EP0379172A3 - Composition de résine époxy et masse coulable pour dispositif à semi-conducteurs à base de celle-ci - Google Patents

Composition de résine époxy et masse coulable pour dispositif à semi-conducteurs à base de celle-ci Download PDF

Info

Publication number
EP0379172A3
EP0379172A3 EP19900100919 EP90100919A EP0379172A3 EP 0379172 A3 EP0379172 A3 EP 0379172A3 EP 19900100919 EP19900100919 EP 19900100919 EP 90100919 A EP90100919 A EP 90100919A EP 0379172 A3 EP0379172 A3 EP 0379172A3
Authority
EP
European Patent Office
Prior art keywords
epoxy resin
resin composition
composition
same
sealing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19900100919
Other languages
German (de)
English (en)
Other versions
EP0379172A2 (fr
Inventor
Eiko C/O Mitsui Petrochemical Togashi
Hisashi Mitsui Petrochemical Ind. Ltd. Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Petrochemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Petrochemical Industries Ltd filed Critical Mitsui Petrochemical Industries Ltd
Publication of EP0379172A2 publication Critical patent/EP0379172A2/fr
Publication of EP0379172A3 publication Critical patent/EP0379172A3/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K3/2279—Oxides; Hydroxides of metals of antimony
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/21—Urea; Derivatives thereof, e.g. biuret
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
EP19900100919 1989-01-18 1990-01-17 Composition de résine époxy et masse coulable pour dispositif à semi-conducteurs à base de celle-ci Pending EP0379172A3 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP7685/89 1989-01-18
JP768589 1989-01-18
JP768489 1989-01-18
JP7684/89 1989-01-18
JP869289 1989-01-19
JP8692/89 1989-01-19

Publications (2)

Publication Number Publication Date
EP0379172A2 EP0379172A2 (fr) 1990-07-25
EP0379172A3 true EP0379172A3 (fr) 1992-02-26

Family

ID=27277711

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19900100919 Pending EP0379172A3 (fr) 1989-01-18 1990-01-17 Composition de résine époxy et masse coulable pour dispositif à semi-conducteurs à base de celle-ci

Country Status (5)

Country Link
US (1) US5064881A (fr)
EP (1) EP0379172A3 (fr)
JP (1) JP3020974B2 (fr)
KR (1) KR930008739B1 (fr)
CA (1) CA2007956C (fr)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0493362A (ja) * 1990-08-10 1992-03-26 Toshiba Ceramics Co Ltd 電子部品封止用充填剤およびその製造方法
EP0633286A1 (fr) * 1993-07-09 1995-01-11 Ciba-Geigy Ag Composition de résine époxy chargée et durcissable
US6710105B1 (en) 1993-07-09 2004-03-23 Jens Awe Curable epoxy resin composition comprising fillers
ES2203643T3 (es) * 1994-07-01 2004-04-16 Vantico Ag Composicion de colada a base de resina epoxi.
US6231959B1 (en) * 1995-02-27 2001-05-15 Matsushita Electric Works, Ltd. Prepreg of epoxy resin, hardener, and organodialkyurea promotor
CA2206384A1 (fr) * 1996-05-29 1997-11-29 Eiki Togashi Methode de moulage par injection pour moulages en resine epoxydique et compose de resine epoxydique moulable par injection
JPH10110088A (ja) * 1996-10-08 1998-04-28 Mitsui Petrochem Ind Ltd エポキシ樹脂組成物
US6103157A (en) * 1997-07-02 2000-08-15 Ciba Specialty Chemicals Corp. Process for impregnating electrical coils
DE19751463B4 (de) * 1997-11-20 2004-05-27 Eads Deutschland Gmbh Härter für ein Reaktivharz auf Metalloberflächen und deren Verwendung
US6372839B1 (en) * 1999-03-17 2002-04-16 Shin-Etsu Chemical Co., Ltd. Flip-chip type semiconductor device underfill
EP1331244A1 (fr) * 2000-10-24 2003-07-30 Mitsui Chemicals, Inc. Composition de resine epoxy et son utilisation
US20030082385A1 (en) * 2001-07-13 2003-05-01 Toray Composites (America), Inc. Quick cure carbon fiber reinforced epoxy resin
US6664307B2 (en) * 2001-11-03 2003-12-16 Dymax Corporation Low-shrinkage epoxy resin formulation
JP4679062B2 (ja) * 2004-03-01 2011-04-27 旭有機材工業株式会社 フェノール樹脂成形材料で成形されたプーリ
CA2562936A1 (fr) * 2004-04-14 2005-10-27 Namics Corporation Composition de resine epoxy
JP5165891B2 (ja) 2004-04-30 2013-03-21 株式会社クレハ 封止用樹脂組成物及び樹脂封止された半導体装置
GB0512610D0 (en) * 2005-06-18 2005-07-27 Hexcel Composites Ltd Composite material
JP4628912B2 (ja) * 2005-09-09 2011-02-09 信越化学工業株式会社 封止用エポキシ樹脂組成物
JP2007231252A (ja) * 2006-01-31 2007-09-13 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び該組成物で封止された半導体装置
JP2008095001A (ja) * 2006-10-13 2008-04-24 Nippon Electric Glass Co Ltd 封止用組成物
WO2009079205A1 (fr) * 2007-12-18 2009-06-25 Dow Global Technologies Inc. Compositions thermodurcissables comprenant des polyéthers siliconés, leur fabrication et leurs utilisations
CN102007167A (zh) * 2008-02-15 2011-04-06 陶氏环球技术公司 包含有机硅聚醚的热固性组合物，及其制备和用途
JP2010050262A (ja) * 2008-08-21 2010-03-04 Panasonic Corp 半導体装置及びその製造方法
US20100289055A1 (en) * 2009-05-14 2010-11-18 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Silicone leaded chip carrier
TWI388623B (zh) * 2009-10-02 2013-03-11 Nanya Plastics Corp A thermosetting epoxy resin composition for improving the drilling processability of printed circuit boards
US9546243B2 (en) 2013-07-17 2017-01-17 Air Products And Chemicals, Inc. Amines and polymeric phenols and usage thereof as curing agents in one component epoxy resin compositions
CN104497490B (zh) * 2014-12-22 2017-08-25 科化新材料泰州有限公司 用于全包封器件的高导热环氧树脂组合物及其制备方法
CN107251665B (zh) * 2015-03-05 2018-06-15 住友电木株式会社 密封用树脂组合物、车载用电子控制单元的制造方法和车载用电子控制单元
DE102016205489A1 (de) * 2016-04-04 2017-10-05 Henkel Ag & Co. Kgaa Geschirrspülmittel enthaltend Harnstoffderivate

