SG8489G - Photosensitive polymer compositions,electrophoretic deposition processes using same,and the use of same in forming films on substrates - Google Patents
Photosensitive polymer compositions,electrophoretic deposition processes using same,and the use of same in forming films on substratesInfo
- Publication number
- SG8489G SG8489G SG84/89A SG8489A SG8489G SG 8489 G SG8489 G SG 8489G SG 84/89 A SG84/89 A SG 84/89A SG 8489 A SG8489 A SG 8489A SG 8489 G SG8489 G SG 8489G
- Authority
- SG
- Singapore
- Prior art keywords
- same
- substrates
- polymer compositions
- deposition processes
- photosensitive polymer
- Prior art date
Links
- 238000001652 electrophoretic deposition Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 229920000642 polymer Polymers 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/138—Corona discharge process
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Materials For Photolithography (AREA)
- Polymerisation Methods In General (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- Paints Or Removers (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/654,821 US4592816A (en) | 1984-09-26 | 1984-09-26 | Electrophoretic deposition process |
| CN86100150A CN86100150A (zh) | 1984-09-26 | 1986-01-11 | 感光聚合物组合物及其电泳沉积工艺过程 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG8489G true SG8489G (en) | 1989-07-14 |
Family
ID=67809744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG84/89A SG8489G (en) | 1984-09-26 | 1989-02-14 | Photosensitive polymer compositions,electrophoretic deposition processes using same,and the use of same in forming films on substrates |
Country Status (19)
| Country | Link |
|---|---|
| US (1) | US4592816A (da) |
| EP (1) | EP0176356B1 (da) |
| JP (1) | JPH081519B2 (da) |
| KR (1) | KR920005775B1 (da) |
| CN (2) | CN86100150A (da) |
| AU (1) | AU586189B2 (da) |
| BR (1) | BR8504640A (da) |
| CA (1) | CA1257803A (da) |
| DE (1) | DE3566047D1 (da) |
| DK (1) | DK168802B1 (da) |
| FI (1) | FI80350C (da) |
| HK (1) | HK58289A (da) |
| IE (1) | IE58622B1 (da) |
| IL (1) | IL76491A (da) |
| MX (1) | MX165458B (da) |
| NO (1) | NO168857C (da) |
| PH (1) | PH22139A (da) |
| SG (1) | SG8489G (da) |
| ZA (1) | ZA857435B (da) |
Families Citing this family (91)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8430377D0 (en) * | 1984-12-01 | 1985-01-09 | Ciba Geigy Ag | Modified phenolic resins |
| DE3517796A1 (de) * | 1985-05-17 | 1986-11-20 | Hoechst Ag, 6230 Frankfurt | Verfahren zur herstellung von elektrisch isolierendem basismaterial fuer die fertigung von durchkontaktierten leiterplatten |
| JPH0644150B2 (ja) * | 1986-05-09 | 1994-06-08 | 関西ペイント株式会社 | プリント配線フオトレジスト用電着塗料組成物 |
| JPS6317592A (ja) * | 1986-07-09 | 1988-01-25 | 三菱電機株式会社 | プリント配線板の製造方法 |
| US4762747A (en) * | 1986-07-29 | 1988-08-09 | Industrial Technology Research Institute | Single component aqueous acrylic adhesive compositions for flexible printed circuits and laminates made therefrom |
| US4751172A (en) * | 1986-08-01 | 1988-06-14 | Shipley Company Inc. | Process for forming metal images |
| GB8620001D0 (en) * | 1986-08-16 | 1986-09-24 | Ciba Geigy Ag | Production of images |
| EP0662636A3 (en) * | 1986-10-23 | 1995-11-22 | Ciba Geigy Ag | Imaging processes. |
| JPS63182888A (ja) * | 1987-01-26 | 1988-07-28 | 関西ペイント株式会社 | プリント配線板の製造方法 |
| JPS63246890A (ja) * | 1987-04-02 | 1988-10-13 | 関西ペイント株式会社 | プリント回路の形成方法 |
| JPS6420694A (en) * | 1987-07-15 | 1989-01-24 | Kansai Paint Co Ltd | Manufacture of printed wiring board |
| DE3880920T2 (de) * | 1987-08-05 | 1993-10-07 | Ciba Geigy | Verbindungen. |
