DK0770006T3 - Skabelon til påføring og dosering af punktformedelag i forskellige tykkelser af et viskost produkt - Google Patents

Skabelon til påføring og dosering af punktformedelag i forskellige tykkelser af et viskost produkt

Info

Publication number
DK0770006T3
DK0770006T3 DK95925010T DK95925010T DK0770006T3 DK 0770006 T3 DK0770006 T3 DK 0770006T3 DK 95925010 T DK95925010 T DK 95925010T DK 95925010 T DK95925010 T DK 95925010T DK 0770006 T3 DK0770006 T3 DK 0770006T3
Authority
DK
Denmark
Prior art keywords
polyester
viscous product
template
dosage
application
Prior art date
Application number
DK95925010T
Other languages
Danish (da)
English (en)
Inventor
Francis Bourrieres
Original Assignee
Francis Bourrieres
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Francis Bourrieres filed Critical Francis Bourrieres
Application granted granted Critical
Publication of DK0770006T3 publication Critical patent/DK0770006T3/da

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41NPRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00Printing plates or foils; Materials therefor
    • B41N1/12Printing plates or foils; Materials therefor non-metallic other than stone, e.g. printing plates or foils comprising inorganic materials in an organic matrix
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41NPRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00Printing plates or foils; Materials therefor
    • B41N1/24Stencils; Stencil materials; Carriers therefor
    • B41N1/243Stencils; Stencil materials; Carriers therefor characterised by the ink pervious sheet, e.g. yoshino paper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41CPROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00Forme preparation
    • B41C1/14Forme preparation for stencil-printing or silk-screen printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41CPROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00Forme preparation
    • B41C1/14Forme preparation for stencil-printing or silk-screen printing
    • B41C1/141Forme preparation for stencil-printing or silk-screen printing by cutting or perforation with mechanical means; Electrical spark cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • B41F15/34Screens, Frames; Holders therefor
    • B41F15/36Screens, Frames; Holders therefor flat
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225Screens or stencils; Holders therefor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/26Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/26Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31786Of polyester [e.g., alkyd, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Printing Methods (AREA)
  • Medicinal Preparation (AREA)
  • Screen Printers (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Laminated Bodies (AREA)
  • Coloring (AREA)
  • Treatment Of Fiber Materials (AREA)
DK95925010T 1994-07-07 1995-07-05 Skabelon til påføring og dosering af punktformedelag i forskellige tykkelser af et viskost produkt DK0770006T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9408518A FR2722138B1 (fr) 1994-07-07 1994-07-07 Pochoir de serigraphie et procede pour le realiser
PCT/FR1995/000898 WO1996001743A1 (fr) 1994-07-07 1995-07-05 Pochoir pour le depot et le dosage de couches plus ou moins epaisses, a base de points, d'un produit visqueux

Publications (1)

Publication Number Publication Date
DK0770006T3 true DK0770006T3 (da) 1998-09-07

Family

ID=9465214

Family Applications (1)

Application Number Title Priority Date Filing Date
DK95925010T DK0770006T3 (da) 1994-07-07 1995-07-05 Skabelon til påføring og dosering af punktformedelag i forskellige tykkelser af et viskost produkt

Country Status (16)

Country Link
US (1) US6183839B1 (de)
EP (1) EP0770006B1 (de)
JP (1) JP3557618B2 (de)
KR (1) KR100229990B1 (de)
CN (1) CN1046899C (de)
AT (1) ATE161777T1 (de)
AU (1) AU700852B2 (de)
BR (1) BR9507743A (de)
CA (1) CA2189539C (de)
DE (1) DE69501405T2 (de)
DK (1) DK0770006T3 (de)
ES (1) ES2113210T3 (de)
FR (1) FR2722138B1 (de)
GR (1) GR3026480T3 (de)
NO (1) NO319023B1 (de)
WO (1) WO1996001743A1 (de)