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1173362A (en) * 1966-01-14 1969-12-10 American Cyanamid Co Epoxy Curing Agents
FR2061055A5 (fr) * 1969-09-09 1971-06-18 Ciba Geigy
US4376174A (en) * 1980-03-17 1983-03-08 Shin-Etsu Chemical Co., Ltd. Curable epoxy resin compositions
US4701479A (en) * 1985-05-22 1987-10-20 Shin-Etsu Chemical Co., Ltd. Epoxy resin-based composition for encapsulation of semiconductor devices
EP0293977A2 (fr) * 1987-05-29 1988-12-07 Shell Internationale Researchmaatschappij B.V. Procédé de préparation de durcisseurs phénoliques pour résines époxydes
EP0372983A2 (fr) * 1988-12-08 1990-06-13 Sumitomo Bakelite Company Limited Composition de résine époxyde pour le scellement de semi-conducteurs

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5892547A (ja) * 1981-11-30 1983-06-01 Mitsui Petrochem Ind Ltd 電気・電子部品の製造方法
JPS60210643A (ja) * 1983-11-30 1985-10-23 Denki Kagaku Kogyo Kk 充填剤及びその組成物
JPS60260611A (ja) * 1984-06-08 1985-12-23 Mitsubishi Petrochem Co Ltd 高分子量クレゾ−ルノボラツク樹脂の製造方法
US4720515A (en) * 1985-05-17 1988-01-19 Denki Kagaku Kogyo Kabushiki Kaisha Epoxy resin composition for encapsulating semiconductor
JPS61283615A (ja) * 1985-06-11 1986-12-13 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂成形材料

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1173362A (en) * 1966-01-14 1969-12-10 American Cyanamid Co Epoxy Curing Agents
FR2061055A5 (fr) * 1969-09-09 1971-06-18 Ciba Geigy
US4376174A (en) * 1980-03-17 1983-03-08 Shin-Etsu Chemical Co., Ltd. Curable epoxy resin compositions
US4701479A (en) * 1985-05-22 1987-10-20 Shin-Etsu Chemical Co., Ltd. Epoxy resin-based composition for encapsulation of semiconductor devices
EP0293977A2 (fr) * 1987-05-29 1988-12-07 Shell Internationale Researchmaatschappij B.V. Procédé de préparation de durcisseurs phénoliques pour résines époxydes
EP0372983A2 (fr) * 1988-12-08 1990-06-13 Sumitomo Bakelite Company Limited Composition de résine époxyde pour le scellement de semi-conducteurs

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN, Vol. 12, No. 501 (C556), 27 December 1988; & JP A 63 210 121 (MITSUI PETROCHEM. IND. LTD.) 31.08.1988, the whole document. *

Also Published As

Publication number Publication date
EP0379172A2 (fr) 1990-07-25
JP3020974B2 (ja) 2000-03-15
JPH02276814A (ja) 1990-11-13
KR930008739B1 (ko) 1993-09-13
KR900011852A (ko) 1990-08-02
US5064881A (en) 1991-11-12
CA2007956A1 (fr) 1990-07-18
CA2007956C (fr) 2000-03-14

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