DK434885A - Fotosensible polymersammensaetninger, fremgangsmaade til elektroforetisk aflejring af disse og deres anvendelse til dannelse af film paa substrater - Google Patents
Fotosensible polymersammensaetninger, fremgangsmaade til elektroforetisk aflejring af disse og deres anvendelse til dannelse af film paa substrater Download PDFInfo
- Publication number
- DK434885A DK434885A DK434885A DK434885A DK434885A DK 434885 A DK434885 A DK 434885A DK 434885 A DK434885 A DK 434885A DK 434885 A DK434885 A DK 434885A DK 434885 A DK434885 A DK 434885A
- Authority
- DK
- Denmark
- Prior art keywords
- photosensible
- movies
- electrophoretic
- disposal
- substrates
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 229920000642 polymer Polymers 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/138—Corona discharge process
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Materials For Photolithography (AREA)
- Polymerisation Methods In General (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- Paints Or Removers (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/654,821 US4592816A (en) | 1984-09-26 | 1984-09-26 | Electrophoretic deposition process |
| US65482184 | 1984-09-26 | ||
| CN86100150A CN86100150A (zh) | 1984-09-26 | 1986-01-11 | 感光聚合物组合物及其电泳沉积工艺过程 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DK434885D0 DK434885D0 (da) | 1985-09-25 |
| DK434885A true DK434885A (da) | 1986-03-27 |
| DK168802B1 DK168802B1 (da) | 1994-06-13 |
Family
ID=67809744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK434885A DK168802B1 (da) | 1984-09-26 | 1985-09-25 | Negativt virkende fotoresist, der kan aflejres elektroforetisk og fremkaldes med vandigt medium, fremgangsmåde til dannelse af et negativt polymerbillede på en ledende overflade af et substrat under anvendelse af fotoresisten samt fotoresistens anvendelse til dannelse af film på substrater |
Country Status (19)
| Country | Link |
|---|---|
| US (1) | US4592816A (da) |
| EP (1) | EP0176356B1 (da) |
| JP (1) | JPH081519B2 (da) |
| KR (1) | KR920005775B1 (da) |
| CN (2) | CN86100150A (da) |
| AU (1) | AU586189B2 (da) |
| BR (1) | BR8504640A (da) |
| CA (1) | CA1257803A (da) |
| DE (1) | DE3566047D1 (da) |
| DK (1) | DK168802B1 (da) |
| FI (1) | FI80350C (da) |
| HK (1) | HK58289A (da) |
| IE (1) | IE58622B1 (da) |
| IL (1) | IL76491A (da) |
| MX (1) | MX165458B (da) |
| NO (1) | NO168857C (da) |
| PH (1) | PH22139A (da) |
| SG (1) | SG8489G (da) |
| ZA (1) | ZA857435B (da) |
Families Citing this family (91)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8430377D0 (en) * | 1984-12-01 | 1985-01-09 | Ciba Geigy Ag | Modified phenolic resins |
| DE3517796A1 (de) * | 1985-05-17 | 1986-11-20 | Hoechst Ag, 6230 Frankfurt | Verfahren zur herstellung von elektrisch isolierendem basismaterial fuer die fertigung von durchkontaktierten leiterplatten |
| JPH0644150B2 (ja) * | 1986-05-09 | 1994-06-08 | 関西ペイント株式会社 | プリント配線フオトレジスト用電着塗料組成物 |
| JPS6317592A (ja) * | 1986-07-09 | 1988-01-25 | 三菱電機株式会社 | プリント配線板の製造方法 |
| US4762747A (en) * | 1986-07-29 | 1988-08-09 | Industrial Technology Research Institute | Single component aqueous acrylic adhesive compositions for flexible printed circuits and laminates made therefrom |
