DK1072176T3 - Fremgangsmåde til tilvejebringelse af ledende baner på et trykt kredsløb og apparatur til anvendelse ved udøvelse af fremgangsmåden - Google Patents

Fremgangsmåde til tilvejebringelse af ledende baner på et trykt kredsløb og apparatur til anvendelse ved udøvelse af fremgangsmåden

Info

Publication number
DK1072176T3
DK1072176T3 DK99914642T DK99914642T DK1072176T3 DK 1072176 T3 DK1072176 T3 DK 1072176T3 DK 99914642 T DK99914642 T DK 99914642T DK 99914642 T DK99914642 T DK 99914642T DK 1072176 T3 DK1072176 T3 DK 1072176T3
Authority
DK
Denmark
Prior art keywords
tracks
electrode
printed circuit
practice
electro
Prior art date
Application number
DK99914642T
Other languages
Danish (da)
English (en)
Inventor
John Michael Lowe
Original Assignee
Tdao Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdao Ltd filed Critical Tdao Ltd
Application granted granted Critical
Publication of DK1072176T3 publication Critical patent/DK1072176T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C25D5/06—Brush or pad plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Devices For Checking Fares Or Tickets At Control Points (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Threshing Machine Elements (AREA)
  • Insulated Conductors (AREA)
DK99914642T 1998-04-06 1999-04-06 Fremgangsmåde til tilvejebringelse af ledende baner på et trykt kredsløb og apparatur til anvendelse ved udøvelse af fremgangsmåden DK1072176T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9807280A GB2336161B (en) 1998-04-06 1998-04-06 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
PCT/GB1999/000890 WO1999052336A1 (en) 1998-04-06 1999-04-06 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method

Publications (1)

Publication Number Publication Date
DK1072176T3 true DK1072176T3 (da) 2004-02-02

Family

ID=10829875

Family Applications (1)

Application Number Title Priority Date Filing Date
DK99914642T DK1072176T3 (da) 1998-04-06 1999-04-06 Fremgangsmåde til tilvejebringelse af ledende baner på et trykt kredsløb og apparatur til anvendelse ved udøvelse af fremgangsmåden

Country Status (15)

Country Link
US (2) US6524462B1 (de)
EP (2) EP1311145B1 (de)
JP (1) JP2002511643A (de)
KR (1) KR100634221B1 (de)
AT (2) ATE251836T1 (de)
AU (1) AU748566C (de)
BR (1) BR9909489A (de)
CA (1) CA2327574A1 (de)
DE (2) DE69921515T2 (de)
DK (1) DK1072176T3 (de)
ES (2) ES2234980T3 (de)
GB (1) GB2336161B (de)
PT (1) PT1072176E (de)
RU (1) RU2218680C2 (de)
WO (1) WO1999052336A1 (de)

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US20050176270A1 (en) * 2004-02-11 2005-08-11 Daniel Luch Methods and structures for the production of electrically treated items and electrical connections
US7705439B2 (en) * 2005-01-25 2010-04-27 Teledyne Technologies Incorporated Destructor integrated circuit chip, interposer electronic device and methods
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US7489013B1 (en) 2005-10-17 2009-02-10 Teledyne Technologies Incorporated Destructor integrated circuit chip, interposer electronic device and methods
US7640658B1 (en) 2005-10-18 2010-01-05 Teledyne Technologies Incorporated Methods for forming an anti-tamper pattern
CN101491166B (zh) * 2006-06-14 2011-09-28 巴斯夫欧洲公司 在载体上生产导电表面的方法
EP2066497B1 (de) 2006-08-07 2018-11-07 Inktec Co., Ltd. Herstellungsverfahren für metallkaschierte laminate
RU2338341C2 (ru) * 2006-12-28 2008-11-10 Федеральное государственное унитарное предприятие "Ордена Трудового Красного Знамени федеральный научно-производственный центр по радиоэлектронным системам и информационным технологиям имени В.И. Шимко" (ФГУП "Федеральный НПЦ "Радиоэлектроника" им. В.И. Шимко") Способ изготовления полосковой платы на диэлектрической подложке
RU2342812C2 (ru) * 2007-01-24 2008-12-27 ФГУП "Казанский научно-исследовательский институт радиоэлектроники" Способ изготовления плат гибридных интегральных схем крючатова в.и.
KR20110030539A (ko) * 2008-06-18 2011-03-23 바스프 에스이 태양 전지용 전극의 제조 방법
EP2182787A1 (de) 2008-10-30 2010-05-05 BAE Systems PLC Verbesserungen in Bezug auf additive Herstellungsverfahren
EP2351472B1 (de) * 2008-10-30 2012-09-12 BAE Systems PLC Verbesserungen in bezug auf additive herstellungsprozesse
CN101950771A (zh) * 2010-07-27 2011-01-19 中国科学院苏州纳米技术与纳米仿生研究所 一种复合电极的制备方法
KR101283009B1 (ko) * 2011-05-26 2013-07-05 주승기 전기 도금장치 및 전기 도금방법
US9255339B2 (en) * 2011-09-19 2016-02-09 Fei Company Localized, in-vacuum modification of small structures
GB2534262B (en) * 2013-06-28 2020-03-25 Intel Corp Preservation of fine pitch redistribution lines
DE102013113485A1 (de) 2013-12-04 2015-06-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Ausbilden einer elektrisch leitfähigen Struktur auf einem Kunststoffsubstrat
RU2739750C1 (ru) * 2019-12-16 2020-12-28 Федеральное государственное бюджетное учреждение науки Новосибирский институт органической химии им. Н.Н. Ворожцова Сибирского отделения Российской академии наук (НИОХ СО РАН) Способ получения микронных электропроводящих дорожек на подложках анодированного алюминия
US12584923B2 (en) * 2021-01-25 2026-03-24 University Of Wyoming Apparatus and methods for fabrication of nanopatterned arrays

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Also Published As

Publication number Publication date
DE69921515D1 (de) 2004-12-02
ES2234980T3 (es) 2005-07-01
AU748566C (en) 2007-03-15
US6524462B1 (en) 2003-02-25
ATE251836T1 (de) 2003-10-15
EP1311145A1 (de) 2003-05-14
ATE281059T1 (de) 2004-11-15
EP1311145B1 (de) 2004-10-27
GB2336161B (en) 2003-03-26
RU2218680C2 (ru) 2003-12-10
GB9807280D0 (en) 1998-06-03
JP2002511643A (ja) 2002-04-16
US20030024819A1 (en) 2003-02-06
DE69921515T2 (de) 2006-02-02
BR9909489A (pt) 2000-12-19
DE69911941T2 (de) 2004-09-09
CA2327574A1 (en) 1999-10-14
WO1999052336B1 (en) 1999-11-18
DE69911941D1 (de) 2003-11-13
EP1072176B1 (de) 2003-10-08
AU3337999A (en) 1999-10-25
EP1072176A1 (de) 2001-01-31
KR100634221B1 (ko) 2006-10-16
US6949171B2 (en) 2005-09-27
KR20010042464A (ko) 2001-05-25
GB2336161A (en) 1999-10-13
WO1999052336A1 (en) 1999-10-14
ES2211064T3 (es) 2004-07-01
AU748566B2 (en) 2002-06-06
PT1072176E (pt) 2004-02-27

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