| EP0302827B1 (en) * | 1987-08-05 | 1994-07-06 | Ciba-Geigy Ag | Process for the formation of images |
| US5196098A (en) * | 1988-01-04 | 1993-03-23 | Shipley Company Inc. | Apparatus and process for electrophoretic deposition |
| JPH0795577B2 (ja) * | 1988-04-12 | 1995-10-11 | 富士プラント工業株式会社 | リードフレームへの部分メッキ方法 |
| JP2585070B2 (ja) * | 1988-08-02 | 1997-02-26 | 日本ペイント株式会社 | 画像形成方法 |
| CA1334897C (en) * | 1988-08-02 | 1995-03-28 | Mamoru Seio | Electrodeposition coating composition and image-forming method using the same |
| US5102775A (en) * | 1988-09-30 | 1992-04-07 | Kansai Paint Co., Ltd. | Visible light sensitive electrodeposition coating composition and image-forming method using the same |
| GB8827847D0 (en) * | 1988-11-29 | 1988-12-29 | Ciba Geigy Ag | Method |
| CA2009274A1 (en) * | 1989-02-22 | 1990-08-22 | Manuel Buentello Iii | Method for making electronic components using a masking material and a masking material therefor |
| GB8909561D0 (en) * | 1989-04-26 | 1989-06-14 | Kodak Ltd | Radiation-sensitive composition and use thereof in the preparation of electrochemical ion sensors |
| JPH02302092A (ja) * | 1989-05-16 | 1990-12-14 | Kansai Paint Co Ltd | プリント配線板の製造方法 |
| US5004672A (en) * | 1989-07-10 | 1991-04-02 | Shipley Company Inc. | Electrophoretic method for applying photoresist to three dimensional circuit board substrate |
| US5236810A (en) * | 1989-10-03 | 1993-08-17 | Kansai Paint Co., Ltd. | Process for preparing printed-circuit board |
| US5047128A (en) * | 1990-01-02 | 1991-09-10 | Shipley Company Inc. | Electrodialysis cell for removal of excess electrolytes formed during electrodeposition of photoresists coatings |
| DE4009563A1 (de) * | 1990-03-24 | 1991-09-26 | Basf Lacke & Farben | Waessrig entwickelbares, negativ wirkendes, elektrophoretisch abscheidbares und photohaertbares beschichtungsmittel sowie seine verwendung zur herstellung von leiterbahnen |
| EP0449022A3 (en) * | 1990-03-26 | 1992-03-11 | Shipley Company Inc. | Method of controlling photoresist film thickness and stability of an electrodeposition bath |
| US5055164A (en) * | 1990-03-26 | 1991-10-08 | Shipley Company Inc. | Electrodepositable photoresists for manufacture of hybrid circuit boards |
| ATE185000T1 (de) * | 1990-06-27 | 1999-10-15 | Coates Brothers Plc | Verfahren zur bilderzeugung |
| JPH0465184A (ja) * | 1990-07-05 | 1992-03-02 | Kansai Paint Co Ltd | 電着前処理方法 |
| CA2048164C (en) * | 1990-08-02 | 1998-11-10 | Kurt G. Olson | Photoimageable electrodepositable photoresist composition |
| US5268256A (en) * | 1990-08-02 | 1993-12-07 | Ppg Industries, Inc. | Photoimageable electrodepositable photoresist composition for producing non-tacky films |
| US5066374A (en) * | 1990-09-20 | 1991-11-19 | Rohm And Haas Company | Elimination of film defects due to hydrogen evolution during cathodic electrodeposition |
| EP0490118A1 (en) * | 1990-12-10 | 1992-06-17 | Shipley Company Inc. | Photoimagable solder mask and photosensitive composition |
| EP0493317B2 (de) * | 1990-12-18 | 2001-01-10 | Ciba SC Holding AG | Strahlungsempfindliche Zusammensetzung auf Basis von Wasser als Lösungsmittel |
| US5202222A (en) * | 1991-03-01 | 1993-04-13 | Shipley Company Inc. | Selective and precise etching and plating of conductive substrates |
| US5607818A (en) * | 1991-06-04 | 1997-03-04 | Micron Technology, Inc. | Method for making interconnects and semiconductor structures using electrophoretic photoresist deposition |