| US4751172A (en) * | 1986-08-01 | 1988-06-14 | Shipley Company Inc. | Process for forming metal images |
| GB8620001D0 (en) * | 1986-08-16 | 1986-09-24 | Ciba Geigy Ag | Production of images |
| EP0662636A3 (en) * | 1986-10-23 | 1995-11-22 | Ciba Geigy Ag | Imaging processes. |
| JPS63182888A (ja) * | 1987-01-26 | 1988-07-28 | 関西ペイント株式会社 | プリント配線板の製造方法 |
| JPS63246890A (ja) * | 1987-04-02 | 1988-10-13 | 関西ペイント株式会社 | プリント回路の形成方法 |
| JPS6420694A (en) * | 1987-07-15 | 1989-01-24 | Kansai Paint Co Ltd | Manufacture of printed wiring board |
| DE3880920T2 (de) * | 1987-08-05 | 1993-10-07 | Ciba Geigy | Verbindungen. |
| EP0302827B1 (en) * | 1987-08-05 | 1994-07-06 | Ciba-Geigy Ag | Process for the formation of images |
| US5196098A (en) * | 1988-01-04 | 1993-03-23 | Shipley Company Inc. | Apparatus and process for electrophoretic deposition |
| JPH0795577B2 (ja) * | 1988-04-12 | 1995-10-11 | 富士プラント工業株式会社 | リードフレームへの部分メッキ方法 |
| JP2585070B2 (ja) * | 1988-08-02 | 1997-02-26 | 日本ペイント株式会社 | 画像形成方法 |
| CA1334897C (en) * | 1988-08-02 | 1995-03-28 | Mamoru Seio | Electrodeposition coating composition and image-forming method using the same |
| US5102775A (en) * | 1988-09-30 | 1992-04-07 | Kansai Paint Co., Ltd. | Visible light sensitive electrodeposition coating composition and image-forming method using the same |
| GB8827847D0 (en) * | 1988-11-29 | 1988-12-29 | Ciba Geigy Ag | Method |
| CA2009274A1 (en) * | 1989-02-22 | 1990-08-22 | Manuel Buentello Iii | Method for making electronic components using a masking material and a masking material therefor |
| GB8909561D0 (en) * | 1989-04-26 | 1989-06-14 | Kodak Ltd | Radiation-sensitive composition and use thereof in the preparation of electrochemical ion sensors |
| JPH02302092A (ja) * | 1989-05-16 | 1990-12-14 | Kansai Paint Co Ltd | プリント配線板の製造方法 |
| US5004672A (en) * | 1989-07-10 | 1991-04-02 | Shipley Company Inc. | Electrophoretic method for applying photoresist to three dimensional circuit board substrate |
| US5236810A (en) * | 1989-10-03 | 1993-08-17 | Kansai Paint Co., Ltd. | Process for preparing printed-circuit board |
| US5047128A (en) * | 1990-01-02 | 1991-09-10 | Shipley Company Inc. | Electrodialysis cell for removal of excess electrolytes formed during electrodeposition of photoresists coatings |
| DE4009563A1 (de) * | 1990-03-24 | 1991-09-26 | Basf Lacke & Farben | Waessrig entwickelbares, negativ wirkendes, elektrophoretisch abscheidbares und photohaertbares beschichtungsmittel sowie seine verwendung zur herstellung von leiterbahnen |
| EP0449022A3 (en) * | 1990-03-26 | 1992-03-11 | Shipley Company Inc. | Method of controlling photoresist film thickness and stability of an electrodeposition bath |
| US5055164A (en) * | 1990-03-26 | 1991-10-08 | Shipley Company Inc. | Electrodepositable photoresists for manufacture of hybrid circuit boards |
| ATE185000T1 (de) * | 1990-06-27 | 1999-10-15 | Coates Brothers Plc | Verfahren zur bilderzeugung |
| JPH0465184A (ja) * | 1990-07-05 | 1992-03-02 | Kansai Paint Co Ltd | 電着前処理方法 |
| CA2048164C (en) * | 1990-08-02 | 1998-11-10 | Kurt G. Olson | Photoimageable electrodepositable photoresist composition |
