DK2458505T3 - Hukommelseskredsløbssystem og fremgangsmåde - Google Patents

Hukommelseskredsløbssystem og fremgangsmåde Download PDF

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Publication number
DK2458505T3
DK2458505T3 DK11194883.2T DK11194883T DK2458505T3 DK 2458505 T3 DK2458505 T3 DK 2458505T3 DK 11194883 T DK11194883 T DK 11194883T DK 2458505 T3 DK2458505 T3 DK 2458505T3
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DK
Denmark
Prior art keywords
memory
dram
integrated circuit
dimm
circuits
Prior art date
Application number
DK11194883.2T
Other languages
English (en)
Inventor
Suresh Natarajan Rajan
Michael John Sebastian Smith
Keith R Schakel
Frederick Daniel Weber
David T Wang
Original Assignee
Google Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/461,437 external-priority patent/US8077535B2/en
Priority claimed from US11/702,981 external-priority patent/US8089795B2/en
Priority claimed from US11/702,960 external-priority patent/US20080126690A1/en
Application filed by Google Inc filed Critical Google Inc
Application granted granted Critical
Publication of DK2458505T3 publication Critical patent/DK2458505T3/da

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F12/00—Accessing, addressing or allocating within memory systems or architectures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/14—Handling requests for interconnection or transfer
    • G06F13/16—Handling requests for interconnection or transfer for access to memory bus
    • G06F13/1668—Details of memory controller
    • G06F13/1673—Details of memory controller using buffers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/14—Handling requests for interconnection or transfer
    • G06F13/16—Handling requests for interconnection or transfer for access to memory bus
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/14—Handling requests for interconnection or transfer
    • G06F13/16—Handling requests for interconnection or transfer for access to memory bus
    • G06F13/1605—Handling requests for interconnection or transfer for access to memory bus based on arbitration
    • G06F13/1652—Handling requests for interconnection or transfer for access to memory bus based on arbitration in a multiprocessor architecture
    • G06F13/1657—Access to multiple memories
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/406—Management or control of the refreshing or charge-regeneration cycles
    • G11C11/40618—Refresh operations over multiple banks or interleaving
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/02—Arrangements for writing information into, or reading information out from, a digital store with means for avoiding parasitic signals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Dram (AREA)
  • Memory System (AREA)
  • Debugging And Monitoring (AREA)
  • Use Of Switch Circuits For Exchanges And Methods Of Control Of Multiplex Exchanges (AREA)
  • Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)

Claims (4)

1. System omfattende: et hukommelsesmodul med: i det mindste én hukommelsesstak (SO), som omfatter adskillige DRAM ¡ntegrerede kredslob; en DIMM (1810, 2010), som omfatter adskillige slots til montering af de naevnte DRAM ¡ntegrerede kredslob; og et bufferkredslob (B0, 2040), som er forbundet med et hostsystem, for at interface hukommelsesstakken med hostsystemet og for at tilvejebringe i det mindste én funktion for hostsystemet, kendetegnet ved, at: bufferkredslobet omfatter et kredslob, som er indrettet til at tillade at hostsystemet holder et maksimalt antal hukommelsessider ábne, selv om et antal populerede DIMM slots er mindre end et maksimalt antal DIMM slots, som hostsystemet er i stand til at understotte; systemet omfatter yderligere et motherboard, hvor alie ¡ntegrerede kredslobs-selektsignaler fra hostsystemet er forbundet med alie DIMM konnektorer pá motherboardet; og hvor, ved forsyningsopstart, de ¡ntegrerede kredslobsselektsignaler tíldeles pá tvaers af populerede DIMM konnektorer, efter at hostsystemet foresporger antallet af populerede DIMM konnektorer.
2. System som angivet i krav 1, hvor bufferkredslobet i hukommelsesmodulet omfatter ¡ntegrerede kredslob til at muliggore at bufferkredslobet sammenstiller adskillige DRAM indretninger, som fungerer ved en forste klokhastighed, for overfor hostsystemet at emulere ét eller flere DRAM ¡ntegrerede kredslob, som fungerer ved en anden klokhastighed, idet den fprste klokhastighed er langsommere end den anden klokhastighed.
3. System som angivet i ethvert af kravene 1-2, hvor hukommelsesmodulet yderligere omfatter: et interfacekredslob, som er forbundet med et hostsystem til at interface hukommelsesstakken med hostsystemet for at drive hukommelsesstakken som et enkelt DRAM integreret kredslob.
4. System som angivet i krav 3, hvor interfacekredslobet i hukommelsesmodulet omfatter et integreret bufferkredslob inkorporeret som en del af hukommelses-stakken.
DK11194883.2T 2006-02-09 2007-02-08 Hukommelseskredsløbssystem og fremgangsmåde DK2458505T3 (da)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US77241406P 2006-02-09 2006-02-09
US11/461,437 US8077535B2 (en) 2006-07-31 2006-07-31 Memory refresh apparatus and method
US86562406P 2006-11-13 2006-11-13
US11/702,981 US8089795B2 (en) 2006-02-09 2007-02-05 Memory module with memory stack and interface with enhanced capabilities
US11/702,960 US20080126690A1 (en) 2006-02-09 2007-02-05 Memory module with memory stack
EP07750307A EP2005303B1 (en) 2006-02-09 2007-02-08 Memory circuit system and method