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| US5160579A (en) * | 1991-06-05 | 1992-11-03 | Macdermid, Incorporated | Process for manufacturing printed circuit employing selective provision of solderable coating |
| CA2067921A1 (en) * | 1991-06-12 | 1992-12-13 | Alan Frederick Becknell | Method of making electrical circuit traces |
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| US5893966A (en) * | 1997-07-28 | 1999-04-13 | Micron Technology, Inc. | Method and apparatus for continuous processing of semiconductor wafers |
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| US6951707B2 (en) * | 2001-03-08 | 2005-10-04 | Ppg Industries Ohio, Inc. | Process for creating vias for circuit assemblies |
| US8065795B2 (en) | 2001-03-08 | 2011-11-29 | Ppg Industries Ohio, Inc | Multi-layer circuit assembly and process for preparing the same |
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| EP1581034A1 (en) * | 2004-03-25 | 2005-09-28 | DSM IP Assets B.V. | Method of forming solder mask |
| US8003293B2 (en) * | 2004-09-30 | 2011-08-23 | Intel Corporation | Pixelated photoresists |
| US20060141143A1 (en) * | 2004-12-17 | 2006-06-29 | J Mccollum Gregory | Method for creating circuit assemblies |
| TWI342172B (en) * | 2007-01-02 | 2011-05-11 | Advanced Semiconductor Eng | Circuit board and method for manufacturing the same |
| EP1975706A3 (en) * | 2007-03-30 | 2010-03-03 | FUJIFILM Corporation | Lithographic printing plate precursor |
| CN101693515B (zh) * | 2009-10-30 | 2012-04-25 | 上海交通大学 | 用于mems领域的可图形化聚合物薄膜的制备方法 |
| KR101548784B1 (ko) * | 2011-02-14 | 2015-08-31 | 주식회사 엘지화학 | 기재 필름 및 그의 제조방법 |
| CN108811359B (zh) * | 2018-07-03 | 2019-11-08 | 刘平 | 一种双面和多层印制电路板的生产方法 |
| DE102020206107A1 (de) | 2020-05-14 | 2021-11-18 | Carl Zeiss Smt Gmbh | Verfahren zum Herstellen eines optischen Elements |
| JP2023553010A (ja) | 2020-12-03 | 2023-12-20 | バテル・メモリアル・インスティテュート | 非ウイルス性送達のためのポリマーナノ粒子およびdnaナノ構造組成物ならびに方法 |
| EP4320233A4 (en) | 2021-04-07 | 2025-08-13 | Battelle Memorial Institute | RAPID DESIGN, BUILD, TEST, AND LEARNING TECHNOLOGIES TO IDENTIFY AND USE NON-VIRAL VECTORS |
| GB2613173A (en) * | 2021-11-25 | 2023-05-31 | Bae Systems Plc | Component processing |
| WO2025072751A1 (en) | 2023-09-29 | 2025-04-03 | Battelle Memorial Institute | Polymer nanoparticle compositions for in vivo expression of polypeptides |
| WO2025122954A1 (en) | 2023-12-08 | 2025-06-12 | Battelle Memorial Institute | Use of dna origami nanostructures for molecular information based data storage systems |
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| JPS60432B2 (ja) * | 1978-03-27 | 1985-01-08 | 凸版印刷株式会社 | 部分着色金属化粧板 |
| DE2651507C3 (de) | 1976-11-11 | 1981-09-10 | Bayer Ag, 5090 Leverkusen | Verwendung von Triacrylaten von oxäthyliertem Trimethylolpropan mit einem Oxäthylierungsgrad von 2,5 bis 4 als Verdünnungsmittel in strahlenhärtbaren Zusammensetzungen |
| DE2816774A1 (de) * | 1977-04-22 | 1978-10-26 | Du Pont | Photopolymerisierbares material |
| US4162162A (en) | 1978-05-08 | 1979-07-24 | E. I. Du Pont De Nemours And Company | Derivatives of aryl ketones and p-dialkyl-aminoarylaldehydes as visible sensitizers of photopolymerizable compositions |
| US4343885A (en) | 1978-05-09 | 1982-08-10 | Dynachem Corporation | Phototropic photosensitive compositions containing fluoran colorformer |
| JPS5527647A (en) | 1978-08-17 | 1980-02-27 | Nippon Telegraph & Telephone | Paint for forming insulating film of conductive printed circuit board and method of forming insulating film |
| JPS55148491A (en) | 1979-05-09 | 1980-11-19 | Meidensha Electric Mfg Co Ltd | Method of fabricating printed circuit board |