| US5268256A (en) * | 1990-08-02 | 1993-12-07 | Ppg Industries, Inc. | Photoimageable electrodepositable photoresist composition for producing non-tacky films |
| US5066374A (en) * | 1990-09-20 | 1991-11-19 | Rohm And Haas Company | Elimination of film defects due to hydrogen evolution during cathodic electrodeposition |
| EP0490118A1 (en) * | 1990-12-10 | 1992-06-17 | Shipley Company Inc. | Photoimagable solder mask and photosensitive composition |
| EP0493317B2 (de) * | 1990-12-18 | 2001-01-10 | Ciba SC Holding AG | Strahlungsempfindliche Zusammensetzung auf Basis von Wasser als Lösungsmittel |
| US5202222A (en) * | 1991-03-01 | 1993-04-13 | Shipley Company Inc. | Selective and precise etching and plating of conductive substrates |
| US5607818A (en) * | 1991-06-04 | 1997-03-04 | Micron Technology, Inc. | Method for making interconnects and semiconductor structures using electrophoretic photoresist deposition |
| US5288377A (en) * | 1991-06-05 | 1994-02-22 | Macdermid, Incorporated | Process for the manufacture of printed circuits using electrophoretically deposited organic resists |
| US5160579A (en) * | 1991-06-05 | 1992-11-03 | Macdermid, Incorporated | Process for manufacturing printed circuit employing selective provision of solderable coating |
| CA2067921A1 (en) * | 1991-06-12 | 1992-12-13 | Alan Frederick Becknell | Method of making electrical circuit traces |
| US5314789A (en) * | 1991-10-01 | 1994-05-24 | Shipley Company Inc. | Method of forming a relief image comprising amphoteric compositions |
| US5384229A (en) * | 1992-05-07 | 1995-01-24 | Shipley Company Inc. | Photoimageable compositions for electrodeposition |
| SK88295A3 (en) * | 1993-01-11 | 1996-03-06 | Macdermid Inc | Phosphating compositions and processes, particulary for use in fabrication of printed circuit utilizating organic resists |
| JPH07249766A (ja) * | 1994-03-10 | 1995-09-26 | Fujitsu Ltd | 半導体装置及びその製造方法 |
| US5590460A (en) | 1994-07-19 | 1997-01-07 | Tessera, Inc. | Method of making multilayer circuit |
| US5531872A (en) * | 1994-08-11 | 1996-07-02 | Xerox Corporation | Processes for preparing photoconductive members by electrophoresis |
| US5721088A (en) * | 1995-12-20 | 1998-02-24 | Ppg Industries, Inc. | Electrodepositable photoimageable compositions with improved edge coverage |
| KR100242165B1 (ko) * | 1996-11-30 | 2000-02-01 | 김영남 | 음극선관의 건식전자사진식 스크린 제조용 광전도막도포용액 및 이를 사용하는 그 스크린 제조방법 |
| US6033548A (en) * | 1997-07-28 | 2000-03-07 | Micron Technology, Inc. | Rotating system and method for electrodepositing materials on semiconductor wafers |
| US5893966A (en) * | 1997-07-28 | 1999-04-13 | Micron Technology, Inc. | Method and apparatus for continuous processing of semiconductor wafers |
| US6153075A (en) | 1998-02-26 | 2000-11-28 | Micron Technology, Inc. | Methods using electrophoretically deposited patternable material |
| US6503564B1 (en) * | 1999-02-26 | 2003-01-07 | 3M Innovative Properties Company | Method of coating microstructured substrates with polymeric layer(s), allowing preservation of surface feature profile |