Publications (1)

Publication Number Publication Date
DK2458505T3 true DK2458505T3 (da) 2014-12-01

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Family Applications (3)

Application Number Title Priority Date Filing Date
DK07750307.6T DK2005303T3 (da) 2006-02-09 2007-02-08 Hukommelseskredsløbssystem samt - fremgangsmåde
DK11194883.2T DK2458505T3 (da) 2006-02-09 2007-02-08 Hukommelseskredsløbssystem og fremgangsmåde
DK13191794.0T DK2696290T3 (da) 2006-02-09 2007-02-08 Hukommelseskredsløbssystem og -metode

Family Applications Before (1)

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DK07750307.6T DK2005303T3 (da) 2006-02-09 2007-02-08 Hukommelseskredsløbssystem samt - fremgangsmåde

Family Applications After (1)

Application Number Title Priority Date Filing Date
DK13191794.0T DK2696290T3 (da) 2006-02-09 2007-02-08 Hukommelseskredsløbssystem og -metode

Country Status (6)

Country Link
EP (7) EP3276495A1 (da)
JP (3) JP5205280B2 (da)
KR (3) KR101404926B1 (da)
AT (1) ATE554447T1 (da)
DK (3) DK2005303T3 (da)
HK (1) HK1250270A1 (da)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4861497B2 (ja) 2010-05-31 2012-01-25 株式会社東芝 データ記憶装置及びメモリ調整方法
US8582373B2 (en) * 2010-08-31 2013-11-12 Micron Technology, Inc. Buffer die in stacks of memory dies and methods
JP2012099189A (ja) * 2010-11-04 2012-05-24 Elpida Memory Inc 半導体装置
JP5541373B2 (ja) 2011-01-13 2014-07-09 富士通株式会社 メモリコントローラ、及び情報処理装置
JP2012146377A (ja) * 2011-01-14 2012-08-02 Elpida Memory Inc 半導体装置
JP5647014B2 (ja) * 2011-01-17 2014-12-24 ピーエスフォー ルクスコ エスエイアールエルＰＳ４ Ｌｕｘｃｏ Ｓ．ａ．ｒ．ｌ． 半導体装置
KR101937951B1 (ko) 2012-05-31 2019-01-14 에스케이하이닉스 주식회사 반도체 집적회로 및 그의 구동방법
US8811110B2 (en) 2012-06-28 2014-08-19 Intel Corporation Configuration for power reduction in DRAM
CN105164804A (zh) * 2013-01-31 2015-12-16 惠普发展公司，有限责任合伙企业 多层级集成电路的选择电路
KR101821633B1 (ko) 2013-03-14 2018-03-08 삼성전자주식회사 메모리 시스템
US9679615B2 (en) * 2013-03-15 2017-06-13 Micron Technology, Inc. Flexible memory system with a controller and a stack of memory
US9658783B2 (en) * 2013-03-27 2017-05-23 Hitachi, Ltd. DRAM having SDRAM interface and flash memory consolidated memory module
CN105027092B (zh) * 2013-03-27 2018-01-30 株式会社日立制作所 具有sdram接口的dram、混合闪存存储器模块
WO2014203383A1 (ja) * 2013-06-20 2014-12-24 株式会社日立製作所 異種メモリを混載したメモリモジュール、及びそれを搭載した情報処理装置
US9921980B2 (en) * 2013-08-12 2018-03-20 Micron Technology, Inc. Apparatuses and methods for configuring I/Os of memory for hybrid memory modules
US9805775B1 (en) 2013-11-08 2017-10-31 Altera Corporation Integrated circuits with improved memory controllers
US9760138B2 (en) * 2014-04-25 2017-09-12 Microsoft Technology Licensing, Llc Load scheduling in multi-battery devices
JP5775629B2 (ja) * 2014-07-29 2015-09-09 ルネサスエレクトロニクス株式会社 半導体集積回路
US10261697B2 (en) 2015-06-08 2019-04-16 Samsung Electronics Co., Ltd. Storage device and operating method of storage device
KR102274038B1 (ko) * 2015-08-03 2021-07-09 삼성전자주식회사 백업 기능을 갖는 메모리 모듈
US9830086B2 (en) * 2016-03-03 2017-11-28 Samsung Electronics Co., Ltd. Hybrid memory controller for arbitrating access to volatile and non-volatile memories in a hybrid memory group
US10592114B2 (en) 2016-03-03 2020-03-17 Samsung Electronics Co., Ltd. Coordinated in-module RAS features for synchronous DDR compatible memory
US10810144B2 (en) * 2016-06-08 2020-10-20 Samsung Electronics Co., Ltd. System and method for operating a DRR-compatible asynchronous memory module
KR102716191B1 (ko) * 2016-12-06 2024-10-11 삼성전자주식회사 반도체 메모리 장치 및 이를 구비하는 메모리 모듈
WO2018216081A1 (ja) * 2017-05-22 2018-11-29 ゼンテルジャパン株式会社 半導体記憶システム
KR20210031266A (ko) * 2019-09-11 2021-03-19 삼성전자주식회사 인터페이스 회로, 메모리 장치, 저장 장치 및 메모리 장치의 동작 방법
US20230156997A1 (en) * 2020-04-03 2023-05-18 Ultramemory Inc. Memory unit, semiconductor module, dimm module, and manufacturing method for same
US11222702B1 (en) 2020-07-09 2022-01-11 Micron Technology, Inc. Noise reduction during parallel plane access in a multi-plane memory device
US11494120B2 (en) 2020-10-02 2022-11-08 Qualcomm Incorporated Adaptive memory transaction scheduling
JP2023177765A (ja) * 2022-06-03 2023-12-14 株式会社半導体エネルギー研究所 半導体装置
US20260119044A1 (en) * 2024-10-30 2026-04-30 Uif (University Industry Foundation), Yonsei University Skew resistance processing in dimm device and processing method
CN120371227A (zh) * 2025-06-27 2025-07-25 西安紫光国芯半导体股份有限公司 一种存储模组、存储系统及电子系统

