and rigorous processing, as pcb manufacture and the like, by electric-charge adherence thereto of thin release-layered plastic films and the like, and improved products produced thereby
US6638607B1 (en) * 2002-10-30 2003-10-28 International Business Machines Corporation Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
AU2003303474A1 (en) * 2002-12-24 2004-07-22 Sentrex Company Multilayer product to make printed circuit boards
US20050112344A1 (en) * 2003-08-20 2005-05-26 Redfern Sean M. Apparatus and method for use in printed circuit board drilling applications
BRPI0415579A (pt) * 2003-10-17 2007-01-02 Du Pont estrutura em multicamadas, embalagem e processo
JP4436803B2 (ja) * 2003-12-26 2010-03-24 積水化学工業株式会社 離型フィルム
US8129009B2 (en) * 2004-04-13 2012-03-06 E. I. Du Pont De Nemours And Company Composition comprising ethylene copolymer
US20060222796A1 (en) * 2005-04-04 2006-10-05 Morris Barry A Structure comprising metallized film and ethylene copolymer
WO2009045932A1 (en) 2007-09-28 2009-04-09 Tri-Star Laminates, Inc. Improved systems and methods for drilling holes in printed circuit boards
CN101457128A (zh) * 2007-12-14 2009-06-17 3M创新有限公司 复合高温胶带及其制造方法
DE102009054435A1 (de) 2009-11-25 2011-05-26 Kechter, Andreas, Dipl.-Ing. Heizbarer Gassensor und Verfahren zu dessen Herstellung
KR101234974B1 (ko) * 2011-03-07 2013-02-20 (주)인터플렉스 연성인쇄회로기판 커버레이 적층용 이형필름
US9876160B2 (en) 2012-03-21 2018-01-23 Parker-Hannifin Corporation Roll-to-roll manufacturing processes for producing self-healing electroactive polymer devices
US9786834B2 (en) 2012-04-12 2017-10-10 Parker-Hannifin Corporation EAP transducers with improved performance
TW201429147A (zh) 2012-08-16 2014-07-16 拜耳智慧財產有限公司 用於輥軋介電彈性轉換器之電性互連終端
TW201436311A (zh) * 2012-10-16 2014-09-16 拜耳智慧財產有限公司 金屬化介電膜之方法
US9889628B2 (en) 2013-11-18 2018-02-13 Hyundai Motor Company Low specific gravity and high stiffness sandwich type steel sheet and method for manufacturing the same
KR102055523B1 (ko) * 2019-05-23 2019-12-12 임용범 플라스틱 소재 열성형공정용 보호테이프, 이 보호테이프의 제조방법 및, 이 보호테이프을 이용한 플라스틱 소재의 열성형방법

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Also Published As

Publication number Publication date
EP0464144A1 (de) 1992-01-08
ATE156420T1 (de) 1997-08-15
ES2104603T3 (es) 1997-10-16
KR920700106A (ko) 1992-02-19
US5057372A (en) 1991-10-15
CA2012670C (en) 1999-04-27
DE69031216T2 (de) 1998-02-05
KR0168034B1 (ko) 1999-01-15
CA2012670A1 (en) 1990-09-22
JP3142554B2 (ja) 2001-03-07
EP0464144A4 (en) 1992-04-01
DE69031216D1 (de) 1997-09-11
WO1990011182A1 (en) 1990-10-04
EP0464144B1 (de) 1997-08-06
JPH04506584A (ja) 1992-11-12

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