| EP1204701B1 (en) | 1999-07-30 | 2005-09-21 | PPG Industries Ohio, Inc. | Cured coatings having improved scratch resistance and coated substrates |
| US6610777B1 (en) * | 1999-07-30 | 2003-08-26 | Ppg Industries Ohio, Inc. | Flexible coating compositions having improved scratch resistance, coated substrates and methods related thereto |
| US6623791B2 (en) | 1999-07-30 | 2003-09-23 | Ppg Industries Ohio, Inc. | Coating compositions having improved adhesion, coated substrates and methods related thereto |
| BR0012875A (pt) | 1999-07-30 | 2002-04-16 | Ppg Ind Ohio Inc | Composições de revestimento tendo resistência aperfeiçoada à arranhadura, substratos revestidos e métodos relacionados às mesmas |
| US6657001B1 (en) | 1999-07-30 | 2003-12-02 | Ppg Industries Ohio, Inc. | Coating compositions having improved scratch resistance, coated substrates and methods related thereto |
| US6455231B1 (en) * | 1999-11-03 | 2002-09-24 | Shipley Company, L.L.C. | Dry film photoimageable compositions |
| KR100686228B1 (ko) | 2000-03-13 | 2007-02-22 | 삼성전자주식회사 | 사진 식각용 장치 및 방법, 그리고 이를 이용한 액정 표시장치용 박막 트랜지스터 기판의 제조 방법 |
| US6379865B1 (en) | 2000-04-11 | 2002-04-30 | 3M Innovative Properties Company | Photoimageable, aqueous acid soluble polyimide polymers |
| US6635341B1 (en) | 2000-07-31 | 2003-10-21 | Ppg Industries Ohio, Inc. | Coating compositions comprising silyl blocked components, coating, coated substrates and methods related thereto |
| DE10112023A1 (de) * | 2001-03-07 | 2002-10-02 | Atotech Deutschland Gmbh | Verfahren zum Bilden eines Metallmusters auf einen dielektrischen Substrat |
| US7000313B2 (en) * | 2001-03-08 | 2006-02-21 | Ppg Industries Ohio, Inc. | Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions |
| US7228623B2 (en) * | 2001-03-08 | 2007-06-12 | Ppg Industries Ohio, Inc. | Process for fabricating a multi layer circuit assembly |
| US6671950B2 (en) | 2001-03-08 | 2004-01-06 | Ppg Industries Ohio, Inc. | Multi-layer circuit assembly and process for preparing the same |
| US6951707B2 (en) * | 2001-03-08 | 2005-10-04 | Ppg Industries Ohio, Inc. | Process for creating vias for circuit assemblies |
| US8065795B2 (en) | 2001-03-08 | 2011-11-29 | Ppg Industries Ohio, Inc | Multi-layer circuit assembly and process for preparing the same |
| US6713587B2 (en) | 2001-03-08 | 2004-03-30 | Ppg Industries Ohio, Inc. | Electrodepositable dielectric coating compositions and methods related thereto |
| US6803092B2 (en) | 2001-06-26 | 2004-10-12 | 3M Innovative Properties Company | Selective deposition of circuit-protective polymers |
| JP2006517004A (ja) * | 2001-08-31 | 2006-07-13 | セミトゥール・インコーポレイテッド | 電気泳動エマルジョン付着装置及び方法 |
| AU2002366894A1 (en) * | 2001-12-20 | 2003-07-09 | Koninklijke Philips Electronics N.V. | Method of patterning a layer and method of manufacturing an electronic device |
| US7344970B2 (en) * | 2002-04-11 | 2008-03-18 | Shipley Company, L.L.C. | Plating method |
| CN1672475B (zh) * | 2002-06-27 | 2011-11-23 | Ppg工业俄亥俄公司 | 有凹入或伸长分离接头片的单层或多层印刷电路板及其制造方法 |
| US20060213685A1 (en) * | 2002-06-27 | 2006-09-28 | Wang Alan E | Single or multi-layer printed circuit board with improved edge via design |