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4538241A (en) * 1983-07-14 1985-08-27 Burroughs Corporation Address translation buffer
US5369749A (en) * 1989-05-17 1994-11-29 Ibm Corporation Method and apparatus for the direct transfer of information between application programs running on distinct processors without utilizing the services of one or both operating systems
JP3078136B2 (ja) * 1992-11-27 2000-08-21 沖電気工業株式会社 画像メモリ装置
WO1995005676A1 (en) * 1993-08-13 1995-02-23 Irvine Sensors Corporation Stack of ic chips as substitute for single ic chip
JPH08278916A (ja) * 1994-11-30 1996-10-22 Hitachi Ltd マルチチャネルメモリシステム、転送情報同期化方法及び信号転送回路
KR0164358B1 (ko) * 1995-08-31 1999-02-18 김광호 반도체 메모리 장치의 서브워드라인 디코더
JP3780580B2 (ja) * 1995-10-16 2006-05-31 セイコーエプソン株式会社 半導体記憶装置及びそれを用いた電子機器
US5761694A (en) * 1995-11-30 1998-06-02 Cirrus Logic, Inc. Multi-bank memory system and method having addresses switched between the row and column decoders in different banks
US5765203A (en) * 1995-12-19 1998-06-09 Seagate Technology, Inc. Storage and addressing method for a buffer memory control system for accessing user and error imformation
US5926827A (en) * 1996-02-09 1999-07-20 International Business Machines Corp. High density SIMM or DIMM with RAS address re-mapping
JPH10233091A (ja) * 1997-02-21 1998-09-02 Hitachi Ltd 半導体記憶装置およびデータ処理装置
JPH10260895A (ja) * 1997-03-19 1998-09-29 Hitachi Ltd 半導体記憶装置およびそれを用いた計算機システム
US5960468A (en) * 1997-04-30 1999-09-28 Sony Corporation Asynchronous memory interface for a video processor with a 2N sized buffer and N+1 bit wide gray coded counters
US6067255A (en) * 1997-07-03 2000-05-23 Samsung Electronics Co., Ltd. Merged memory and logic (MML) integrated circuits including independent memory bank signals and methods
US6351427B1 (en) * 1997-12-10 2002-02-26 Texas Instruments Incorporated Stored write scheme for high speed/wide bandwidth memory devices
JP3922487B2 (ja) * 1998-02-04 2007-05-30 松下電器産業株式会社 メモリ制御装置および方法
US6226730B1 (en) * 1998-06-05 2001-05-01 Intel Corporation Achieving page hit memory cycles on a virtual address reference
JP4540137B2 (ja) * 1998-07-24 2010-09-08 ルネサスエレクトロニクス株式会社 同期型半導体記憶装置
US6526484B1 (en) * 1998-11-16 2003-02-25 Infineon Technologies Ag Methods and apparatus for reordering of the memory requests to achieve higher average utilization of the command and data bus
KR100304705B1 (ko) * 1999-03-03 2001-10-29 윤종용 포스티드 카스 레이턴시 기능을 가지는 동기식 반도체 메모리 장치 및 카스 레이턴시 제어 방법
US6389514B1 (en) * 1999-03-25 2002-05-14 Hewlett-Packard Company Method and computer system for speculatively closing pages in memory
US6683372B1 (en) * 1999-11-18 2004-01-27 Sun Microsystems, Inc. Memory expansion module with stacked memory packages and a serial storage unit
KR100344217B1 (ko) * 2000-07-04 2002-07-20 주식회사 케이이씨메카트로닉스 듀얼포트 메모리를 이용한 통신 인터페이스회로
US6487102B1 (en) * 2000-09-18 2002-11-26 Intel Corporation Memory module having buffer for isolating stacked memory devices
JP2002288037A (ja) * 2001-03-27 2002-10-04 Sony Corp メモリ制御装置及び方法
US6915402B2 (en) * 2001-05-23 2005-07-05 Hewlett-Packard Development Company, L.P. Method and system for creating secure address space using hardware memory router
JP3799251B2 (ja) * 2001-08-24 2006-07-19 エルピーダメモリ株式会社 メモリデバイス及びメモリシステム
CN1280734C (zh) * 2001-09-07 2006-10-18 皇家菲利浦电子有限公司 用于分段存取控制的控制装置和方法和具有该控制装置的视频存储器装置
US6914324B2 (en) * 2001-10-26 2005-07-05 Staktek Group L.P. Memory expansion and chip scale stacking system and method
US6950910B2 (en) * 2001-11-08 2005-09-27 Freescale Semiconductor, Inc. Mobile wireless communication device architectures and methods therefor
US7480911B2 (en) * 2002-05-09 2009-01-20 International Business Machines Corporation Method and apparatus for dynamically allocating and deallocating processors in a logical partitioned data processing system
EP1570474A1 (en) * 2002-12-04 2005-09-07 Koninklijke Philips Electronics N.V. Portable media player with adaptive playback buffer control
JP4419049B2 (ja) * 2003-04-21 2010-02-24 エルピーダメモリ株式会社 メモリモジュール及びメモリシステム
JP4346369B2 (ja) * 2003-08-08 2009-10-21 株式会社メルコホールディングス メモリモジュールおよびメモリ用補助モジュール
JP3896112B2 (ja) * 2003-12-25 2007-03-22 エルピーダメモリ株式会社 半導体集積回路装置
KR100604843B1 (ko) * 2004-03-26 2006-07-31 삼성전자주식회사 온-다이 종단 회로를 구비한 메모리 모듈 및 그 제어 방법
TWI299497B (en) * 2004-06-24 2008-08-01 Via Tech Inc Method and related apparatus for accessing memory apparatus
JP4534132B2 (ja) * 2004-06-29 2010-09-01 エルピーダメモリ株式会社 積層型半導体メモリ装置