| US4338235A (en) | 1979-12-21 | 1982-07-06 | E. I. Du Pont De Nemours And Company | Electrocoating composition with polyhydroxyamine and acrylic or methacrylic polymers |
| DE3005034A1 (de) * | 1980-02-11 | 1981-08-20 | Basf Ag, 6700 Ludwigshafen | Verfahren zur herstellung von ueberzuegen |
| US4378264A (en) | 1980-05-27 | 1983-03-29 | E. I. Du Pont De Nemours And Company | Integrated laminating process |
| US4382135A (en) | 1981-04-01 | 1983-05-03 | Diamond Shamrock Corporation | Radiation-hardenable diluents |
| DE3131448A1 (de) * | 1981-08-07 | 1983-02-24 | Basf Ag, 6700 Ludwigshafen | Fuer die herstellung von photoresistschichten geeignete photopolymerisierbare aufzeichnungsmasse |
| CA1182469A (en) | 1981-12-11 | 1985-02-12 | William D. Emmons | Esters of michael addition homopolymers of acrylic acid |
| US4414311A (en) * | 1982-03-18 | 1983-11-08 | American Hoechst Corporation | Cathodic deposition of light sensitive components |
-
1984
- 1984-09-26 US US06/654,821 patent/US4592816A/en not_active Expired - Lifetime
-
1985
- 1985-09-12 CA CA000490519A patent/CA1257803A/en not_active Expired
- 1985-09-16 PH PH32784A patent/PH22139A/en unknown
- 1985-09-17 JP JP60205180A patent/JPH081519B2/ja not_active Expired - Lifetime
- 1985-09-23 BR BR8504640A patent/BR8504640A/pt not_active IP Right Cessation
- 1985-09-23 IE IE234385A patent/IE58622B1/en not_active IP Right Cessation
- 1985-09-24 NO NO853738A patent/NO168857C/no not_active IP Right Cessation
- 1985-09-24 IL IL76491A patent/IL76491A/xx not_active IP Right Cessation
- 1985-09-25 EP EP85306800A patent/EP0176356B1/en not_active Expired
- 1985-09-25 KR KR1019850007029A patent/KR920005775B1/ko not_active Expired
- 1985-09-25 AU AU47862/85A patent/AU586189B2/en not_active Ceased
- 1985-09-25 DE DE8585306800T patent/DE3566047D1/de not_active Expired
- 1985-09-25 FI FI853691A patent/FI80350C/fi not_active IP Right Cessation
- 1985-09-25 DK DK434885A patent/DK168802B1/da not_active IP Right Cessation
- 1985-09-26 ZA ZA857435A patent/ZA857435B/xx unknown
- 1985-10-01 MX MX000032A patent/MX165458B/es unknown
-
1986
- 1986-01-11 CN CN86100150A patent/CN86100150A/zh active Pending
- 1986-01-11 CN CN91108683A patent/CN1058431A/zh not_active Withdrawn
-
1989
- 1989-02-14 SG SG84/89A patent/SG8489G/en unknown
- 1989-07-20 HK HK582/89A patent/HK58289A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| IL76491A (en) | 1989-07-31 |
| EP0176356A3 (en) | 1986-08-20 |
| BR8504640A (pt) | 1986-07-15 |
| CN86100150A (zh) | 1987-07-22 |
| FI80350B (fi) | 1990-01-31 |
| DK168802B1 (da) | 1994-06-13 |
| ZA857435B (en) | 1987-11-25 |
| DK434885A (da) | 1986-03-27 |
| JPH081519B2 (ja) | 1996-01-10 |
| NO853738L (no) | 1986-04-01 |
| KR860002735A (ko) | 1986-04-28 |
| US4592816A (en) | 1986-06-03 |
| IL76491A0 (en) | 1986-01-31 |
| CA1257803A (en) | 1989-07-25 |
| AU586189B2 (en) | 1989-07-06 |
| MX165458B (es) | 1992-11-11 |
| JPS6180240A (ja) | 1986-04-23 |
| DE3566047D1 (en) | 1988-12-08 |
| EP0176356A2 (en) | 1986-04-02 |
| EP0176356B1 (en) | 1988-11-02 |
| DK434885D0 (da) | 1985-09-25 |
| AU4786285A (en) | 1986-04-10 |
| FI853691A0 (fi) | 1985-09-25 |
| PH22139A (en) | 1988-06-01 |
| IE58622B1 (en) | 1993-10-20 |
| HK58289A (en) | 1989-07-28 |
| CN1058431A (zh) | 1992-02-05 |
| FI80350C (fi) | 1990-05-10 |
| IE852343L (en) | 1986-03-26 |
| NO168857C (no) | 1992-04-08 |
| KR920005775B1 (ko) | 1992-07-18 |
| FI853691L (fi) | 1986-03-27 |
| NO168857B (no) | 1991-12-30 |
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