| US6824959B2 (en) * | 2002-06-27 | 2004-11-30 | Ppg Industries Ohio, Inc. | Process for creating holes in polymeric substrates |
| TW200513805A (en) * | 2003-08-26 | 2005-04-16 | Nippon Kogaku Kk | Optical device and exposure apparatus |
| FR2860523B1 (fr) * | 2003-10-01 | 2006-01-13 | Commissariat Energie Atomique | Procede de formation d'un film polymere sur une surface conductrice ou semi-conductrice de l'electricite par electro-greffage, surfaces obtenues et applications |
| EP1581034A1 (en) * | 2004-03-25 | 2005-09-28 | DSM IP Assets B.V. | Method of forming solder mask |
| US8003293B2 (en) * | 2004-09-30 | 2011-08-23 | Intel Corporation | Pixelated photoresists |
| US20060141143A1 (en) * | 2004-12-17 | 2006-06-29 | J Mccollum Gregory | Method for creating circuit assemblies |
| TWI342172B (en) * | 2007-01-02 | 2011-05-11 | Advanced Semiconductor Eng | Circuit board and method for manufacturing the same |
| EP1975706A3 (en) * | 2007-03-30 | 2010-03-03 | FUJIFILM Corporation | Lithographic printing plate precursor |
| CN101693515B (zh) * | 2009-10-30 | 2012-04-25 | 上海交通大学 | 用于mems领域的可图形化聚合物薄膜的制备方法 |
| KR101548784B1 (ko) * | 2011-02-14 | 2015-08-31 | 주식회사 엘지화학 | 기재 필름 및 그의 제조방법 |
| CN108811359B (zh) * | 2018-07-03 | 2019-11-08 | 刘平 | 一种双面和多层印制电路板的生产方法 |
| DE102020206107A1 (de) | 2020-05-14 | 2021-11-18 | Carl Zeiss Smt Gmbh | Verfahren zum Herstellen eines optischen Elements |
| JP2023553010A (ja) | 2020-12-03 | 2023-12-20 | バテル・メモリアル・インスティテュート | 非ウイルス性送達のためのポリマーナノ粒子およびdnaナノ構造組成物ならびに方法 |
| EP4320233A4 (en) | 2021-04-07 | 2025-08-13 | Battelle Memorial Institute | RAPID DESIGN, BUILD, TEST, AND LEARNING TECHNOLOGIES TO IDENTIFY AND USE NON-VIRAL VECTORS |
| GB2613173A (en) * | 2021-11-25 | 2023-05-31 | Bae Systems Plc | Component processing |
| WO2025072751A1 (en) | 2023-09-29 | 2025-04-03 | Battelle Memorial Institute | Polymer nanoparticle compositions for in vivo expression of polypeptides |
| WO2025122954A1 (en) | 2023-12-08 | 2025-06-12 | Battelle Memorial Institute | Use of dna origami nanostructures for molecular information based data storage systems |
Family Cites Families (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL101499C (da) | 1951-08-20 | |||
| US2875047A (en) | 1955-01-19 | 1959-02-24 | Oster Gerald | Photopolymerization with the formation of coherent plastic masses |
| US2850445A (en) | 1955-01-19 | 1958-09-02 | Oster Gerald | Photopolymerization |
| US2893868A (en) * | 1955-08-22 | 1959-07-07 | Du Pont | Polymerizable compositions |
| US3074974A (en) | 1957-12-06 | 1963-01-22 | Monsanto Chemicals | Method for the preparation of diglycidyl ether of tetrachlorobisphenol-a |
| US3097097A (en) | 1959-02-12 | 1963-07-09 | Gisela K Oster | Photo degrading of gel systems and photographic production of reliefs therewith |
| NL254306A (da) | 1959-08-07 | |||
| US3200057A (en) | 1960-12-27 | 1965-08-10 | Ford Motor Co | Electrophoretic coating process |
| US3303078A (en) | 1962-05-18 | 1967-02-07 | David Wolf | Method of making electrical components |
| US3403088A (en) | 1964-05-18 | 1968-09-24 | Ppg Industries Inc | Electrodeposition of water-dispersed acrylic interpolymers |
| US3380831A (en) | 1964-05-26 | 1968-04-30 | Du Pont | Photopolymerizable compositions and elements |