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TW289901B (de) 1994-12-28 1996-11-01 Ricoh Microelectronics Kk
TW342365B (en) * 1995-12-21 1998-10-11 Ricoh Microelectronics Kk A printing mask with a plastic printing plate and process for producing the same
FR2768365B1 (fr) * 1997-09-16 1999-10-29 Novatec Mini pochoir et son systeme d'autopositionnement pour la reparation et/ou le remplacement de composants unitaires sur une carte electronique
WO1999014049A1 (fr) * 1997-09-16 1999-03-25 Societe Novatec S.A. Mini pochoir et son dispositif de mise en oeuvre
DE19826998A1 (de) * 1998-06-19 1999-12-23 Stefan Walther Auftragswerk zum direkten Auftrag pastöser Medien auf textilen Flächengebilden
US6722275B2 (en) 2001-09-28 2004-04-20 Photo Stencil, Llc Reservoir stencil with relief areas and method of using
DE10200181A1 (de) * 2001-10-12 2003-04-30 Daniel Mahler Siebdruckform sowie Verfahren zu deren Herstellung
US6887737B1 (en) 2001-12-13 2005-05-03 Henkel Corporation Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom
US20060273138A1 (en) * 2005-06-07 2006-12-07 Samsung Electronics Co., Ltd. Soldering apparatus for printed circuit board, soldering method for printed circuit board and soldering cream printing unit for soldering printed circuit board
DE102008034906A1 (de) * 2008-07-26 2010-02-11 Kocher + Beck Gmbh + Co. Rotationsstanztechnik Kg Siebdruckform für grafische Anwendungen und Verfahren zur Herstellung einer Siebdruckform
DE202008012829U1 (de) 2008-09-26 2008-12-04 Nb Technologies Gmbh Siebdruckform
DE102009024873A1 (de) * 2009-06-09 2010-12-16 Nb Technologies Gmbh Siebdruckform
DE102009024875A1 (de) * 2009-06-09 2010-12-16 Nb Technologies Gmbh Siebdruckschablone
GB2481079B (en) 2009-09-21 2014-06-25 Dtg Int Gmbh Printing screens and method of fabricating the same
US8268389B2 (en) 2010-01-08 2012-09-18 International Business Machines Corporation Precast thermal interface adhesive for easy and repeated, separation and remating
DE202010006945U1 (de) * 2010-05-18 2011-10-07 Cadilac Laser Gmbh Cad Industrial Lasercutting Druckschablone
CN103042818B (zh) * 2011-10-17 2015-12-16 正中科技股份有限公司 网版结构
CN103203984B (zh) * 2012-01-16 2016-06-15 昆山允升吉光电科技有限公司 一种印刷用三维立体掩模板
WO2014033861A1 (ja) * 2012-08-29 2014-03-06 ヤマハ発動機株式会社 印刷機
ITVI20130273A1 (it) * 2013-11-14 2015-05-15 Eurotech S P A Scheda elettronica per supercalcolo refrigerata e procedimento per produrla
CN104249548A (zh) * 2014-09-24 2014-12-31 深圳市华星光电技术有限公司 一种印刷网版
DE102015120185A1 (de) * 2015-11-20 2017-05-24 Asm Assembly Systems Gmbh & Co. Kg Verfahren und Vorrichtung zum Auswählen einer Pastenschablone für einen Pastendruck sowie zum Auftragen von Paste auf ein Substrat mittels der ausgewählten Pastenschablone

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Also Published As

Publication number Publication date
EP0770006B1 (de) 1998-01-07
JP3557618B2 (ja) 2004-08-25
WO1996001743A1 (fr) 1996-01-25
ATE161777T1 (de) 1998-01-15
FR2722138A1 (fr) 1996-01-12
FR2722138B1 (fr) 1996-09-20
KR100229990B1 (ko) 1999-11-15
AU2929895A (en) 1996-02-09
NO964827L (no) 1996-11-14
NO964827D0 (no) 1996-11-14
GR3026480T3 (en) 1998-06-30
DE69501405T2 (de) 1998-07-09
EP0770006A1 (de) 1997-05-02
DE69501405D1 (de) 1998-02-12
CA2189539A1 (fr) 1996-01-25
CA2189539C (fr) 1999-12-14
CN1148830A (zh) 1997-04-30
KR970704583A (ko) 1997-09-06
NO319023B1 (no) 2005-06-06
JPH10510223A (ja) 1998-10-06
US6183839B1 (en) 2001-02-06
AU700852B2 (en) 1999-01-14
CN1046899C (zh) 1999-12-01
ES2113210T3 (es) 1998-04-16
BR9507743A (pt) 1997-08-19

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