Also Published As

Publication number Publication date
EP2005303A2 (en) 2008-12-24
EP2706461A1 (en) 2014-03-12
EP2450798A1 (en) 2012-05-09
JP2013012232A (ja) 2013-01-17
EP2005303A4 (en) 2009-09-16
KR101429869B1 (ko) 2014-08-12
JP5730252B2 (ja) 2015-06-03
KR20140056349A (ko) 2014-05-09
EP2696290A1 (en) 2014-02-12
EP2450800A1 (en) 2012-05-09
EP2450798B1 (en) 2013-10-30
JP2013012233A (ja) 2013-01-17
EP2450800B1 (en) 2014-04-23
KR20080108975A (ko) 2008-12-16
HK1250270A1 (en) 2018-12-07
DK2696290T3 (da) 2016-02-15
JP5730251B2 (ja) 2015-06-03
ATE554447T1 (de) 2012-05-15
KR101404926B1 (ko) 2014-06-10
EP3276495A1 (en) 2018-01-31
JP5205280B2 (ja) 2013-06-05
EP2696290B1 (en) 2015-12-23
EP2005303B1 (en) 2012-04-18
KR101343252B1 (ko) 2013-12-18
KR20130141693A (ko) 2013-12-26
JP2009526323A (ja) 2009-07-16
EP2458505A1 (en) 2012-05-30
EP2458505B1 (en) 2014-10-08
DK2005303T3 (da) 2012-07-23

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