| GB1090142A (en) | 1965-02-26 | 1967-11-08 | Agfa Gevaert Nv | Photochemical insolubilisation of polymers |
| US3479185A (en) | 1965-06-03 | 1969-11-18 | Du Pont | Photopolymerizable compositions and layers containing 2,4,5-triphenylimidazoyl dimers |
| FR1486212A (da) | 1965-07-09 | 1967-10-04 | ||
| US3549367A (en) | 1968-05-24 | 1970-12-22 | Du Pont | Photopolymerizable compositions containing triarylimidazolyl dimers and p-aminophenyl ketones |
| US3469982A (en) | 1968-09-11 | 1969-09-30 | Jack Richard Celeste | Process for making photoresists |
| JPS4925505B1 (da) | 1969-06-10 | 1974-07-01 | ||
| US3738835A (en) * | 1971-10-21 | 1973-06-12 | Ibm | Electrophoretic photoresist composition and a method of forming etch resistant masks |
| JPS5221526B2 (da) * | 1972-01-10 | 1977-06-11 | ||
| US4040925A (en) * | 1974-05-02 | 1977-08-09 | Scm Corporation | Ultraviolet curing of electrocoating compositions |
| US4039414A (en) | 1974-06-19 | 1977-08-02 | Scm Corporation | Ultraviolet curing of electrocoating compositions |
| US3925181A (en) | 1974-10-31 | 1975-12-09 | Scm Corp | Cathodic electrocoating process |
| BE835203A (nl) * | 1974-11-04 | 1976-05-04 | Fotoresistieve verwijderingssystemen | |
| US3975251A (en) | 1975-03-19 | 1976-08-17 | Scm Corporation | Cathodic electrocoating process |
| US4025409A (en) * | 1975-07-14 | 1977-05-24 | Scm Corporation | Dual cure cathodic electrocoating process |
| JPS5211601A (en) | 1975-07-17 | 1977-01-28 | Taiho Kensetsu Kk | Excavation device |
| GB1572441A (en) * | 1975-12-23 | 1980-07-30 | Vickers Ltd | Photopolymerisable polymers with free carboxyl groups and printing plates therefrom |
| US4029561A (en) * | 1976-01-22 | 1977-06-14 | Scm Corporation | Photocurable cathodic electrocoating |
| US4066523A (en) * | 1976-02-17 | 1978-01-03 | Scm Corporation | Dual cure cathodic electrocoating composition |
| US4166017A (en) * | 1976-05-24 | 1979-08-28 | Scm Corporation | Process for cathodic electrocoating and photocuring |
| US4035273A (en) * | 1976-05-24 | 1977-07-12 | Scm Corporation | Cathodic electrocoating process |
| US4035274A (en) | 1976-05-24 | 1977-07-12 | Scm Corporation | Dual cure cathodic electrocoating |
| JPS60432B2 (ja) * | 1978-03-27 | 1985-01-08 | 凸版印刷株式会社 | 部分着色金属化粧板 |
| DE2651507C3 (de) | 1976-11-11 | 1981-09-10 | Bayer Ag, 5090 Leverkusen | Verwendung von Triacrylaten von oxäthyliertem Trimethylolpropan mit einem Oxäthylierungsgrad von 2,5 bis 4 als Verdünnungsmittel in strahlenhärtbaren Zusammensetzungen |
| DE2816774A1 (de) * | 1977-04-22 | 1978-10-26 | Du Pont | Photopolymerisierbares material |
| US4162162A (en) | 1978-05-08 | 1979-07-24 | E. I. Du Pont De Nemours And Company | Derivatives of aryl ketones and p-dialkyl-aminoarylaldehydes as visible sensitizers of photopolymerizable compositions |
| US4343885A (en) | 1978-05-09 | 1982-08-10 | Dynachem Corporation | Phototropic photosensitive compositions containing fluoran colorformer |
| JPS5527647A (en) | 1978-08-17 | 1980-02-27 | Nippon Telegraph & Telephone | Paint for forming insulating film of conductive printed circuit board and method of forming insulating film |
| JPS55148491A (en) | 1979-05-09 | 1980-11-19 | Meidensha Electric Mfg Co Ltd | Method of fabricating printed circuit board |
| US4338235A (en) | 1979-12-21 | 1982-07-06 | E. I. Du Pont De Nemours And Company | Electrocoating composition with polyhydroxyamine and acrylic or methacrylic polymers |
| DE3005034A1 (de) * | 1980-02-11 | 1981-08-20 | Basf Ag, 6700 Ludwigshafen | Verfahren zur herstellung von ueberzuegen |
| US4378264A (en) | 1980-05-27 | 1983-03-29 | E. I. Du Pont De Nemours And Company | Integrated laminating process |
| US4382135A (en) | 1981-04-01 | 1983-05-03 | Diamond Shamrock Corporation | Radiation-hardenable diluents |
| DE3131448A1 (de) * | 1981-08-07 | 1983-02-24 | Basf Ag, 6700 Ludwigshafen | Fuer die herstellung von photoresistschichten geeignete photopolymerisierbare aufzeichnungsmasse |
| CA1182469A (en) | 1981-12-11 | 1985-02-12 | William D. Emmons | Esters of michael addition homopolymers of acrylic acid |
| US4414311A (en) * | 1982-03-18 | 1983-11-08 | American Hoechst Corporation | Cathodic deposition of light sensitive components |
-
1984
- 1984-09-26 US US06/654,821 patent/US4592816A/en not_active Expired - Lifetime
-
1985
- 1985-09-12 CA CA000490519A patent/CA1257803A/en not_active Expired
- 1985-09-16 PH PH32784A patent/PH22139A/en unknown
- 1985-09-17 JP JP60205180A patent/JPH081519B2/ja not_active Expired - Lifetime
- 1985-09-23 BR BR8504640A patent/BR8504640A/pt not_active IP Right Cessation
- 1985-09-23 IE IE234385A patent/IE58622B1/en not_active IP Right Cessation
- 1985-09-24 NO NO853738A patent/NO168857C/no not_active IP Right Cessation
- 1985-09-24 IL IL76491A patent/IL76491A/xx not_active IP Right Cessation
- 1985-09-25 EP EP85306800A patent/EP0176356B1/en not_active Expired
- 1985-09-25 KR KR1019850007029A patent/KR920005775B1/ko not_active Expired
- 1985-09-25 AU AU47862/85A patent/AU586189B2/en not_active Ceased
- 1985-09-25 DE DE8585306800T patent/DE3566047D1/de not_active Expired
- 1985-09-25 FI FI853691A patent/FI80350C/fi not_active IP Right Cessation
- 1985-09-25 DK DK434885A patent/DK168802B1/da not_active IP Right Cessation
- 1985-09-26 ZA ZA857435A patent/ZA857435B/xx unknown
- 1985-10-01 MX MX000032A patent/MX165458B/es unknown
-
1986
- 1986-01-11 CN CN86100150A patent/CN86100150A/zh active Pending
- 1986-01-11 CN CN91108683A patent/CN1058431A/zh not_active Withdrawn
-
1989
- 1989-02-14 SG SG84/89A patent/SG8489G/en unknown
- 1989-07-20 HK HK582/89A patent/HK58289A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| IL76491A (en) | 1989-07-31 |
| SG8489G (en) | 1989-07-14 |
| EP0176356A3 (en) | 1986-08-20 |
| BR8504640A (pt) | 1986-07-15 |
| CN86100150A (zh) | 1987-07-22 |
| FI80350B (fi) | 1990-01-31 |
| DK168802B1 (da) | 1994-06-13 |
| ZA857435B (en) | 1987-11-25 |
| JPH081519B2 (ja) | 1996-01-10 |
| NO853738L (no) | 1986-04-01 |
| KR860002735A (ko) | 1986-04-28 |
| US4592816A (en) | 1986-06-03 |
| IL76491A0 (en) | 1986-01-31 |
| CA1257803A (en) | 1989-07-25 |
| AU586189B2 (en) | 1989-07-06 |
| MX165458B (es) | 1992-11-11 |
| JPS6180240A (ja) | 1986-04-23 |
| DE3566047D1 (en) | 1988-12-08 |
| EP0176356A2 (en) | 1986-04-02 |
| EP0176356B1 (en) | 1988-11-02 |
| DK434885D0 (da) | 1985-09-25 |
| AU4786285A (en) | 1986-04-10 |
| FI853691A0 (fi) | 1985-09-25 |
| PH22139A (en) | 1988-06-01 |
| IE58622B1 (en) | 1993-10-20 |
| HK58289A (en) | 1989-07-28 |
| CN1058431A (zh) | 1992-02-05 |
| FI80350C (fi) | 1990-05-10 |
| IE852343L (en) | 1986-03-26 |
| NO168857C (no) | 1992-04-08 |
| KR920005775B1 (ko) | 1992-07-18 |
| FI853691L (fi) | 1986-03-27 |
| NO168857B (no) | 1991-12-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DK434885D0 (da) | Fotosensible polymersammensaetninger, fremgangsmaade til elektroforetisk aflejring af disse og deres anvendelse til dannelse af film paa substrater | |
| DK286881A (da) | Fremgangsmaade til fremstilling af silazanpolymere | |
| DK286781A (da) | Fremgangsmaade til fremstilling af silazanpolymere | |
| DK149949C (da) | Analogifremgangsmaade til fremstilling af n-aryl-piperazinalkanamider | |
| DK308085D0 (da) | Fremgangsmaade til ekstrudering af silicaholdige materialer | |
| DK592286D0 (da) | Fremgangsmaade til dannelse af silicium-diffusionsbelaegninger paa metalartikler | |
| DK260682A (da) | Fremgangsmaade til fremstilling af partikelformige geler | |
| DK312985D0 (da) | Fremgangsmaade ved og anlaeg til tilberedning af plastmateriale paa basis af butylgummi | |
| DK186786D0 (da) | Fremgangsmaade til fremstilling af polymerpolyahler | |
| DK550381A (da) | Bindemiddel paa basis af organisk polyisocyanat-cyklisk alkylencarbonat | |
| DK160213C (da) | Apparat til stribeformet paafoering af klaebestof og adhaesiv pasta paa overflader | |
| DK153388C (da) | Fremgangsmaade til fremstilling af spraengstof, saadant til plast bundet spraengstof samt fremgangsmaade til fremstilling af formlegemer af naevnte spraengstof | |
| DK402385D0 (da) | Fremgangsmaade til stabilisering af snavsloesnelsesfremmende polymerer | |
| DK161147C (da) | Analogifremgangsmaade til fremstilling af oe3haa-imidazo-oe5,1-daa-1,2,3,5-tetrazin-4-onderivater | |
| DK150647C (da) | Anlaeg til dannelse af stabler af paa stroeer udlagt, savet toemmer | |
| DK186886A (da) | Fremgangsmaade til fremstilling af polymerpolyahler | |
| DK251984D0 (da) | Fremgangsmaade til fremstilling af polymerpartikler | |
| DK615684D0 (da) | Fremgangsmaade til belaegning af overflader med glasagtig emalje | |
| DK233985A (da) | Flydende kompostition til rengoering af faste overflader og anvendelse af samme | |
| DK22584D0 (da) | Fremgangsmade til genanvendelse af asfaltbelaegninger | |
| DK222783A (da) | Vindmoelle og dele til samme samt fremgangsmaade til fremstilling af disse | |
| DK16590A (da) | Fremgangsmaade til fremstilling af tvaerbundet polymerfilm | |
| DK506584A (da) | Termohardelige formstoffer paa basis af imidgruppeholdige praepolymere samt fremgangsmaade til fremstilling af saadanne formstoffer | |
| DK162969C (da) | Fremgangsmaade til tilvejebringelse af specifikke kemiske funktionelle grupper paa overfladerne af organiske eller uorganiske substrater | |
| DK479283A (da) | Komposition af materialer til retentionselementer og plader baseret paa kompositionen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B1 | Patent granted (law 1993) | ||
| PBP | Patent lapsed |